Operation optimization of prefabricated light modular radiant heating system:Thermal resistance analysis and numerical study

The utilization of prefabricated light modular radiant heating system has demonstrated significant increases in heat transfer efficiency and energy conservation capabilities.Within prefabricated building construction,this new heating method presents an opportunity for the development of comprehensive facilities.The parameters for evaluating the effectiveness of such a system are the upper surface layer’s heat flux and temperature.In this paper,thermal resistance analysis calculation based on a simplified model for this unique radiant heating system analysis is presented with the heat transfer mechanism’s evaluation.The results obtained from thermal resistance analysis calculation and numerical simulation indicate that the thermal resistance analysis method is highly accurate with temperature discrepancies ranging from 0.44℃ to−0.44℃ and a heat flux discrepancy of less than 7.54%,which can meet the requirements of practical engineering applications,suggesting a foundation for the prefabricated radiant heating system.

Breaking Through Bottlenecks for Thermally Conductive Polymer Composites:A Perspective for Intrinsic Thermal Conductivity,Interfacial Thermal Resistance and Theoretics

Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)values of prepared thermally conductive polymer composites are still difficult to achieve expectations,which has become the bottleneck in the fields of thermally conductive polymer composites.Aimed at that,based on the accumulation of the previous research works by related researchers and our research group,this paper proposes three possible directions for breaking through the bottlenecks:(1)preparing and synthesizing intrinsically thermally conductive polymers,(2)reducing the interfacial thermal resistance in thermally conductive polymer composites,and(3)establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization.Also,the future development trends of the three above-mentioned directions are foreseen,hoping to provide certain basis and guidance for the preparation,researches and development of thermally conductive polymers and their composites.

Thermal Resistance of Common Rice Maintainer and Restorer Lines to High Temperature During Flowering and Early Grain Filling Stages

Fifteen common rice maintainer lines and 26 high-yielding restorer lines were used to evaluate their thermal resistance and fertility during flowering and early grain filling stages. The rice plants were subjected to high temperature stress （39-43 ℃） for 1-15 d from main stem flowering. Based on the heat stress index, they were divided into thermal resistant lines, semi-thermal resistant lines, semi-thermal sensitive lines and thermal sensitive lines. Therefore, the maintainer lines K22B, Bobai B and V20B belonged to thermal resistant lines, whereas 11-32B, Zhongzhe B and Zhong 9B belonged to thermal sensitive lines. For rice restorer lines, Minghui 63 had the highest thermal resistance, followed by R207, P32, P929, and the lowest thermal resistant lines P62-2-2, R8006 and P51. The correlation analysis indicated that the heat stress index was significantly correlated with seed-setting rate and abortive grain rate under heat stress, but not under natural conditions. This indicated that heat stress occurred during flowering and early grain filling stages mainly decreased the seed- setting rate and significantly increased the abortive grain rate in both rice maintainer and restorer lines.

Effect of contact thermal resistance on temperature distributions of concrete-filled steel tubes in fire

To predicate the temperature distribution of concrete-filled steel tubes(CFSTs) being exposure to fire,a finite element analysis model was developed using a finite element package,ANSYS.A suggested value of contact thermal resistance was therefore proposed with the supporting of massive numbers of collected test data.Parametric analysis was conducted subsequently towards the cross-sectional temperature distribution of CFST columns in four-side fire,in which the exposure time,width of the cross section,steel ratio were taken into account with considering contact thermal resistance.It was found that contact thermal resistance has little effect on the overall temperature regulation with the exposure time,the width of cross-section or the change of steel ratio.However,great temperature dropping at the concrete adjacent to the contact interface,and gentle temperature increase at steel tube,exist if considering contact thermal resistance.The results of the study are expected to provide theoretical basis for the fire resistance behavior and design of the CFST columns being exposure to fire.

Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes

Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructures of Au80Sn20 solder were then investigated to understand the reason for the difference in thermal resistance.It was found that the microstructure with a higher content of Au-rich phase in the center of the solder and a lower content of(Au,Ni)Sn phase at the interface of the solder/heat sink resulted in lower thermal resistance.This is attributed to the lower thermal resistance of Au-rich phase and higher thermal resistance of(Au,Ni)Sn phase.

Measurements of electron-phonon coupling factor and interfacial thermal resistance of metallic nano-films using a transient thermoreflectance technique

Using a transient thermoreflectance （TTR） technique, several Au films with different thicknesses on glass and SiC substrates are measured for thermal characterization of metMlic nano-films, including the electron phonon coupling factor G, interfazial thermal resistance R, and thermal conductivity Ks of the substrate. The rear heating-front detecting （RF） method is used to ensure the femtosecond temporal resolution. An intense laser beam is focused on the rear surface to heat the film, and another weak laser beam is focused on the very spot of the front surface to detect the change in the electron temperature. By varying the optical path delay between the two beams, a complete electron temperature profile can be scanned. Different from the normally used single-layer model, the double-layer model involving interfaciM thermal resistance is studied here. The electron temperature cooling profile can be affected by the electron energy transfer into the substrate or the electron-phonon interactions in the metallic films. For multiple-target optimization, the genetic algorithm （GA） is used to obtain both G and R. The experimental result gives a deep understanding of the mechanism of ultra-fast heat transfer in metals.

Interfacial thermal resistance between high-density polyethylene(HDPE) and sapphire

To improve the thermal conductivity of polymeric composites, the numerous interfacial thermal resistance （ITR） inside is usually considered as a bottle neck, but the direct measurement of the ITR is hardly reported. In this paper, a sandwich structure which consists of transducer/high density polyethylene （HDPE）/sapphire is prepared to study the interface characteristics. Then, the ITRs between HDPE and sapphire of two samples with different HDPE thickness values are measured by time-domain thermoreflectance （TDTR） method and the results are -- 2 × 10-7 m2.K.W-1. Furthermore, a model is used to evaluate the importance of ITR for the thermal conductivity of composites. The model＇s analysis indicates that reducing the ITR is an effective way of improving the thermal conductivity of composites. These results will provide valuable guidance for the design and manufacture of polymer-based thermally conductive materials.

Thermal Resistance Testing Technology Research of Integration High Power-LED

In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.

Micro-organic dust combustion considering particles thermal resistance

Organic dust flames deal with a field of science in which many complicated phenomena like pyrolysis or devolatization of solid particles and combustion of volatile particles take place. One-dimensional flame propagation in cloud of fuel mixture is analyzed in which flame structure is divided into three zones. The first zone is preheat zone in which rate of the chemical reaction is small and transfer phenomena play significant role in temperature and mass distributions. In this model, it is assumed that particles pyrolyze first to yield a gaseous fuel mixture. The second zone is reaction zone where convection and vaporization rates of the particles are small. The third zone is convection zone where diffusive terms are negligible in comparison of other terms. Non-zero Biot number is used in order to study effect of particles thermal resistance on flame characteristics. Also, effect of particle size on combustion of micro organic dust is investigated. According to obtained results, it is understood that both flame temperature and burning velocity decrease with rise in the Biot number and particle size.

Thermal resistance matrix representation of thermal effects and thermal design in multi-finger power heterojunction bipolar transistors

The thermal resistance matrix including self-heating thermal resistance and thermal coupling resistance is presented to describe the thermal effects of multi-finger power heterojunction bipolar transistors. The dependence of thermal resistance matrix on finger spacing is also investigated. It is shown that both self-heating thermal resistance and thermal coupling resistance are lowered by increasing the finger spacing, in which the downward dissipated heat path is widened and the heat flow from adjacent fingers is effectively suppressed. The decrease of self-heating thermal resistance and thermal coupling resistance is helpful for improving the thermal stability of power devices. Furthermore, with the aid of the thermal resistance matrix a 10-finger power heterojunction bipolar transistor （HBT） with non-uniform finger spacing is designed for high thermal stability. The optimized structure can effectively lower the peak temperature while maintaining a uniformity of the temperature profile at various biases and thus the device effectively may operate at a higher power level.

Measurement of Thermal Resistance of Heat-resistant Fabrics with a Guarded-hot-box

A novel analytical method with the guarded-hot-box （GHB） in investigating the thermal resistance of heat-resistant fabrics is described and the analytical method is also presented in this paper. The new apparatus is capable of measure thermal resistance of the fabrics in high temperature up to an average applied temperature of 250~C. The maximum measurement error of the apparatus is 6.5% and relative error is less than 2.8% between the introduced method and standard given value. In the G/-IB method, air layer thickness is the most important factor that influences measurement value of thermal resistance of heat-resistant fabrics. Results show that the method is more accurate and efficient than GBl1048-89 one in measuring thermal resistance of heat-resistant fabrics.

Comparison of Testing Clothing Thermal Resistance on 2 Thermal Manikins

The paper compares clothing thermal resistance of the same ensemble tested by different thermal manikins in different laboratories. It also examines the consistence of the two groups of total thermal resistance by Paired-Sample T Test method, which proves that there is no remarkable difference in testing results under the same experiment method and requirement. It is of great significance in promoting the application of thermal manikin testing technology and academic exchange among different institutes.

A Detailed Thermal Resistance Network Analysis of FCBGA Package

Using thermal models to describe the heat dissipation process of FCBGA is a significant topic in the field of packaging.However,the thermal resistance model considering the structure of each part of the chip is still ambiguous and rare,but it is quite desirable in engineering.In this work,we propose a detailed thermal resistance network model,and describe it by using thermal conduction resistance and thermal spreading resistance.For a striking FCBGA case,we calculated the thermal resistance of each part of the structure according to the temperature field simulated by COMSOL.The thermal resistance network can be used to predict the temperatures in the chip under different conditions.For example,when the power changes by 40%,the relative error of junction temperature prediction is only 0.24%.The function of the detailed thermal resistance network in evaluating the optimization space and determining the optimization direction is clarified.This work illustrates a potential thermal resistance analysis method for electronic devices such as FCBGA.

AHFO-based soil water content sensing technology considering soil-sensor thermal contact resistance

The actively heated fiber-optic(AHFO)technology has become emerged as a research focus due to its advantages of distributed,real-time measurement and good durability.These attributes have led to the gradual application of AHFO technology to the water content measurement of in situ soil.However,all existing in situ applications of AHFO technology fail to consider the effect of soilesensor contact quality on water content measurements,limiting potential for the wider application of AHFO technology.To address this issue,the authors propose a method for determining the soilesensor thermal contact resistance based on the principle of an infinite cylindrical heat source.This is then used to establish an AHFO water content measurement technology that considers the thermal contact resistance.The reliability and validity of the new measurement technology are explored through a laboratory test and a field case study,and the spatial-temporal evolution of the soil water content in the case is revealed.The results demonstrate that method for determining the soilesensor thermal contact resistance is highly effective and applicable to all types of soils.This method requires only the moisture content,dry density,and thermal response of the in situ soil to be obtained.In the field case,the measurement error of soil water content between the AHFO method,which takes into account the thermal contact resistance,and the neutron scattering method is only 0.011.The water content of in situ soil exhibits a seasonal variation,with an increase in spring and autumn and a decrease in summer and winter.Furthermore,the response of shallow soils to precipitation and evaporation is significant.These findings contribute to the enhancement of the accuracy of the AHFO technology in the measurement of the water content of in situ soils,thereby facilitating the dissemination and utilization of this technology.

Prediction and parametric analysis of 3D borehole and total internal thermal resistance of single U-tube borehole heat exchanger for ground source heat pumps

The borehole and total internal thermal resistance are both significant parameters in evaluating the thermal performance of the ground source heat pump.This study aimed to obtain the accurate correlation of the 3D borehole and total internal thermal resistance(R_(b,3D)and R_(a,3D))and analyze the impacts of parameters on the R_(b,3D)and R_(a,3D).Firstly,eight parameters affecting the R_(b,3D)and R_(a,3D),including the borehole diameter,pipe diameter,pipe-pipe distance,borehole depth,soil thermal conductivity,grout thermal conductivity,pipe thermal conductivity,and fluid velocity inside the pipe,were considered and an L-54 design matrix was generated.Then,the 3D numerical model,coupling with the four-resistance model,was proposed to calculate R_(b,3D)and R_(a,3D)for each case.After that,the response surface methodology was employed to obtain and verify the correlation of R_(b,3D)and R_(a,3D),which were compared with the existing resistance calculation methods.Lastly,analysis of variance was carried out to reveal parameters that have statistically significant impacts on the R_(b,3D)and R_(a,3D).Results show that the rationality and accuracy of the correlation of R_(b,3D)and R_(a,3D)can be verified by the determination coefficient and P value of regression model,as well as the P value of lack-of-fit.The existing resistance calculation methods are more or less inaccurate and the discrepancies in some cases can be up to 86.74%and 111.35%for the borehole and total internal thermal resistance.The pipe and grout thermal conductivity,pipe and borehole diameter,and the pipe-pipe distance can be seen as the significant contributory factors to the variation of R_(b,3D)and R_(a,3D).

Preparation and Thermal Shock Resistance of Mullite Ceramics for High Temperature Solar Thermal Storage

Mullite thermal storage ceramics were prepared by low-cost calcined bauxite and kaolin.The phase composition,microstructure,high temperature resistance and thermophysical properties were characterized by modern testing techniques.The experimental results indicate that sample A3(bauxite/kaolin ratio of 5:5)sintered at 1620℃has the optimum comprehensive properties,with bulk density of 2.83 g·cm^(-3)and bending strength of 155.44 MPa.After 30 thermal shocks(1000℃-room temperature,air cooling),the bending strength of sample A3 increases to 166.15 MPa with an enhancement rate of 6.89%,the corresponding thermal conductivity and specific heat capacity are 3.54 W·(m·K)^(-1)and 1.39 kJ·(kg·K)^(-1)at 800℃,and the thermal storage density is 1096 kJ·kg^(-1)(25-800 mullite ceramics;sintering properties;high-temperature thermal storage;thermal shock resistance).Mullite forms a dense and continuous interlaced network microstructure,which endows the samples high thermal storage density and high bending strength,but the decrease of bauxite/kaolin ratio leads to the decrease of mullite content,which reduces the properties of the samples.

Entransy dissipation,entransy-dissipation-based thermal resistance and optimization of one-stream hybrid thermal network

The one-stream hybrid thermal network is analyzed and discussed based on the entransy theory,and the results are compared with those from the entropy generation optimization.The theoretical analysis indicates that the minimum heat-flow-weighted temperature of the thermal networks corresponds to the minimum entransy dissipation rate and the minimum thermal resistance.For a simple hybrid thermal network consisting of three thermal components,the expression of entransy dissipation is conducted,and the heat transfer area and the mass flow rate are calculated and optimized.The optimal results are obtained in order to minimize the entransy dissipation and the thermal resistance.The optimal results are calculated for various combinations,such as series connection,parallel connection and other hybrid connections.The numerical results are in accordance with the theoretical analysis.Both the theoretical analysis and the numerical results show that the minimum entransy dissipation and the minimum thermal resistance correspond to the minimum heat-flow-weighted temperature of the thermal networks while the minimum entropy generation does not.

A Correction Factor-Based General Thermal Resistance Formula for Heat Exchanger Design and Performance Analysis

Methods for the analysis of heat exchangers with various flow arrangements modeling,design,and performance are essential for heat transfer system modeling and its integration with other energy system models.This paper proposes the use of the linear-transfer law for the heat exchanger design and performance analysis as a function of the thermal resistance related to the ratio of a linear temperature difference to the total heat transfer rate.Additionally,we derived a correction factor that represents the influence of the flow arrangement on the heat transfer performance by the effective thermal conductance,as a function of correction factor,heat transfer coefficient,and surface area.Based on the effective thermal conductance,we propose the hot-end NTU and cold-end NTU for deriving a standardized and general thermal resistance formula for different types of heat exchangers by the combination of the correction factor with linear-transfer law.Moreover,for parallel-flow,cross-flow,and 1-2 Tubular Exchanger Manufacturers Association(TEMA)E shell-and-tube heat exchangers,we derived and obtained alternative correction factor expressions without introducing any temperatures.Two cases about heat exchanger design and performance analysis show that the calculation processes using the correction factor-based general thermal resistance are straightforward without any iteration and the calculation results are accurate.Finally,the experimental validation shows that the general thermal resistance formula is appropriate for analyzing the heat transfer performance.That is,the correction factor-based general thermal resistance formula provides a standardized model for heat exchanger analysis and heat transfer/integrated energy system modeling using the heat current method.

Measuring the thermal conductivity and interfacial thermal resistance of suspended MoS2 using electron beam self-heating technique

Establishment of a new technique or extension of an existing technique for thermal and thermoelectric measurements to a more challenging system is an important task to explore the thermal and thermoelectric properties of various materials and systems. The bottleneck lies in the challenges in measuring the thermal contact resistance. In this work, we applied electron beam self-heating technique to derive the intrinsic thermal conductivity of suspended Molybdenum Disulfide （MoS2） ribbons and the thermal contact resistance, with which the interracial thermal resistance between few-layer MoS2 and Pt electrodes was calculated. The measured room temperature thermal conductivity of MoS2 is around -30 W/（m K）, while the estimated interracial thermal resistance is around -2 × 10 -6 m-2 K/W. Our experiments extend a useful branch in application of this technique for studying thermal properties of suspended layered ribbons and have potential application in investigating the interracial thermal resistance of different twodimensional （2D） heterojunctions.

Evaluation of the drain–source voltage effect on AlGaAs/InGaAs PHEMTs thermal resistance by the structure function method

The effect of drain-source voltage on A1GaAs/InGaAs PHEMTs thermal resistance is studied by experimental measuring and simulation. The result shows that A1GaAs/InGaAs PHEMTs thermal resistance presents a downward trend under the same power dissipation when the drain-source voltage （VDs） is decreased. Moreover, the relatively low VDS and large drain-source current （IDs） result in a lower thermal resistance. The chip-level and package-level thermal resistance have been extracted by the structure function method. The simulation result indicated that the high electric field occurs at the gate contact where the temperature rise occurs. A relatively low VDS leads to a relatively low electric field, which leads to the decline of the thermal resistance.