Ultrasonic power features of wire bonding and thermosonic flip chip bonding in microelectronics packaging

The driving voltage and current signals of piezoceramic transducer (PZT) were measured directly by designing circuits from ultrasonic generator and using a data acquisition software system. The input impedance and power of PZT were investigated by using root mean square (RMS) calculation. The vibration driven by high frequency was tested by laser Doppler vibrometer (PSV-400-M2). And the thermosonic bonding features were observed by scanning electron microscope (JSM-6360LV). The results show that the input power of bonding is lower than that of no load. The input impedance of bonding is greater than that of no load. Nonlinear phase, plastic flow and expansion period, and strengthening bonding process are shown in the impedance and power curves. The ultrasonic power is in direct proportion to the vibration displacement driven by the power, and greater displacements driven by high power (>5 W) result in welding failure phenomena, such as crack, break, and peeling off in wedge bonding. For thermosonic flip chip bonding, the high power decreases position precision of bonding or results in slippage and rotation phenomena of bumps. To improve reliability and precision of thermosonic bonding, the low ultrasonic power (about 1-5 W) should be chosen.

Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding

This paper presents the recent study by investigating the vital responses of wire bonding with the application of conduction pre-heating. It is observed through literature reviews that, the effect of pre-heating has not been completely explored to enable the successful application of pre-heating during wire bonding. The aim of wire bonding is to form quality and reliable solid-state bonds to interconnect metals such as gold wires to metalized pads deposited on silicon integrated circuits. Typically, there are 3 main wire bonding techniques applied in the industry;Thermo-compression, Ultrasonic and Thermosonic. This experiment utilizes the most common and widely used platform which is thermosonic bonding. This technique is explored with the application of conduction pre-heating along with heat on the bonding site, ultrasonic energy and force on an Au-Al system. Sixteen groups of bonding conditions which include eight hundred data points of shear strength at various temperature settings were compared to establish the relationship between bonding strength and the application of conduction pre-heating. The results of this study will clearly indicate the effects of applied conduction pre-heating towards bonding strength which may further produce a robust wire bonding system.

Defect Recognition in Thermosonic Imaging

This work is aimed at developing an effective method for defect recognition in thermosonic imaging.The heat mechanism of thermosonic imaging is introduced,and the problem for defect recognition is discussed.For this purpose,defect existing in the inner wall of a metal pipeline specimen and defects embedded in a carbon fiber reinforced plastic（CFRP） laminate are tested.The experimental data are processed by pulse phase thermography（PPT） method to show the phase images at different frequencies,and the characteristic of phase angle vs frequency curve of thermal anomalies and sound area is analyzed.A binary image,which is based on the characteristic value of defects,is obtained by a new recognition algorithm to show the defects.Results demonstrate good defect recognition performance for thermosonic imaging,and the reliability of this technique can be improved by the method.

Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds

Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diameter are adopted to evaluate the bonding quality. It is concluded that the ef/~cient ultrasonic power is needed to soften the ball to form the copper bonds with high bonding strength. However, excessive ultrasonic power would serve as a fatigue loading to weaken the bonding. Excessive or less bonding force would cause cratering in the silicon.

MICROSTRUCTURE CHARACTERISTICS AT THE BOND INTERFACE

Lift-off and section characteristics at the interface of thermosonic bond are observed by using scanning electron microscope （KYKY2800） with EDS-test. Results show that the peeling underdeveloped bonds simulate atorns （or doughnut） with an unbonded central region and ridged peripheral region is bonded hardly, Inside roundness at flip chip bonding center are discovered. Bond strength is located between the severely ridged periphery and the non-adhering central area of the bond. For constant force and time, the ridged area of the bond pattern increases when more power is applied. For constant force and power, the ridged location of the bonded region moves closer to the bond center with time. Results of EDS-tests at Au-Al and Au-Ag interfaces show that Kirkendall diffusibility at Au-Ag interface occur and the diffusing speed of Au-atomic is faster than that of Ag, and that intermetallic compounds at Au-Al interface is generated possibly. And these would be helpful for further research about thermosonic bonding.

Use of ultrasound in food preservation

Ultrasound is versatile and innovative technology due to its wide range of application and increase in knowledge and research studies. It is used in food industry for many purposes including analysis methods and food processings such as freezing, cutting, drying, tempering, homogenization, degassing, antifoaming, filtration and extraction. Ultrasound can be used as a promoter or alternative to food processing. There may be numereous advantages of using ultrasound for food processing such as effective mixing, increased mass transfer, reduced energy, reduced temperature and increased production rate. Due to the elimination of microorganisms and enzymes without destroying nutrients of foods, ultrasound can be used as an alternative method to thermal treatments in the food preservation. Additionally, low power ultrasound is thought to be an attractive nonthermal method due to overcome problems which occur during heat treatments such as physical and chemical changes, nutritional loss and change in organoleptic properties. This review summarizes mechanism, operation and latest potential applications of ultrasound in the food preservation.

Calculation Model for the Steady-State Vibration Amplitude of a New Type of Cascaded Composite Structure-Based Ultrasonic Transducer

The steady-state vibration amplitude is an important performance indicator of high-frequency ultrasonic transducers for ultrasonically assisted manipulating,machining,and manufacturing.This work aimed to develop a calculation model for the steady-state vibration amplitude of a new type of dual-branch cascaded composite structure-based ultrasonic transducer that can be used in the packaging of microelectronic chips.First,the steady-state vibration amplitude of the piezoelectric vibrator of the transducer was derived from the piezoelectric equation.Second,the vibration transfer matrices of the tapered ultrasonic horns were obtained by combining the vibration equation,the continuous condition of the displacement,and the equilibrium condition of the force.Calculation models for the steady-state vibration amplitude of the two working ends of the transducer were then developed.A series of exciting trials were carried out to test the performance of the models.Comparison between the calculated and measured results for steady-state vibration amplitude showed that the maximum deviation was 0.0221μm,the minimum deviation was 0.0013μm,the average deviation was 0.0097μm,and the standard deviation was 0.0046μm.These values indicated good calculation accuracy,laying a good foundation for the practical application of the proposed transducer.