Background: Since 2021, high-risk Human Papilloma Virus (HR-HPV) testing has been the recommended screening test for cervical cancer for all settings;either used alone in a “test and treat” strategy, or with a triag...Background: Since 2021, high-risk Human Papilloma Virus (HR-HPV) testing has been the recommended screening test for cervical cancer for all settings;either used alone in a “test and treat” strategy, or with a triage test, with or without biopsy, before treatment. Cameroon has rolled out immunization against HPV 16 and 18, but studies show a higher prevalence of non-16/18 HR-HPV types. Objectives: Determine the prevalence of precancerous lesions, in women with HR-HPV infection and evaluate association of digital cervicography (DC) VIA/VILI positivity with HPV serotype, as a measure of their contribution to precancer and cancer incidence. Methodology: The study was cross-sectional, descriptive, and analytic. It took place at the Etoug-Ebe and Ekoudoum Baptist Hospitals in Yaoundé, during the period April-September 2022. We reviewed the records of women screened for cervical cancer between February 2020 and December 2021 and evaluated the prevalence of lesions on digital cervicography (DC) with VIA/VILI for women positive for HR-HPV serotypes. The data were analyzed using SPSS version 20.0 for Windows. P values Results: We identified 315 cases with a positive HR-HPV deoxyribonucleic acid (DNA) test, 224 (71.1%) had a DC VIA/VILI triage test done. Of these, 30 (13.4%) women had a positive DC VIA/VILI, with five women (2.2%) having lesions suggestive of cancer. Out of 11 cases positive for HPV 16 alone, 05 (45.5%) had a positive DC VIA/VILI test. Of the 14 cases positive for HPV 18 alone, 03 (21.4%) had a positive VIA/VILI, meanwhile only 19 (10.7%) of the 177 cases positive for non-16/18 HPV had a positive VIA/VILI test. Conclusion: A high proportion of women (13.4%) with HR HPV had a positive DC VIA/VILI, with a significant proportion (2.2%) having lesions suggestive of invasive cervical cancer HR-HPV serotype was associated with DC VIA/VILI positivity;HPV 16 had the strongest association (45.5%), followed by HPV 18 (21.4%), and non-16/18 HR-HPV (10.7%), suggesting a decreasing order of oncogenicity.展开更多
Through-silicon-via （TSV） to TSV crosstalk noise is one of the key factors affecting the signal integrity of three- dimensional integrated circuits （3D ICs）. Based on the frequency dependent equivalent electrical ...Through-silicon-via （TSV） to TSV crosstalk noise is one of the key factors affecting the signal integrity of three- dimensional integrated circuits （3D ICs）. Based on the frequency dependent equivalent electrical parameters for the TSV channel, an analytical crosstalk noise model is established to capture the TSV induced crosstalk noise. The impact of various design parameters including insulation dielectric, via pitch, via height, silicon conductivity, and terminal impedance on the crosstalk noise is analyzed with the proposed model. Two approaches are proposed to alleviate the TSV noise, namely, driver sizing and via shielding, and the SPICE results show 241 rnV and 379 mV reductions in the peak noise voltage, respectively.展开更多
In this article,we have given a elaborate introduction about MVICH implementation underlying MPICH,and illustrated its structure ,working principle and performance. MVICH is an implementation of MPICH ADI2 base ofVIA ...In this article,we have given a elaborate introduction about MVICH implementation underlying MPICH,and illustrated its structure ,working principle and performance. MVICH is an implementation of MPICH ADI2 base ofVIA protocol, using VIA descriptors queue for transferring data in its low layer. It has some characters such as userlevel communications, without kernel trapping, memory binding and registering and so on. MVICH uses buffer(region)management,four transfer protocol,converting dynamically at runtime,and special flow control etc. For highspeed LAN,the combination of VIA and MPI can give a greater improvement for the performance of MPI applica-tions ,and exert those applications' potential ability. It will become the main project of research and development in future.展开更多
The principal aim of this paper is to develop an approach to realize stable biological nitrogen removal via nitrite under normal conditions. Validation of the new method was established on laboratory-scale experiments...The principal aim of this paper is to develop an approach to realize stable biological nitrogen removal via nitrite under normal conditions. Validation of the new method was established on laboratory-scale experiments applying the sequencing batch reactor（SBR） activated sludge process to domestic wastewater with low C/N ratio. The addition of sodium chloride（NaCI） to influent was established to achieve nitrite build-up. The high nitrite accumulation, depending on the salinity in influent and the application duration of salt, was obtained in SBRs treating saline wastewater. The maintenance results indicated that the real-time SBRs can maintain stable nitrite accumulation, but conversion from shorter nitrification-denitrification to full nitrification-denitrification was observed after some operation cycles in the other SBR with fixed-time control. The presented method is valuable to offer a solution to realize and to maintain nitrogen removal via nitrite under normal conditions.展开更多
The Virtual Interface Architecture(VIA) is a kind of user-level communication architectures and it has become industrial standard of cluster communication.In order to evaluate different VIA implemention under unified ...The Virtual Interface Architecture(VIA) is a kind of user-level communication architectures and it has become industrial standard of cluster communication.In order to evaluate different VIA implemention under unified criterion, a micro-benchmark ,which called VIABM is designed. Used some cases demonstrating this micro-benchmark also can slove the problem mentioned above.展开更多
Based on the heat diffusion equation of multilevel interconnects, a novel analytical thermal model for multilevel nano-scale interconnects considering the via effect is presented, which can compute quickly the tempera...Based on the heat diffusion equation of multilevel interconnects, a novel analytical thermal model for multilevel nano-scale interconnects considering the via effect is presented, which can compute quickly the temperature of multilevel interconnects, with substrate temperature given. Based on the proposed model and the 65 nm complementary metal oxide semiconductor （CMOS） process parameter, the temperature of nano-scale interconnects is computed. The computed results show that the via effect has a great effect on local interconnects, but the reduction of thermal conductivity has little effect on local interconnects. With the reduction of thermal conductivity or the increase of current density, however, the temperature of global interconnects rises greatly, which can result in a great deterioration in their performance. The proposed model can be applied to computer aided design （CAD） of very large-scale integrated circuits （VLSIs） in nano-scale technologies.展开更多
In this article, a new application to find the exact solutions of nonlinear partial time-space fractional differential Equation has been discussed. Firstly, the fractional complex transformation has been implemented t...In this article, a new application to find the exact solutions of nonlinear partial time-space fractional differential Equation has been discussed. Firstly, the fractional complex transformation has been implemented to convert nonlinear partial fractional differential Equations into nonlinear ordinary differential Equations. Afterwards, the (G'/G)-expansion method has been implemented, to celebrate the exact solutions of these Equations, in the sense of modified Riemann-Liouville derivative. As application, the exact solutions of time-space fractional Burgers’ Equation have been discussed.展开更多
The via interconnects are key components in ultra-large scale integrated circuits （ULSI）. This paper deals with a new method to create single-walled carbon nanotubes （SWNTs） via interconnects using alternating die...The via interconnects are key components in ultra-large scale integrated circuits （ULSI）. This paper deals with a new method to create single-walled carbon nanotubes （SWNTs） via interconnects using alternating dielectrophoresis （DEP）. Carbon nanotubes are vertically assembled in the microscale via-holes successfully at room temperature under ambient condition. The electrical evaluation of the SWNT vias reveals that our DEP assembly technique is highly reliable and the success rate of assembly can be as high as 90%. We also propose and test possible approaches to reducing the contact resistance between CNT vias and metal electrodes.展开更多
文摘Background: Since 2021, high-risk Human Papilloma Virus (HR-HPV) testing has been the recommended screening test for cervical cancer for all settings;either used alone in a “test and treat” strategy, or with a triage test, with or without biopsy, before treatment. Cameroon has rolled out immunization against HPV 16 and 18, but studies show a higher prevalence of non-16/18 HR-HPV types. Objectives: Determine the prevalence of precancerous lesions, in women with HR-HPV infection and evaluate association of digital cervicography (DC) VIA/VILI positivity with HPV serotype, as a measure of their contribution to precancer and cancer incidence. Methodology: The study was cross-sectional, descriptive, and analytic. It took place at the Etoug-Ebe and Ekoudoum Baptist Hospitals in Yaoundé, during the period April-September 2022. We reviewed the records of women screened for cervical cancer between February 2020 and December 2021 and evaluated the prevalence of lesions on digital cervicography (DC) with VIA/VILI for women positive for HR-HPV serotypes. The data were analyzed using SPSS version 20.0 for Windows. P values Results: We identified 315 cases with a positive HR-HPV deoxyribonucleic acid (DNA) test, 224 (71.1%) had a DC VIA/VILI triage test done. Of these, 30 (13.4%) women had a positive DC VIA/VILI, with five women (2.2%) having lesions suggestive of cancer. Out of 11 cases positive for HPV 16 alone, 05 (45.5%) had a positive DC VIA/VILI test. Of the 14 cases positive for HPV 18 alone, 03 (21.4%) had a positive VIA/VILI, meanwhile only 19 (10.7%) of the 177 cases positive for non-16/18 HPV had a positive VIA/VILI test. Conclusion: A high proportion of women (13.4%) with HR HPV had a positive DC VIA/VILI, with a significant proportion (2.2%) having lesions suggestive of invasive cervical cancer HR-HPV serotype was associated with DC VIA/VILI positivity;HPV 16 had the strongest association (45.5%), followed by HPV 18 (21.4%), and non-16/18 HR-HPV (10.7%), suggesting a decreasing order of oncogenicity.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61131001,61322405,61204044,61376039,and 61334003)
文摘Through-silicon-via （TSV） to TSV crosstalk noise is one of the key factors affecting the signal integrity of three- dimensional integrated circuits （3D ICs）. Based on the frequency dependent equivalent electrical parameters for the TSV channel, an analytical crosstalk noise model is established to capture the TSV induced crosstalk noise. The impact of various design parameters including insulation dielectric, via pitch, via height, silicon conductivity, and terminal impedance on the crosstalk noise is analyzed with the proposed model. Two approaches are proposed to alleviate the TSV noise, namely, driver sizing and via shielding, and the SPICE results show 241 rnV and 379 mV reductions in the peak noise voltage, respectively.
文摘In this article,we have given a elaborate introduction about MVICH implementation underlying MPICH,and illustrated its structure ,working principle and performance. MVICH is an implementation of MPICH ADI2 base ofVIA protocol, using VIA descriptors queue for transferring data in its low layer. It has some characters such as userlevel communications, without kernel trapping, memory binding and registering and so on. MVICH uses buffer(region)management,four transfer protocol,converting dynamically at runtime,and special flow control etc. For highspeed LAN,the combination of VIA and MPI can give a greater improvement for the performance of MPI applica-tions ,and exert those applications' potential ability. It will become the main project of research and development in future.
基金The Hi_Tech Research and Development Program(863) of China(2004AA601020) the National Natural Science Foundation of China(No.50478047)andthe Open Grant of Beijing Key Laboratory
文摘The principal aim of this paper is to develop an approach to realize stable biological nitrogen removal via nitrite under normal conditions. Validation of the new method was established on laboratory-scale experiments applying the sequencing batch reactor（SBR） activated sludge process to domestic wastewater with low C/N ratio. The addition of sodium chloride（NaCI） to influent was established to achieve nitrite build-up. The high nitrite accumulation, depending on the salinity in influent and the application duration of salt, was obtained in SBRs treating saline wastewater. The maintenance results indicated that the real-time SBRs can maintain stable nitrite accumulation, but conversion from shorter nitrification-denitrification to full nitrification-denitrification was observed after some operation cycles in the other SBR with fixed-time control. The presented method is valuable to offer a solution to realize and to maintain nitrogen removal via nitrite under normal conditions.
文摘The Virtual Interface Architecture(VIA) is a kind of user-level communication architectures and it has become industrial standard of cluster communication.In order to evaluate different VIA implemention under unified criterion, a micro-benchmark ,which called VIABM is designed. Used some cases demonstrating this micro-benchmark also can slove the problem mentioned above.
基金Project supported by the National Natural Science Foundation of China (Grant Nos 60676009 and 60725415)the National High Technology Research and Development Program of China (Grant Nos 2009AA01Z258 and 2009AA01Z260)
文摘Based on the heat diffusion equation of multilevel interconnects, a novel analytical thermal model for multilevel nano-scale interconnects considering the via effect is presented, which can compute quickly the temperature of multilevel interconnects, with substrate temperature given. Based on the proposed model and the 65 nm complementary metal oxide semiconductor （CMOS） process parameter, the temperature of nano-scale interconnects is computed. The computed results show that the via effect has a great effect on local interconnects, but the reduction of thermal conductivity has little effect on local interconnects. With the reduction of thermal conductivity or the increase of current density, however, the temperature of global interconnects rises greatly, which can result in a great deterioration in their performance. The proposed model can be applied to computer aided design （CAD） of very large-scale integrated circuits （VLSIs） in nano-scale technologies.
文摘In this article, a new application to find the exact solutions of nonlinear partial time-space fractional differential Equation has been discussed. Firstly, the fractional complex transformation has been implemented to convert nonlinear partial fractional differential Equations into nonlinear ordinary differential Equations. Afterwards, the (G'/G)-expansion method has been implemented, to celebrate the exact solutions of these Equations, in the sense of modified Riemann-Liouville derivative. As application, the exact solutions of time-space fractional Burgers’ Equation have been discussed.
基金Project supported by the National Natural Science Foundation of China (Grant Nos. 60625403,60925015,and 61076069)the National Basic Research Program of China (Grant Nos. 2011CBA00600 and 2011CBA00601)the Instrumental Analysis Fund of Peking University,China
文摘The via interconnects are key components in ultra-large scale integrated circuits （ULSI）. This paper deals with a new method to create single-walled carbon nanotubes （SWNTs） via interconnects using alternating dielectrophoresis （DEP）. Carbon nanotubes are vertically assembled in the microscale via-holes successfully at room temperature under ambient condition. The electrical evaluation of the SWNT vias reveals that our DEP assembly technique is highly reliable and the success rate of assembly can be as high as 90%. We also propose and test possible approaches to reducing the contact resistance between CNT vias and metal electrodes.
