An improved ASM-HEMT model for kink effect on GaN devices

With the analysis of experiment and theory on GaN HEMT devices under DC sweep,an improved model for kink effect based on advanced SPICE model for high electron mobility transistors(ASM-HEMT)is pro⁃posed,considering the relationship between the drain/gate-source voltage and kink effect.The improved model can not only accurately describe the trend of the drain-source current with the current collapse and kink effect,but also precisely fit different values of drain-source voltages at which the kink effect occurs under different gatesource voltages.Furthermore,it well characterizes the DC characteristics of GaN devices in the full operating range,with the fitting error less than 3%.To further verify the accuracy and convergence of the improved model,a load-pull system is built in ADS.The simulated result shows that although both the original ASM-HEMT and the improved model predict the output power for the maximum power matching of GaN devices well,the im⁃proved model predicts the power-added efficiency for the maximum efficiency matching more accurately,with 4%improved.

Epitaxial Growth of 4H-SiC on 4° Off-Axis Substrate for Power Devices

Homo-epitaxial layers are successfully grown on Si-face 4°off−axis 4H-SiC substrates using the horizontal hot-wall chemical vapor deposition system.The smooth surface without morphological defects is obtained by the optimized in situ etching process and growth temperature.Schottky diodes fabricated on the epilayer present a typical I–V characteristic.This is the first report of Schottky diodes fabricated on 4°off-axis 4H-SiC substrates made in China.

Investigation of reflection anisotropy induced by micropipe defects on the surface of a 4H-SiC single crystal using scanning anisotropy microscopy

Optical reflection anisotropy microscopy mappings of micropipe defects on the surface of a 4H-SiC single crystal are studied by the scanning anisotropy microscopy(SAM)system.The reflection anisotropy(RA)image with a'butterfly pattern'is obtained around the micropipes by SAM.The RA image of the edge dislocations is theoretically simulated based on dislocation theory and the photoelastic principle.By comparing with the Raman spectrum,it is verified that the micropipes consist of edge dislocations.The different patterns of the RA images are due to the different orientations of the Burgers vectors.Besides,the strain distribution of the micropipes is also deduced.One can identify the dislocation type,the direction of the Burgers vector and the optical anisotropy from the RA image by using SAM.Therefore,SAM is an ideal tool to measure the optical anisotropy induced by the strain field around a defect.

宽带单片低噪声放大器的增益温度补偿

分析了PHEMT的增益-温度特性和漏电流-温度特性,发现PHEMT增益和漏电流都是随温度的升高而降低,并发现了一定栅宽的PHEMT在大于某一频率时,其增益受温度变化较小的原因.提出了两种自动温度补偿的方法,并分析了每种方法的温度补偿原理.串联源电阻的温度补偿可使PHEMT的漏电流基本保持不变,在一定程度上能降低温度对增益的影响.而自动栅压温度补偿则是强温度补偿,它可随温度的升高,自动提高栅极电压,提高PHEMT的跨导,从而大大减少温度对增益的影响,达到温度补偿的目的.把这两种自动温度补偿的方法结合应用到宽带低噪声放大器中,发现补偿效果良好.试验发现温度补偿后,温度从-55℃～＋85℃时和-55℃～＋125℃时,放大器的增益在6GHz时的降差分别减小了60%和51%,较大地改善了放大器的温度-增益性能.

Heterogeneous integration of GaAs pHEMT and Si CMOS on the same chip

In this work,we demonstrate the technology of wafer-scale transistor-level heterogeneous integration of Ga As pseudomorphic high electron mobility transistors（p HEMTs） and Si complementary metal–oxide semiconductor（CMOS） on the same Silicon substrate.Ga As p HEMTs are vertical stacked at the top of the Si CMOS wafer using a wafer bonding technique,and the best alignment accuracy of 5 μm is obtained.As a circuit example,a wide band Ga As digital controlled switch is fabricated,which features the technologies of a digital control circuit in Si CMOS and a switch circuit in Ga As p HEMT,15% smaller than the area of normal Ga As and Si CMOS circuits.

Common Base Four-Finger InGaAs/InP Double Heterojunction Bipolar Transistor with Maximum Oscillation Frequency 535 GHz

A common base four-finger InOaAs/InP double heterojunction bipolar transistor with 535 OHz fmax by using the 0.5 μm emitter technology is fabricated. Multi-finger design is used to increase the input current. Common base configuration is compared with common emitter configuration, and shows a smaller K factor at high frequency span, indicating a larger breakpoint frequency of maximum stable gain/maximum available gain （MSG/MAG） and thus a higher gain near the cut-off frequency, which is useful in THz amplifier design.

Effect of X-ray irradiation on threshold voltage of AlGaN/GaN HEMTs with p-GaN and MIS Gates

Commercially available AlGaN/GaN high-electron-mobility transistors(HEMTs)are beginning to enter the public scene froma range of suppliers.Based on previous studies,commercial GaN-based electronics are expected to be tolerant to different types of irradiation in space.To test this assumption,we compared the characteristic electrical curves obtained at different X-ray irradiation doses for GaN HEMT devices manufactured by Infineon and Transphorm.The p-GaN-based device was found to be more robust with a stable threshold voltage,whereas the threshold voltage of the device with ametal-insulator-semiconductor gatewas found to shift first in the negative and then the positive direction.This dynamic phenomenon is caused by the releasing and trapping effects of radiation-induced charges in the dielectric layer and at the interface of irradiated devices.As such,the p-GaNgate-based GaN HEMT provides a promising solution for use as an electric source in space.

A 5.4mW and 6.1% efficiency fixed-tuned 214GHz frequency doubler with Schottky barrier diodes

A Y-band frequency doubler is analyzed and designed with GaAs planar Schottky diode, which is flip-chip solded into a 50 μm thick quartz substrate. Diode embedding impedance is found by full- wave analysis with lumped port to model the nonlinear junction for impedance matching without the need of diode equivalent circuit model. All the matching circuit is designed ＂on-chip＂ and the mul- tiplier is self-biasing. To the doubler, a conversion efficiency of 6.1% and output power of 5.4mW are measured at 214GHz with input power of 88mW, and the typical measured efficiency is 4.5% in 200 - 225 GHz.

Thermal characterization of GaN heteroepitaxies using ultraviolet transient thermoreflectance

Thermal transport properties of GaN heteroepitaxial structures are of critical importance for the thermal management of high-power GaN electronic and optoelectronic devices. Ultraviolet(UV) lasers are employed to directly heat and sense the GaN epilayers in the transient thermoreflectance(TTR) measurement, obtaining important thermal transport properties in different GaN heterostructures, which include a diamond thin film heat spreader grown on GaN. The UV TTR technique enables rapid and non-contact thermal characterization for GaN wafers.

A G-band terahertz monolithic integrated amplifier in 0.5-μm InP double heterojunction bipolar transistor technology

Design and characterization of a G-band（140–220 GHz） terahertz monolithic integrated circuit（TMIC） amplifier in eight-stage common-emitter topology are performed based on the 0.5-μm In Ga As/In P double heterojunction bipolar transistor（DHBT）. An inverted microstrip line is implemented to avoid a parasitic mode between the ground plane and the In P substrate. The on-wafer measurement results show that peak gains are 20 dB at 140 GHz and more than 15-dB gain at 140–190 GHz respectively. The saturation output powers are-2.688 dBm at 210 GHz and-2.88 dBm at 220 GHz,respectively. It is the first report on an amplifier operating at the G-band based on 0.5-μm InP DHBT technology. Compared with the hybrid integrated circuit of vacuum electronic devices, the monolithic integrated circuit has the advantage of reliability and consistency. This TMIC demonstrates the feasibility of the 0.5-μm InGaAs/InP DHBT amplifier in G-band frequencies applications.

Influence of spacer layer thickness on the current-voltage characteristics of pseudomorphic AlAs/In_(0.53)Ga_(0.47)As/InAs resonant tunnelling diodes

This paper investigates the dependence of current voltage characteristics of AlAs/In0.53Ga0.47As/InAs resonant tunnelling diodes （RTDs） on spacer layer thickness. It finds that the peak and the valley current density J in the negative differential resistance （NDR） region depends strongly on the thickness of the spacer layer. The measured peak to valley current ratio of RTDs studied here is shown to improve while the current density through RTDs decreases with increasing spacer layer thickness below a critical value.

Low on-resistance 1.2 kV 4H-SiC power MOSFET with Ron, sp of 3.4 mΩ·cm^2

A 4H-SiC power MOSFET with specific on-resistance of 3.4 mΩ·cm^2 and breakdown voltage exceeding 1.5 kV is designed and fabricated.Numerical simulations are carried out to optimize the electric field strength in gate oxide and at the surface of the semiconductor material in the edge termination region.Additional n-type implantation in JFET region is implemented to reduce the specific on-resistance.The typical leakage current is less than 1μA at VDS=1.4 kV.Drain–source current reaches 50 A at VDS=0.75 V and VGS=20 V corresponding to an on-resistance of 15 mΩ.The typical gate threshold voltage is 2.6 V.

Enhanced interface properties of diamond MOSFETs with Al2O3 gate dielectric deposited via ALD at a high temperature

The interface state of hydrogen-terminated(C-H)diamond metal-oxide-semiconductor field-effect transistor(MOSFET)is critical for device performance.In this paper,we investigate the fixed charges and interface trap states in C-H diamond MOSFETs by using different gate dielectric processes.The devices use Al_(2)O_(3) as gate dielectrics that are deposited via atomic layer deposition(ALD)at 80℃and 300℃,respectively,and their C-V and I-V characteristics are comparatively investigated.Mott-Schottky plots(1/C2-VG)suggest that positive and negative fixed charges with low density of about 10^(11)cm^(-2) are located in the 80-℃-and 300-℃deposition Al2O3 films,respectively.The analyses of direct current(DC)/pulsed I-V and frequency-dependent conductance show that the shallow interface traps(0.46 eV-0.52 eV and 0.53 eV-0.56 eV above the valence band of diamond for the 80-℃and 300-℃deposition conditions,respectively)with distinct density(7.8×10^(13)eV^(-1)·cm^(-2)-8.5×10^(13)eV^(-1)·cm^(-2) and 2.2×10^(13)eV^(-1)·cm^(-2)-5.1×10^(13)eV^(-1)·cm^(-2) for the 80-℃-and 300-℃-deposition conditions,respectively)are present at the Al2O3/C-H diamond interface.Dynamic pulsed I-V and capacitance dispersion results indicate that the ALD Al_(2)O_(3) technique with 300-℃deposition temperature has higher stability for C-H diamond MOSFETs.

Characterize and optimize the four-wave mixing in dual-interferometer coupled silicon microrings

By designing and fabricating a series of dual-interferometer coupled silicon microrings, the coupling condition of the pump, signal, and idler beams can be engineered independently and then we carried out both the continuous-wave and pulse pumped four-wave mixing experiments to verify the dependence of conversion efficiency on the coupling conditions of the four interacting beams, respectively. Under the continuous-wave pump, the four-wave mixing efficiency gets maximized when both the pump and signal/idler beams are closely operated at the critical coupling point, while for the pulse pump case, the efficiency can be enhanced greatly when the pump and converted idler beams are all overcoupled. These experiment results agree well with our theoretical calculations. Our design provides a platform for explicitly characterizing the four-wave mixing under different pumping conditions, and offers a method to optimize the four-wave mixing, which will facilitate the development of on-chip all-optical signal processing with a higher efficiency or reduced pump power.

Vacuum Violet Photo-Response of AlGaN-Based Metal-Semiconductor-Metal Photodetectors

Al_(0.5)Ga_(0.5)N-based metal-semiconductor-metal photodetectors(PDs)with a large device area of 5×5 mm^(2) are fabricated on a sapphire substrate,which are tested for vacuum ultraviolet light detection by using a synchrotron radiation source.The PD exhibits low dark current of less than 1 pA under 30 V bias and a spectral cutoff around 260 nm,corresponding to the energy bandgap of Al_(0.5)Ga_(0.5)N.A peak photo-responsivity of 14.68 mA/W at 250 nm with a rejection ratio(250/360 nm)of more than four orders of magnitude is obtained under 30 V bias.For wavelength less than 170 nm,the photoresponsivity of the PD is found to increase as wavelength decreases,which is likely caused by the enhanced photoemission effect.

RF characterization of InP double heterojunction bipolar transistors on a flexible substrate under bending conditions

This letter presents the fabrication of InP double heterojunction bipolar transistors(DHBTs)on a 3-inch flexible substrate with various thickness values of the benzocyclobutene(BCB)adhesive bonding layer,the corresponding thermal resistance of the InP DHBT on flexible substrate is also measured and calculated.InP DHBT on a flexible substrate with 100 nm BCB obtains cut-off frequency f_(T)=358 GHz and maximum oscillation frequency f_(MAX)=530 GHz.Moreover,the frequency performance of the InP DHBT on flexible substrates at different bending radii are compared.It is shown that the bending strain has little effect on the frequency characteristics(less than 8.5%),and these bending tests prove that InP DHBT has feasible flexibility.

Channel Temperature Measurement of AlGaN/GaN HEMTs by Forward Schottky Characteristics

Channel temperature measurements of multi-finger AlGaN/OaN HEMTs by forward Schottky characteristics are presented. The temperature dependence of the forward gate-source Schottky junction voltage is investigated and it is used as the temperature sensitive parameter （TSP） by pulsed switching technique. The channel-to-mounting thermal resistance of the tested AlGaN/GaN HEMT sample is 19.6°C/W. Compared with both the measured results by micro-Raman method and simulated results of a three-di^nensional heat conduction model, the physical meaning of the channel temperature for AIGaN/GaN HEMT tested by pulsed switching electrical TSP method is investigated quantitatively for the first time.

Structure and Strain Properties of GaN Films Grown on Si（111） Substrates with AlxGa1-xN/AlyGa1-yN Superlattices

CaN films with an AlxGa1-xN/AlyGa1-xN superlattice （SL） buffer layer are grown on Si（111） substrates by metal-organic chemical vapor deposition （MOCVD）. The structure and strain properties of the samples are studied by optical microscopy, Raman spectroscopy, x-ray diffractometry and atomic force microscopy. The results show that the strain status and crystalline quality of the CaN layers are strongly dependent on the difference of the Al composition between AlxCa1-xN barriers and AlyCa1-yN wells in the SLs. With a large Al composition difference, the CaN film tends to generate cracks on the surface due to the severe relaxation of the SLs. Otherwise, when using a small Al composition difference, the crystalline quality of the CaN layer degrades due to the poor function of the SLs in filtering dislocations. Under an optimized condition that the Al composition difference equals 0.1, the crack-free and compressive strained CaN film with an improved crystalline quality is achieved. Therefore, the AlxGa1-xN/AlyGal-yN SL buffer layer is a promising buffer structure for growing thick CaN films on Si substrates without crack generation.

A NOVEL Ku-BAND LOW NOISE AMPLIFIER WITH HEMT AND GaAs MMIC

A novel Ku-band low noise amplifier with a high electron mobility transistor (HEMT)and a GaAs monolithic microwave integrated circuit (MMIC) has been demonstrated. Its noisefigure is less-than 1.9dB with an associated gain larger than 27dB and an input/output VSWRless than 1.4 in the frequency range of 11.7-12.2GHz. The HEMT and the microwave series in-ductance feedback technique are used in the first stage of the amplifier, and a Ku-band MMIC isemployed in the last stage. The key to this design is to achieve an optimum noise match and a min-imum input VSWR matching simultaneously by using the microwave series inductance feedbackmethod. The B J-120 waveguides are used in both input and output of the amplifier.

Analysis of Drain Modulation for High Voltage GaN Power Amplifier Considering Parasitics

For high-voltage and high-power Gallium Nitride(GaN)power amplifiers,a drain modulation circuit with rapid rise and fall time is proposed in this paper.To decrease the rise and fall time,the high-side bootstrap drive circuit with an auxiliary discharge switch is proposed.The effect of the parasitics is analyzed based on calculation and the parallel bonding is proposed.The storage capacitance of power supply is calculated quantitatively to provide large pulse current.To ensure safe operation of the power amplifier,the circuit topology with the dead-time control and sequential control is proposed.Finally,a prototype is built to verify the drain modulation circuit design.The experiments prove that the rise time and fall time of the output pulse signal are both less than 100 ns.