11.2 W/mm power density AlGaN/GaN high electron-mobility transistors on a GaN substrate

In this letter,high power density AlGaN/GaN high electron-mobility transistors(HEMTs)on a freestanding GaN substrate are reported.An asymmetricΓ-shaped 500-nm gate with a field plate of 650 nm is introduced to improve microwave power performance.The breakdown voltage(BV)is increased to more than 200 V for the fabricated device with gate-to-source and gate-to-drain distances of 1.08 and 2.92μm.A record continuous-wave power density of 11.2 W/mm@10 GHz is realized with a drain bias of 70 V.The maximum oscillation frequency(f_(max))and unity current gain cut-off frequency(f_(t))of the AlGaN/GaN HEMTs exceed 30 and 20 GHz,respectively.The results demonstrate the potential of AlGaN/GaN HEMTs on freestanding GaN substrates for microwave power applications.

High-Performance Perovskite Solar Cells with Zwitterion-Capped-ZnO Quantum Dots as Electron Transport Layer and NH_(4)X(X=F,Cl,Br)Assisted Interfacial Engineering

The systematic advances in the power conversion efficiency(PCE)and stability of perovskite solar cells(PSCs)have been driven by the developments of perovskite materials,electron transport layer(ETL)materials,and interfacial passivation between the relevant layers.While zinc oxide(ZnO)is a promising ETL in thin film photovoltaics,it is still highly desirable to develop novel synthetic methods that allow both fine-tuning the versatility of ZnO nanomaterials and improving the ZnO/perovskite interface.Among various inorganic and organic additives,zwitterions have been effectively utilized to passivate the perovskite films.In this vein,we develop novel,well-characterized betaine-coated ZnO QDs and use them as an ETL in the planar n-i-p PSC architecture,combining the ZnO QDs-based ETL with the ZnO/perovskite interface passivation by a series of ammonium halides(NH_(4)X,where X=F,Cl,Br).The champion device with the NH4F passivation achieves one of the highest performances reported for ZnO-based PSCs,exhibiting a maximum PCE of~22%with a high fill factor of 80.3%and competitive stability,retaining~78%of its initial PCE under 1 Sun illumination with maximum power tracking for 250 h.

Study the Effect of Thickness on the Performance of PM6:Y6 Organic Solar Using SCAPS Simulation

In this study, organic solar cells (OSCs) with an active layer, a blend of polymer of non-fullerene (NFA) Y6 as an acceptor, and donor PBDB-T-2F as donor were simulated through the one-dimensional solar capacitance simulator (SCAPS-1D) software to examine the performance of this type of organic polymer thin-film solar cell by varying the thickness of the active layer. PFN-Br interfacial layer entrenched in OPV devices gives overall enhanced open-circuit voltage, short-circuit current density and fill factor thus improving device performance. PEDOT: PSS is an electro-conductive polymer solution that has been extensively utilized in solar cell devices as a hole transport layer (HTL) due to its strong hole affinity, good thermal and mechanical stability, high work function, and high transparency in the visible range. The structure of the organic solar cell is ITO/PEDOT: PSS/BTP-4F: PBDB-T-2F/PFN-Br/Ag. Firstly, the active layer thickness was optimized to 100 nm;after that, the active-layer thickness was varied up to 900 nm. The results of these simulations demonstrated that the active layer thickness improves efficiency significantly up to 500 nm, then it decreased with increasing the thickness of the active layer from 600 nm, also notice that the short circuit current and the fill factor decrease with increasing the active layer from 600 nm, while the open voltage circuit increased with increasing the thickness of the active layer. The optimum thickness is 500 nm.

High-Frequency AlGaN/GaN High-Electron-Mobility Transistors with Regrown Ohmic Contacts by Metal-Organic Chemical Vapor Deposition

Nonalloyed ohmic contacts regrown by metal-organic chemical vapor deposition are performed on AlGaN/GaN high-electron-mobility transistors. Low ohmic contact resistance of 0.15Ω.mm is obtained. It is found that the sidewall obliquity near the regrown interface induced by the plasma dry etching has great influence on the total contact resistance. The fabricated device with a 100-nm T-shaped gate demonstrates a maximum drain current density of 0.95 A/mm at Vgs = 1 V and a maximum peak extrinsic transcondutance Gm of 216mS/ram. Moreover, a current gain cut-off frequency fT of 115 GHz and a maximum oscillation frequency fmax of 127 GHz are achieved.

Fabrication of GaN films through reactive reconstruction of magnetron sputtered ZnO/Ga_2O_3

A simple and easily operated technique was developed to fabricate GaN films. GaN films possessing hexagonal wurtzite structure were fabricated on Si(111) substrates with ZnO buffer layers through nitriding Ga2O3 films in the tube quartz furnace. ZnO buffer layers and Ga3O3 films were deposited on Si substrates in turn by using radio frequency magnetron sputtering system before the nitriding process. The structure and composition of GaN films were studied by X-ray diffraction, selected area electron diffraction and Fourier transform infrared spectrophotometer. The morphologies of GaN films were studied by scanning electron microscopy. The results show that ZnO buffer layer improves the crystalline quality and the surface morphology of the films relative to the films grown directly on silicon substrates. The measurement result of room-temperature photoluminescence spectrum indicates that the photoluminescence peaks locate at 365 nm and 422 nm.

HISTORY AND RECENT DEVELOPMENTS OF TERAHERTZ WAVE GENERATION

The unexplored terahertz (THz) region involves important phenomena of both fundamental and applied natures. Examples include phonon interactions, rotational transitions and intermolecular dynamics. Frequency tunable high power THz wave generation has been successfully achieved utilizing lattice resonance of LiNbO3 and GaP crystals, respectively. Semiconductor devices utilizing electron tunneling effect have also been developed.

Source-field-plated Ga_2O_3 MOSFET with a breakdown voltage of 550 V

Ga_2O_3 metal–oxide–semiconductor field-effect transistors(MOSFETs) with high-breakdown characteristics were fabricated on a homoepitaxial n-typed β-Ga_2O_3 film, which was grown by metal organic chemical vapor deposition(MOCVD) on an Fedoped semi-insulating(010) Ga_2O_3 substrate. The structure consisted of a 400 nm unintentionally doped(UID) Ga_2O_3 buffer layer and an 80 nm Si-doped channel layer. A high k HfO_2 gate dielectric film formed by atomic layer deposition was employed to reduce the gate leakage. Moreover, a source-connected field plate was introduced to enhance the breakdown characteristics. The drain saturation current density of the fabricated device reached 101 mA/mm at V_(gs) of 3 V. The off-state current was as low as 7.1 ×10^(-11) A/mm, and the drain current I_(ON)/I_(OFF) ratio reached 10~9. The transistors exhibited three-terminal off-state breakdown voltages of 450 and 550 V, corresponding to gate-to-drain spacing of 4 and 8 μm, respectively.

Demonstration of a High Open-Circuit Voltage GaN Betavoltaic Microbattery

A high open-circuit voltage betavoltaic microbattery based on a GaN p-i-n diode is demonstrated.Under the irradiation of a 4×4 mm^(2) planar solid 63Ni source with an activity of 2 mCi,the open−circuit voltage Voc of the fabricated single 2×2 mm^(2) cell reaches as high as 1.62 V,the short−circuit current density Jsc is measured to be 16nA/cm^(2).The microbattery has a fill factor of 55%,and the energy conversion efficiency of beta radiation into electricity reaches to 1.13%.The results suggest that GaN is a highly promising potential candidate for long-life betavoltaic microbatteries used as power supplies for microelectromechanical system devices.

Ohmic contact properties of p-type surface conductive layer on H-terminated diamond films prepared by DC arc jet CVD

With the advantages of high deposition rate and large deposition area, polycrystalline diamond films prepared by direct current （DC） arc jet chemical vapor deposition （CVD） are considered to be one of the most promising materials for high-frequency and high-power electronic devices. In this paper, high-quality self-standing polycrystalline diamond films with the diameter of 100 mm were prepared by DC arc jet CVD, and then, the p-type surface conductive layer with the sheet carrier density of 10^11-10^13 cm-2 on the H-terminated diamond film was obtained by micro-wave hydrogen plasma treatment for 40 min. Ti/Au and Au films were deposited on the H-terminated diamond surface as the ohmic contact electrode, respectively, afterwards, they were treated by rapid vacuum annealing at different temperatures. The properties of these two types of ohmic contacts were investigated by measuring the specific contact resistance using the transmission line method （TLM）. Due to the formation of Ti-related carbide at high temperature, the specific contact resistance of Ti/Au contact gradually decreases to 9.95 × 10^-5 Ω-cm2 as the temperature increases to 820℃. However, when the annealing temperature reaches 850℃, the ohmic contact for Ti/Au is degraded significantly due to the strong diffusion and reaction between Ti and Au. As for the as-deposited Au contact, it shows an ohmic contact. After annealing treatment at 550℃, low specific contact resistance was detected for Au contact, which is derived from the enhancement of interdiffusion between Au and diamond films.

Vanadium-Doped Semi-Insulating 6H-SiC for Microwave Power Device Applications

Two-inch semi-insulating SiC bulk crystals with resistivity higher than 1 × 10^6 Qcm were achieved by vanadium doping during sublimation. Secondary-ion-mass-spectrometry （SIMS） was employed to determine the concentration of impurities in the crystals, such as B, AI, V and N. These results indicated that the concentration of nitrogen and aluminum kept on decreasing and the concentration of B and V was almost constant during the whole growth. An inner crucible was used to control the exhausting of vanadium, which made the uniformity of the high resistivity （〉1×10^6 Ωcm） in the wafer up to 80%. High-performance AlGaN/GaN high-electronmobility-transistor （HEMT） materials and devices were grown and fabricated on semi-insulating 6H-SiC sub- strates. The two-dimensional electron gas （2DEG） mobility at room-temperature was 1795 cm^2/V-s. The charge carrier concentration of the substrate determined by capacitance-voltage （C-V） test was 7.3×10^15 cm^-3. The device with a gate width of I mm exhibits a maximum output power of 5.5 W at 8 GHz, which proves the semi-insulating property of the substrates indirectly.

Effect of high-temperature buffer thickness on quality of AlN epilayer grown on sapphire substrate by metalorganic chemical vapor deposition

The effect of an initially grown high-temperature A1N buffer （HT-A1N） layer＇s thickness on the quality of an A1N epilayer grown on sapphire substrate by metalorganic chemical vapor deposition （MOCVD） in a two-step growth process is investigated. The characteristics of A1N epilayers are analyzed by using triple-axis crystal X-ray diffraction （XRD） and atomic force microscopy （AFM）. It is shown that the crystal quality of the A1N epilayer is closely related to its correlation length. The correlation length is determined by the thickness of the initially grown HT-A1N buffer layer. We find that the optimal HT-A1N buffer thickness for obtaining a high-quality A1N epilayer grown on sapphire substrate is about 20 nm.

Rapid epitaxy of 2-inch and high-quality α-Ga_(2)O_(3) films by mist-CVD method

High thickness uniformity and large-scale films of α-Ga_(2)O_(3) are crucial factors for the development of power devices.In this work, a high-quality 2-inch α-Ga_(2)O_(3) epitaxial film on c-plane sapphire substrates was prepared by the mist-CVD method.The growth rate and phase control mechanisms were systematically investigated. The growth rate of the α-Ga_(2)O_(3) films was limited by the evaporation of the microdroplets containing gallium acetylacetonate. By adjusting the substrate position(z) from 80 to 50 mm, the growth rate was increased from 307 nm/h to 1.45 μm/h when the growth temperature was fixed at 520 °C.When the growth temperature exceeded 560 °C, ε-Ga_(2)O_(3) was observed to form at the edges of 2-inch sapphire substrate.Phase control was achieved by adjusting the growth temperature. When the growth temperature was 540 °C and the substrate position was 50 mm, the full-width at half maximum(FWHM) of the rocking curves for the(0006) and(10-14) planes were 0.023° and 1.17°. The screw and edge dislocations were 2.3 × 10~6 and 3.9 × 10~(10)cm~(-2), respectively. Furthermore, the bandgaps and optical transmittance of α-Ga_(2)O_(3) films grown under different conditions were characterized utilizing UV-visible and near-IR scanning spectra.

Progress in Space Material Researches

New progress in the post researches on space grown materials, the development of experiment facilities, and the experiment techniques for space materials researches were introduced. Besides the conventional materials, such as alloys, semiconductors, and optical crystals, new materials have also been prepared on the ground.

Transport mechanism of reverse surface leakage current in AlGaN/GaN high-electron mobility transistor with SiN passivation

The transport mechanism of reverse surface leakage current in the AlGaN/GaN high-electron mobility transistor（HEMT） becomes one of the most important reliability issues with the downscaling of feature size.In this paper,the research results show that the reverse surface leakage current in AlGaN/GaN HEMT with SiN passivation increases with the enhancement of temperature in the range from 298 K to 423 K.Three possible transport mechanisms are proposed and examined to explain the generation of reverse surface leakage current.By comparing the experimental data with the numerical transport models,it is found that neither Fowler-Nordheim tunneling nor Frenkel-Poole emission can describe the transport of reverse surface leakage current.However,good agreement is found between the experimental data and the two-dimensional variable range hopping（2D-VRH） model.Therefore,it is concluded that the reverse surface leakage current is dominated by the electron hopping through the surface states at the barrier layer.Moreover,the activation energy of surface leakage current is extracted,which is around 0.083 eV.Finally,the SiN passivated HEMT with a high Al composition and a thin AlGaN barrier layer is also studied.It is observed that 2D-VRH still dominates the reverse surface leakage current and the activation energy is around 0.10 eV,which demonstrates that the alteration of the AlGaN barrier layer does not affect the transport mechanism of reverse surface leakage current in this paper.

3D heterogeneous integration of wideband RF chips using silicon-based adapter board technology

An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapter board technology.Four layers of high-resistance silicon substrate stack packaging are implemented based on the wafer-level gold-gold bonding process.Each layer adopts though silicon via(TSV)technology to realize signal interconnection.A core monolithic integrated microwave chip(MMIC)is embedded in the silicon cavity,and the silicon-based filter is integrated with the high-resistance silicon substrate.The interconnect line,cavity and filter of the silicon-based adapter board are designed with AutoCAD,and HFSS is adopted for 3D electromagnetic field simulation.According to the measured results,the radio frequency(RF)of the mixing multi-function chip is 40-44 GHz and its intermediate frequency(IF)can cover the Ku band with a chip size of 10 mm×11 mm×1 mm.The multiplier multi-function chip operates at 16-20 GHz.The fundamental suppression is greater than 50 dB and the second harmonic suppression is better than 40 dB with a chip size of 8 mm×8 mm×1 mm.The cascaded fully assembled mixing component achieves a spur of better than-50 dBc and a gain of better than 15 dB.

Carrier transport characteristics of H-terminated diamond films prepared using molecular hydrogen and atomic hydrogen

The H-terminated diamond films, which exhibit high surface conductivity, have been used in high-frequency and high-power electronic devices. In this paper, the surface conductive channel on specimens from the same diamond film was obtained by hydrogen plasma treatment and by heating under a hydrogen atmosphere, respectively, and the surface carrier transport characteristics of both samples were compared and evaluated. The results show that the carrier mobility and carrier density of the sample treated by hydrogen plasma are 15 cm^2·V^（-1）·s^（-1） and greater than 5 × 1012 cm^（-2）, respectively, and that the carrier mobilities measured at five different areas are similar. Compared to the hydrogen-plasma-treated specimen, the thermally hydrogenated specimen exhibits a lower surface conductivity, a carrier density one order of magnitude lower, and a carrier mobility that varies from 2 to 33 cm^2·V^（-1）·s^（-1）. The activated hydrogen atoms restructure the diamond surface, remove the scratches, and passivate the surface states via the etching effect during the hydrogen plasma treatment process, which maintains a higher carrier density and a more stable carrier mobility.

DC Characteristics of Lattice-Matched InAlN/AlN/GaN High Electron Mobility Transistors

Lattice-matched InAlN/AlN/GaN high electron mobility transistors (HEMTs) grown on sapphire substrate by using low-pressure metallorganic chemical vapor deposition were prepared, and the comprehensive DC characteristics were implemented by Keithley 4200 Semiconductor Characterization System. The experimental results indicated that a maximum drain current over 400 mA/mm and a peak external transconductance of 215 mS/mm can be achieved in the initial HEMTs. However, after the devices endured a 10-h thermal aging in furnace under nitrogen condition at 300 ℃, the maximum reduction of saturation drain current and external transconductance at high gate-source voltage and drain-source voltage were 30% and 35%, respectively. Additionally, an increased drain-source leakage current was observed at three-terminal off-state. It was inferred that the degradation was mainly related to electron-trapping defects in the InAlN barrier layer.

Preparation of Amorphous LiZn Ferrites Hollow Microspheres by Self-reactive Quenching Technology

NaCl aqueous solution（15 wt%） was used as the quenching medium to prepare amorphous Lithium-Zinc ferrite hollow microspheres（LiZn FHMs） based on self-reactive quenching technology. Investigations by scanning electro microscope, X-ray diffraction, electron diffraction of transmission electron microscope, and differential scanning calorimetry prove that LiZn FHMs are susceptible to amorphization. It is indicated that NaCl aqueous solution（15 wt%） has ultra-fast quenching speed, and the growth rate of crystals on LiZn FHMs is so large that the formation and growth of the crystal nucleus are significantly restrained. This is the main reason for the formation of amorphous LiZn FHMs.

A New Solar Radio Spectrometer at 1.10-2.06 GHz and First Observational Results

An improved Solar Radio Spectrometer working at 1.10-2.06 GHz with much improved spectral and temporal resolution, has been accomplished by the National Astronomical Observatories and Hebei Semiconductor Research Institute,based on an old spectrometer at 1 2 GHz. The new spectrometer has a spectral resolution of 4 MHz and a temporal resolution of 5 ms, with an instantaneous detectable range from 0.02 to 10 times of the quiet Sun flux. It can measure both left and right circular polarization with an accuracy of 10% in degree of polarization. Some results of preliminary observations that could not be recorded by the old spectrometer at 1-2 GHz are presented.

Dependence of 1.54 μm Photoluminescence on Excess-Si Degrees of Er-Doped Si-Rich SiO_(2) Films Deposited by Magnetron Sputtering

Room-temperature 1.54-μm photoluminescence(PL)is observed from Er-doped Si-rich SiO_(2)(SiO_(2):Si:Er)films deposited by using the magnetron sputtering technique.To determine the optimum Si content in the SiO_(2):Si:Er films,the percentage area of the Si target in the composite SiO_(2)-Si-Er target was changed from 0,to 10%,20%and 30%.The percentage area of the Er target was fixed at 1%.It is found that the optimum annealing temperatures for Er3+luminescence intensities are 900°C for the SiO_(2):Er film and 900,800,and 700°C for the SiO_(2):Si:Er films containing 10%,20%and 30%excess-Si(percentage areas of Si target),respectively.The SiO_(2):Si:Er film containing 20%excess-Si and annealed at 800°C has the intensest PL.