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Investigation of the Influence of Annealing Temperature on the Morphology and Growth Kinetic of Ni3Sn4 in the Ni-Sn-Solder System 被引量:1
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作者 Mathias Wendt Andreas Plö&beta +3 位作者 l Andreas Weimar Marcus Zenger Klaus Dilger 《Journal of Materials Science and Chemical Engineering》 2016年第2期116-130,共15页
The reaction between high purity nickel (99.999%) and high purity tin (99.999%) was investigated in the temperature range of 232℃ - 330℃, at short periods of annealing (1 - 60 s). The reaction kinetic was studied us... The reaction between high purity nickel (99.999%) and high purity tin (99.999%) was investigated in the temperature range of 232℃ - 330℃, at short periods of annealing (1 - 60 s). The reaction kinetic was studied using cross-sectional scanning electron microscope (SEM) images. The intermetallic compound (IMC) growth was analyzed using the empirical power law and a time dependence in the range of 0.26 to 0.33 was found. The morphology of the IMC was investigated by SEM in the temperature range of 235℃ - 290℃, at annealing periods of 10 s, 30 s, and 60 s by selectively etching away the remaining elementary tin. The exposed IMC displays a change in morphology with increasing annealing temperature, demonstrating that the growth velocity of certain crystallographic orientations of the IMC is strongly influenced by the annealing temperature. Additionally, coarsening and crumbling of the IMC grains is observed, and will be discussed with respect to the responsible mechanisms. 展开更多
关键词 Lead-Free Solders Intermetallic Compound Formation Grain Growth COARSENING Solid Liquid Inter-Diffusion (SLID) Bonding
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