Si-doped Ge2Sb2Te5 films have been prepared by dc magnetron co-sputtering with Ge2Sb2Te5 and Si targets. The addition of Si in the Ge2Sb2Te5 film results in the increase of both crystallization temperature and phasetr...Si-doped Ge2Sb2Te5 films have been prepared by dc magnetron co-sputtering with Ge2Sb2Te5 and Si targets. The addition of Si in the Ge2Sb2Te5 film results in the increase of both crystallization temperature and phasetransition temperature from face-centred-cubic （fcc） phase to hexagonal （hex） phase. The resistivity of the Ge2Sb2Te5 film shows a significant increase with the Si doping. When doping 11.8 at.% of Si in the film, the resistivity after 460℃ annealing increases from 1 to 11 mΩ.cm and dynamic resistance increase from 64 to 99Ω compared to the undoped Ge2Sb2Te5 film. This is very helpful to writing current reduction of phase-change random access memory.展开更多
Electrical properties and phase structures of （Si＋N）-codoped Oe2Sb2Te5 （GST） for phase change memory are investigated to improve the memory performance. Compared to the films with N or Si dopants only in previous...Electrical properties and phase structures of （Si＋N）-codoped Oe2Sb2Te5 （GST） for phase change memory are investigated to improve the memory performance. Compared to the films with N or Si dopants only in previous reports, the （Si＋N）-doped GST has a remarkable improvement of crystalline resistivity of about 104mΩcm. The Fourier-transform infrared spectroscopy spectrum reveals the Si-N bonds formation in the film. X-ray diffraction patterns show that the grain size is reduced due to the crystallization inhibition of the amorphous GST by SiNx, which results in higher crystalline resistivity. This is very useful to reduce writing current for phase change memory applications.展开更多
文摘Si-doped Ge2Sb2Te5 films have been prepared by dc magnetron co-sputtering with Ge2Sb2Te5 and Si targets. The addition of Si in the Ge2Sb2Te5 film results in the increase of both crystallization temperature and phasetransition temperature from face-centred-cubic （fcc） phase to hexagonal （hex） phase. The resistivity of the Ge2Sb2Te5 film shows a significant increase with the Si doping. When doping 11.8 at.% of Si in the film, the resistivity after 460℃ annealing increases from 1 to 11 mΩ.cm and dynamic resistance increase from 64 to 99Ω compared to the undoped Ge2Sb2Te5 film. This is very helpful to writing current reduction of phase-change random access memory.
基金Supported by the National Natural Science Foundation of China under Nos 60206005, 60376017, and 60676007, the Shanghai Applied Materials Research and Development Foundation and Silicon Storage Technology, Inc.
文摘Electrical properties and phase structures of （Si＋N）-codoped Oe2Sb2Te5 （GST） for phase change memory are investigated to improve the memory performance. Compared to the films with N or Si dopants only in previous reports, the （Si＋N）-doped GST has a remarkable improvement of crystalline resistivity of about 104mΩcm. The Fourier-transform infrared spectroscopy spectrum reveals the Si-N bonds formation in the film. X-ray diffraction patterns show that the grain size is reduced due to the crystallization inhibition of the amorphous GST by SiNx, which results in higher crystalline resistivity. This is very useful to reduce writing current for phase change memory applications.
