The power consumption of a variable optical attenuator（VOA） array based on a silica planar lightwave circuit was investigated. The thermal field profile of the device was optimized using the finite-element analysis....The power consumption of a variable optical attenuator（VOA） array based on a silica planar lightwave circuit was investigated. The thermal field profile of the device was optimized using the finite-element analysis. The simulation results showed that the power consumption reduces as the depth of the heat-insulating grooves is deeper, the up-cladding is thinner,the down-cladding is thicker, and the width of the cladding ridge is narrower. The materials component and thickness of the electrodes were also optimized to guarantee the driving voltage under 5 V. The power consumption was successfully reduced to as low as 155 mW at an attenuation of 30 dB in the experiment.展开更多
The integrated photonic chip is a promising way to realize future quantum technology. Here we demonstrate a two-photon interference in the standard telecommunication band on a silica-on-silicon integrated photonic chi...The integrated photonic chip is a promising way to realize future quantum technology. Here we demonstrate a two-photon interference in the standard telecommunication band on a silica-on-silicon integrated photonic chip. Two identical photons in the 1.55 μm band, which are indistinguishable in spatial, frequency and polarization, are generated by type-I collinear spontaneous parametric down-conversion via bismuth borate. The silica-on-silicon integrated chip, which has an insertion loss less than 1 dB, is a Mach-Zehnder interferometer with a thermo-optic phase shifter. A high visibility of 100% in the classical interference and 99.2% in the two-photon interference is achieved, indicating that the two-photon interference with high interference visibility on the chip is attained successfully.展开更多
基金Supported by National Key R&D Program of China(2018YFA0306403)National Nature Science Foundation of China(61805232,61435013)K.C.Wong Education Foundation
基金Project supported by the National High Technology Research and Development Program of China(Grant No.2015AA016902)the National Nature Science Foundation of China(Grant Nos.61435013,61405188,and 61627820)
文摘The power consumption of a variable optical attenuator（VOA） array based on a silica planar lightwave circuit was investigated. The thermal field profile of the device was optimized using the finite-element analysis. The simulation results showed that the power consumption reduces as the depth of the heat-insulating grooves is deeper, the up-cladding is thinner,the down-cladding is thicker, and the width of the cladding ridge is narrower. The materials component and thickness of the electrodes were also optimized to guarantee the driving voltage under 5 V. The power consumption was successfully reduced to as low as 155 mW at an attenuation of 30 dB in the experiment.
基金Supported by the National Natural Science Foundation of China under Grant Nos 61627820,61575191 and 61275045the National Basic Research Program of China under Grant Nos 2016YFA0301200,2013CB632105
文摘The integrated photonic chip is a promising way to realize future quantum technology. Here we demonstrate a two-photon interference in the standard telecommunication band on a silica-on-silicon integrated photonic chip. Two identical photons in the 1.55 μm band, which are indistinguishable in spatial, frequency and polarization, are generated by type-I collinear spontaneous parametric down-conversion via bismuth borate. The silica-on-silicon integrated chip, which has an insertion loss less than 1 dB, is a Mach-Zehnder interferometer with a thermo-optic phase shifter. A high visibility of 100% in the classical interference and 99.2% in the two-photon interference is achieved, indicating that the two-photon interference with high interference visibility on the chip is attained successfully.
