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磁控溅射参数及基片材料对铜薄膜结合强度的影响 被引量:3
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作者 陈瑞芳 倪泽炎 +1 位作者 花银群 薛青 《热加工工艺》 CSCD 北大核心 2013年第24期66-69,72,共5页
采用不同的溅射工艺参数及基片材料制备了铜薄膜,用划痕法测试了薄膜结合强度,研究了溅射功率、溅射气压、溅射时间、基片温度及基片材料对铜薄膜结合强度的影响。结果表明,在功率85W,溅射气压1.5 Pa,时间30 min,基片温度150℃的条件下... 采用不同的溅射工艺参数及基片材料制备了铜薄膜,用划痕法测试了薄膜结合强度,研究了溅射功率、溅射气压、溅射时间、基片温度及基片材料对铜薄膜结合强度的影响。结果表明,在功率85W,溅射气压1.5 Pa,时间30 min,基片温度150℃的条件下,薄膜结合强度为26.9 N。与硅片相比,玻璃表面的铜薄膜具有更高的结合强度。 展开更多
关键词 结合强度 铜薄膜 直流磁控溅射
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Study of the substructure in nanometer copper thin films treated by laser shock processing
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作者 花银群 薛青 +3 位作者 刘海霞 叶云霞 陈瑞芳 倪泽炎 《Chinese Optics Letters》 SCIE EI CAS CSCD 2013年第3期35-37,共3页
We study nanometer copper thin films prepared by magnetron sputtering and treated with laser shock processing (LSP). We observe the formation of firstborn twin crystals and some complete twin crystals in the copper ... We study nanometer copper thin films prepared by magnetron sputtering and treated with laser shock processing (LSP). We observe the formation of firstborn twin crystals and some complete twin crystals in the copper thin films. After LSP, scanning electron microscope (SEM) images show obvious plastic deformation of the copper grain on the film surface, dramatically increased grain size, and the appearance of a large number of twin crystals. Moreover, the width of the crystals is a few dozen nanometers, and the cross angle is more than or close to 90°. Many vacancy defects appear during the sliding of atomic plane, which leads to a faulty structure; however, no obvious dislocation is observed. These substructures play a significant role in improving the mechanical performance of nanometer copper thin films. 展开更多
关键词 Crystal atomic structure Dislocations (crystals) Scanning electron microscopy Thin films
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