以共沉淀法制备了纳米级铋-钇铁柘榴石粉末,并压锭成块材进行微波测试,因钇铁柘榴石块材烧结温度>1400℃,无法顺利导入低温多层共烧陶瓷制程(LTCC),本研究以掺杂铋元素进入柘榴石晶体内的方式,使块材烧结温度大幅下降,同时不降低其...以共沉淀法制备了纳米级铋-钇铁柘榴石粉末,并压锭成块材进行微波测试,因钇铁柘榴石块材烧结温度>1400℃,无法顺利导入低温多层共烧陶瓷制程(LTCC),本研究以掺杂铋元素进入柘榴石晶体内的方式,使块材烧结温度大幅下降,同时不降低其在微波应用上的性质.实验结果显示,随着掺杂铋元素的增加,块材的烧结温度最大可降至850℃,而微波应用于滤波器的亚铁磁共振(Ferrimagnetic magnetic resonance)特性在测量后证实并未遭受破坏.展开更多
Study on increasing the roughness of the polymer substrate surface to enhance the adhesion with the copper layer in an inductively coupling plasma （ICP） process was carried out. The microstructure of the polymer sub...Study on increasing the roughness of the polymer substrate surface to enhance the adhesion with the copper layer in an inductively coupling plasma （ICP） process was carried out. The microstructure of the polymer substrate surfaces, which were exposed to different kinds of plasma treatment, was identified by scanning electron microscopy（SEM） analysis, peel strength of the copper coating and water surface contact angle. The adhesion of the substrate was largely enhanced by plasma treatment and the copper deposited coating reached a value of 7.68 kgf/m in verifying the adhesion of the copper coating with polymer material. The quality of the line/space 50/50 μm produced in the laboratory was examined by the pressure cooker test and proved to meet the requirement.展开更多
文摘以共沉淀法制备了纳米级铋-钇铁柘榴石粉末,并压锭成块材进行微波测试,因钇铁柘榴石块材烧结温度>1400℃,无法顺利导入低温多层共烧陶瓷制程(LTCC),本研究以掺杂铋元素进入柘榴石晶体内的方式,使块材烧结温度大幅下降,同时不降低其在微波应用上的性质.实验结果显示,随着掺杂铋元素的增加,块材的烧结温度最大可降至850℃,而微波应用于滤波器的亚铁磁共振(Ferrimagnetic magnetic resonance)特性在测量后证实并未遭受破坏.
文摘Study on increasing the roughness of the polymer substrate surface to enhance the adhesion with the copper layer in an inductively coupling plasma （ICP） process was carried out. The microstructure of the polymer substrate surfaces, which were exposed to different kinds of plasma treatment, was identified by scanning electron microscopy（SEM） analysis, peel strength of the copper coating and water surface contact angle. The adhesion of the substrate was largely enhanced by plasma treatment and the copper deposited coating reached a value of 7.68 kgf/m in verifying the adhesion of the copper coating with polymer material. The quality of the line/space 50/50 μm produced in the laboratory was examined by the pressure cooker test and proved to meet the requirement.
