比较了空气桥跨细栅和空气桥跨栅总线两种源连接结构的1 mm AlGaN/GaN HEMTs器件的特性,对两种结构的管芯进行了等效电路参数提取。测试了两种布局方式下的不同源场板结构器件的射频以及功率性能,比较分析表明,空气桥跨细栅的源连接方...比较了空气桥跨细栅和空气桥跨栅总线两种源连接结构的1 mm AlGaN/GaN HEMTs器件的特性,对两种结构的管芯进行了等效电路参数提取。测试了两种布局方式下的不同源场板结构器件的射频以及功率性能,比较分析表明,空气桥跨细栅的源连接方式由于有效地降低了栅漏电容以及栅源电容,比空气桥跨栅总线源连接的器件能取得更好的频率特性以及功率特性。展开更多
A power amplifier MIC with power combining based on AlGaN/GaN HEMTs was fabricated and measured. The amplifier consists of four 10 × 120μm transistors. A Wilkinson splitters and combining were used to divide and...A power amplifier MIC with power combining based on AlGaN/GaN HEMTs was fabricated and measured. The amplifier consists of four 10 × 120μm transistors. A Wilkinson splitters and combining were used to divide and combine the power. By biasing the amplifier at VDS = 40V, IDS = 0.9A, a maximum CW output power of 41.4dBm with a maximum power added efficiency (PAE) of 32.54% and a power combine efficiency of 69% was achieved at 5.4GHz.展开更多
文摘比较了空气桥跨细栅和空气桥跨栅总线两种源连接结构的1 mm AlGaN/GaN HEMTs器件的特性,对两种结构的管芯进行了等效电路参数提取。测试了两种布局方式下的不同源场板结构器件的射频以及功率性能,比较分析表明,空气桥跨细栅的源连接方式由于有效地降低了栅漏电容以及栅源电容,比空气桥跨栅总线源连接的器件能取得更好的频率特性以及功率特性。
文摘A power amplifier MIC with power combining based on AlGaN/GaN HEMTs was fabricated and measured. The amplifier consists of four 10 × 120μm transistors. A Wilkinson splitters and combining were used to divide and combine the power. By biasing the amplifier at VDS = 40V, IDS = 0.9A, a maximum CW output power of 41.4dBm with a maximum power added efficiency (PAE) of 32.54% and a power combine efficiency of 69% was achieved at 5.4GHz.