High-performance Al Ga N/Ga N high electron mobility transistors（HEMTs） grown on silicon substrates by metal–organic chemical-vapor deposition（MOCVD） with a selective non-planar n-type Ga N source/drain（S/D） re...High-performance Al Ga N/Ga N high electron mobility transistors（HEMTs） grown on silicon substrates by metal–organic chemical-vapor deposition（MOCVD） with a selective non-planar n-type Ga N source/drain（S/D） regrowth are reported. A device exhibited a non-alloyed Ohmic contact resistance of 0.209 Ω·mm and a comprehensive transconductance（gm） of 247 m S/mm. The current gain cutoff frequency f T and maximum oscillation frequency f MAX of 100-nm HEMT with S/D regrowth were measured to be 65 GHz and 69 GHz. Compared with those of the standard Ga N HEMT on silicon substrate, the fTand fMAXis 50% and 52% higher, respectively.展开更多
The fabrication and performance of 160-nm gate-length metamorphic AlInAs/GaInAs high electron mobility transistors （mHEMTs） grown on GaAs substrate by metal organic chemical vapour deposition （MOCVD） are reported....The fabrication and performance of 160-nm gate-length metamorphic AlInAs/GaInAs high electron mobility transistors （mHEMTs） grown on GaAs substrate by metal organic chemical vapour deposition （MOCVD） are reported. By using a novel combined optical and e-beam photolithography technology, submicron mHEMTs devices have been achieved. The devices exhibit good DC and RF performance. The maximum current density was 817 mA/mm and the maximum transconductance was 828 mS/mm. The non-alloyed Ohmic contact resistance Rc was as low as 0.02 Ω- ram. The unity current gain cut-off frequency （fT） and the maximum oscillation frequency （fmax） were 146 GHz and 189 GHz, respectively. This device has the highest fT yet reported for a 160-nm gate-length HEMTs grown by MOCVD. The output conductance is 28.9 mS/mm, which results in a large voltage gain of 28.6, Also, an input capacitance to gate-drain feedback capacitance ratio, Cgs/Cgd, of 4.3 is obtained in the device.展开更多
High-performance low-leakage-current A1GaN/GaN high electron mobility transistors （HEMTs） on silicon （111） sub- strates grown by metal organic chemical vapor deposition （MOCVD） with a novel partially Magnesium ...High-performance low-leakage-current A1GaN/GaN high electron mobility transistors （HEMTs） on silicon （111） sub- strates grown by metal organic chemical vapor deposition （MOCVD） with a novel partially Magnesium （Mg）-doped GaN buffer scheme have been fabricated successfully. The growth and DC results were compared between Mg-doped GaN buffer layer and a unintentionally onμe. A 1μ m gate-length transistor with Mg-doped buffer layer exhibited an OFF-state drain leakage current of 8.3 × 10-8 A/mm, to our best knowledge, which is the lowest value reported for MOCVD-grown A1GaN/GaN HEMTs on Si featuring the same dimension and structure. The RF characteristics of 0.25-μ m gate length T-shaped gate HEMTs were also investigated.展开更多
In this work, a hetero-epitaxial Al0.49In0.51As/Ga0.47In0.53 As metamorphic high electron mobility transistor(mHEMT) grown by metal–organic chemical vapor deposition(MOCVD) on p-type silicon substrate has been succes...In this work, a hetero-epitaxial Al0.49In0.51As/Ga0.47In0.53 As metamorphic high electron mobility transistor(mHEMT) grown by metal–organic chemical vapor deposition(MOCVD) on p-type silicon substrate has been successfully demonstrated. A novel AlGaAs/Al As period multiple quantum well(MQW) composite buffer scheme is developed to effectively tune the leakage current from the buffer layer. The quantized room-temperature Hall mobility of the twodimensional electron gas(2DEG) is larger than 7800 cm2/V·s, with an average sheet carrier density of 4.6×1012cm-2.Two-stage electron beam(EB) lithography technology by a JBX-6300 e-beam lithography system is developed to realize a 0.13-μm m HEMT device on Si substrate. A maximum transconductance Gm of up to 854 mS/mm is achieved, and is comparable to that of m HEMT technology on Ga As substrate with the same dimension. The fTand fmax are 135 GHz and120 GHz, respectively.展开更多
AlGaN/GaN high electron mobility transistors(HEMTs)are grown on 2-inch Si(111)substrates by MOCVD.The stacked AlGaN/AlN interlayer with different AlGaN thickness and indium surfactant doped is designed and optimized t...AlGaN/GaN high electron mobility transistors(HEMTs)are grown on 2-inch Si(111)substrates by MOCVD.The stacked AlGaN/AlN interlayer with different AlGaN thickness and indium surfactant doped is designed and optimized to relieve the tensile stress during GaN epitaxial growth.The top 1.0μm GaN buffer layer grown on the optimized AlGaN/AlN interlayer shows a crack-free and shining surface.The XRD results show that GaN(002)FWHM is 480arcsec and GaN(102)FWHM is 900arcsec.The AGaN/GaN HEMTs with optimized and nonoptimized AlGaN/AlN interlayer are grown and processed for comparison and the dc and rf characteristics are characterized.For the dc characteristics of the device with optimized AlGaN/AlN interlayer,maximum drain current density I_(dss)of 737mA/mm,peak transconductance G_(m)of 185mS/mm,drain leakage current density Ids of 1.7μA/mm,gate leakage current density I_(gs)of 24.8μA/mm and off-state breakdown voltage VBR of 67V are achieved with L_(g)/W_(g)/L_(g)/L_(g)=1/10/1/1μm.For the small signal rf characteristics of the device with optimized AlGaN/AlN interlayer,current gain cutoff frequency fT of 8.3 GHz and power gain cutoff frequency fmax of 19.9GHz are achieved with L_(g)/W_(g)/L_(g)/L_(g)=1/100/1/1μm.Furthermore,the best rf performance with fT of 14.5 GHz and fmax of 37.3 GHz is achieved with a reduced gate length of 0.7μm.展开更多
A combination of self-aligned fluoride-based plasma treatment and post-gate rapid thermal annealing was developed to fabricate a novel 120-nm T-shaped gate normally-off metamorphic Al0.49In0.51As/Ga0.47In0.53 As HEMT ...A combination of self-aligned fluoride-based plasma treatment and post-gate rapid thermal annealing was developed to fabricate a novel 120-nm T-shaped gate normally-off metamorphic Al0.49In0.51As/Ga0.47In0.53 As HEMT device on a Si substrate grown by metal-organic chemical vapor deposition（MOCVD）. A shift of the threshold voltage, from-0.42 V to 0.11 V was obtained and the shift can be effectively adjusted by the process parameter of CF4 plasma treatment. Furthermore, a side benefit of reducing the leakage current of the device up to two orders of magnitude was also observed.E-mode transistors with 120 nm gate length own fTup to 160 GHz and fmax of 140 GHz. These characteristics imply the potential of the fluoride-based plasma treatment technology for the fabrication of monolithic enhancement/depletion-mode mHEMTs, which also encourage the massive production with this low-cost technology.展开更多
基金Project supported by the Young Scientists Fund of the National Natural Science Foundation of China(Grant No.61401373)the Fundamental Research Funds for Central Universities,China(Grant No.XDJK2013B004)the Research Fund for the Doctoral Program of Southwest University,China(Grant No.SWU111030)
文摘High-performance Al Ga N/Ga N high electron mobility transistors（HEMTs） grown on silicon substrates by metal–organic chemical-vapor deposition（MOCVD） with a selective non-planar n-type Ga N source/drain（S/D） regrowth are reported. A device exhibited a non-alloyed Ohmic contact resistance of 0.209 Ω·mm and a comprehensive transconductance（gm） of 247 m S/mm. The current gain cutoff frequency f T and maximum oscillation frequency f MAX of 100-nm HEMT with S/D regrowth were measured to be 65 GHz and 69 GHz. Compared with those of the standard Ga N HEMT on silicon substrate, the fTand fMAXis 50% and 52% higher, respectively.
基金Project supported by CERG Grant (615506) from the Research Grants Council of Hong Kong Special Administrative Region of China and Intel CorporationScience and Technology Plan of the Education Bureau of Guangxi Zhuang Autonomous Region of China (Grant No. 200911MS93)
文摘The fabrication and performance of 160-nm gate-length metamorphic AlInAs/GaInAs high electron mobility transistors （mHEMTs） grown on GaAs substrate by metal organic chemical vapour deposition （MOCVD） are reported. By using a novel combined optical and e-beam photolithography technology, submicron mHEMTs devices have been achieved. The devices exhibit good DC and RF performance. The maximum current density was 817 mA/mm and the maximum transconductance was 828 mS/mm. The non-alloyed Ohmic contact resistance Rc was as low as 0.02 Ω- ram. The unity current gain cut-off frequency （fT） and the maximum oscillation frequency （fmax） were 146 GHz and 189 GHz, respectively. This device has the highest fT yet reported for a 160-nm gate-length HEMTs grown by MOCVD. The output conductance is 28.9 mS/mm, which results in a large voltage gain of 28.6, Also, an input capacitance to gate-drain feedback capacitance ratio, Cgs/Cgd, of 4.3 is obtained in the device.
文摘High-performance low-leakage-current A1GaN/GaN high electron mobility transistors （HEMTs） on silicon （111） sub- strates grown by metal organic chemical vapor deposition （MOCVD） with a novel partially Magnesium （Mg）-doped GaN buffer scheme have been fabricated successfully. The growth and DC results were compared between Mg-doped GaN buffer layer and a unintentionally onμe. A 1μ m gate-length transistor with Mg-doped buffer layer exhibited an OFF-state drain leakage current of 8.3 × 10-8 A/mm, to our best knowledge, which is the lowest value reported for MOCVD-grown A1GaN/GaN HEMTs on Si featuring the same dimension and structure. The RF characteristics of 0.25-μ m gate length T-shaped gate HEMTs were also investigated.
基金supported by the Young Scientists Fund of the National Natural Science Foundation of China(Grant No.61401373)the Fundamental Research Funds for Central University,China(Grant Nos.XDJK2013B004 and 2362014XK13)the Chongqing Natural Science Foundation,China(Grant No.cstc2014jcyj A40038)
文摘In this work, a hetero-epitaxial Al0.49In0.51As/Ga0.47In0.53 As metamorphic high electron mobility transistor(mHEMT) grown by metal–organic chemical vapor deposition(MOCVD) on p-type silicon substrate has been successfully demonstrated. A novel AlGaAs/Al As period multiple quantum well(MQW) composite buffer scheme is developed to effectively tune the leakage current from the buffer layer. The quantized room-temperature Hall mobility of the twodimensional electron gas(2DEG) is larger than 7800 cm2/V·s, with an average sheet carrier density of 4.6×1012cm-2.Two-stage electron beam(EB) lithography technology by a JBX-6300 e-beam lithography system is developed to realize a 0.13-μm m HEMT device on Si substrate. A maximum transconductance Gm of up to 854 mS/mm is achieved, and is comparable to that of m HEMT technology on Ga As substrate with the same dimension. The fTand fmax are 135 GHz and120 GHz, respectively.
文摘AlGaN/GaN high electron mobility transistors(HEMTs)are grown on 2-inch Si(111)substrates by MOCVD.The stacked AlGaN/AlN interlayer with different AlGaN thickness and indium surfactant doped is designed and optimized to relieve the tensile stress during GaN epitaxial growth.The top 1.0μm GaN buffer layer grown on the optimized AlGaN/AlN interlayer shows a crack-free and shining surface.The XRD results show that GaN(002)FWHM is 480arcsec and GaN(102)FWHM is 900arcsec.The AGaN/GaN HEMTs with optimized and nonoptimized AlGaN/AlN interlayer are grown and processed for comparison and the dc and rf characteristics are characterized.For the dc characteristics of the device with optimized AlGaN/AlN interlayer,maximum drain current density I_(dss)of 737mA/mm,peak transconductance G_(m)of 185mS/mm,drain leakage current density Ids of 1.7μA/mm,gate leakage current density I_(gs)of 24.8μA/mm and off-state breakdown voltage VBR of 67V are achieved with L_(g)/W_(g)/L_(g)/L_(g)=1/10/1/1μm.For the small signal rf characteristics of the device with optimized AlGaN/AlN interlayer,current gain cutoff frequency fT of 8.3 GHz and power gain cutoff frequency fmax of 19.9GHz are achieved with L_(g)/W_(g)/L_(g)/L_(g)=1/100/1/1μm.Furthermore,the best rf performance with fT of 14.5 GHz and fmax of 37.3 GHz is achieved with a reduced gate length of 0.7μm.
基金Project supported by the Young Scientists Fund of the National Natural Science Foundation,China(Grant No.61401373)the Fundamental Research Funds for Central University,China(Grant No.XDJK2013B004 and 2362014XK13)the Research Fund for the Doctoral Program of Southwest University,China(Grant No.SWU111030)
文摘A combination of self-aligned fluoride-based plasma treatment and post-gate rapid thermal annealing was developed to fabricate a novel 120-nm T-shaped gate normally-off metamorphic Al0.49In0.51As/Ga0.47In0.53 As HEMT device on a Si substrate grown by metal-organic chemical vapor deposition（MOCVD）. A shift of the threshold voltage, from-0.42 V to 0.11 V was obtained and the shift can be effectively adjusted by the process parameter of CF4 plasma treatment. Furthermore, a side benefit of reducing the leakage current of the device up to two orders of magnitude was also observed.E-mode transistors with 120 nm gate length own fTup to 160 GHz and fmax of 140 GHz. These characteristics imply the potential of the fluoride-based plasma treatment technology for the fabrication of monolithic enhancement/depletion-mode mHEMTs, which also encourage the massive production with this low-cost technology.
