The Pt/Si/Ta/Ti multilayer metal contacts on 4H-Si C are annealed in Ar atmosphere at 600°C-1100°C by a rapid thermal processor（RTP）. The long-term thermal stability is evaluated by aging the annealed cont...The Pt/Si/Ta/Ti multilayer metal contacts on 4H-Si C are annealed in Ar atmosphere at 600°C-1100°C by a rapid thermal processor（RTP）. The long-term thermal stability is evaluated by aging the annealed contact at 600°C in air. The contact＇s properties are determined by current-voltage measurement, and the specific contact resistance is calculated based on the transmission line model（TLM）. Transmission electron microscope（TEM） and energy-dispersive x-ray spectrometry（EDX） are used to characterize the interface morphology, thickness, and composition. The results reveal that a higher annealing temperature is favorable for the formation of an Ohmic contact with a lower specific contact resistance, and causes the rapid degradation of the Ohmic contact in the aging process.展开更多
基金Project supported by the Special Prophase Project on the National Basic Research Program of China(Grant No.2012CB326402)the National Natural Science Found of China(Grant No.61404085)+1 种基金the Innovation Program of Shanghai Municipal Education Commission,China(Grant No.13ZZ108)the Shanghai Science and Technology Commission,China(Grant No.13520502700)
文摘The Pt/Si/Ta/Ti multilayer metal contacts on 4H-Si C are annealed in Ar atmosphere at 600°C-1100°C by a rapid thermal processor（RTP）. The long-term thermal stability is evaluated by aging the annealed contact at 600°C in air. The contact＇s properties are determined by current-voltage measurement, and the specific contact resistance is calculated based on the transmission line model（TLM）. Transmission electron microscope（TEM） and energy-dispersive x-ray spectrometry（EDX） are used to characterize the interface morphology, thickness, and composition. The results reveal that a higher annealing temperature is favorable for the formation of an Ohmic contact with a lower specific contact resistance, and causes the rapid degradation of the Ohmic contact in the aging process.
