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Reliability Analysis of Sn-Bi Plating Chips
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作者 帅迪 金星 +1 位作者 郭士达 柳光洙 《上海交通大学学报》 EI CAS CSCD 北大核心 2007年第S2期154-156,共3页
The character of Sn-Bi plating chips,such as the effect of whisker preventing, solder ability,temperature cycle(T/C) test and thermal humidity bias(THB) test result was introduced.The research result shows that the Sn... The character of Sn-Bi plating chips,such as the effect of whisker preventing, solder ability,temperature cycle(T/C) test and thermal humidity bias(THB) test result was introduced.The research result shows that the Sn-Bi plating chips have good effect of prevent whisker from growing,these chips can pass the T/C test and THB test. 展开更多
关键词 SN-BI WHISKER solder ability thermal humidity bias(THB)
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