The evaluation of thermal resistance constitution for packaged A1GaN/GaN high electron mobility transistor （HEMT） by structure function method is proposed in this paper. The evaluation is based on the transient heat...The evaluation of thermal resistance constitution for packaged A1GaN/GaN high electron mobility transistor （HEMT） by structure function method is proposed in this paper. The evaluation is based on the transient heating measurement of the A1GaN/GaN HEMT by pulsed electrical temperature sensitive parameter method. The extracted chip-level and package-level thermal resistances of the packaged multi-finger A1GaN/GaN HEMT with 400μm SiC substrate are 22.5 K/W and 7.2 K/W respectively, which provides a non-invasive method to evaluate the chip-level thermal resistance of packaged A1GaN/GaN HEMTs. It is also experimentally proved that the extraction of the chip- level thermal resistance by this proposed method is not influenced by package form of the tested device and temperature boundary condition of measurement stage.展开更多
The temperature in the active region of semiconductor modules can be measured by a vacuum system method.The test device is positioned on a vacuum test platform and heated in two ways,from the chip and from the case,to...The temperature in the active region of semiconductor modules can be measured by a vacuum system method.The test device is positioned on a vacuum test platform and heated in two ways,from the chip and from the case,to identify the required heat to establish stable temperature gradients for the two processes,respectively.A complementary relationship between the temperatures under the two heating methods is found.By injecting the total heat into the device,the resulting uniform temperature can be derived from the temperature curves of the chip and case.It is demonstrated that the temperature obtained from this vacuum system method is equivalent to the normal operating temperature of the device in the atmosphere.Further comparison of our result with that of the electrical method also shows good agreement.展开更多
We present the high-temperature characteristics of Ti/Al/Ni/Au（15 nm/220 nm/40 nm/50 nm） multiplayer contacts to n-type GaN （Nd = 3.7 × 10^17 cm^-3, Nd = 3.0 × 10^18 cm^-3）. The contact resistivity incre...We present the high-temperature characteristics of Ti/Al/Ni/Au（15 nm/220 nm/40 nm/50 nm） multiplayer contacts to n-type GaN （Nd = 3.7 × 10^17 cm^-3, Nd = 3.0 × 10^18 cm^-3）. The contact resistivity increases with the measurement temperature. Furthermore, the increasing tendency is related to doping concentration. The higher the doped, the slower the contact resistivity with decreasing measurement temperature. Ti/Al/Ni/Au ohmic contact to heavy doping n-GaN takes on better high temperature reliability. According to the analyses of XRD and AES for the n-GaN/Ti/Al/Ni/Au, the Au atoms permeate through the Ni layer which is not thick enough into the AI layer even the Ti layer.展开更多
Channel temperature determinations of A1GaN/GaN high electron mobility transistors （HEMTs） by high spectral resolution microRaman spectroscopy are proposed. The temperature dependence of the E2 phonon fre quency of ...Channel temperature determinations of A1GaN/GaN high electron mobility transistors （HEMTs） by high spectral resolution microRaman spectroscopy are proposed. The temperature dependence of the E2 phonon fre quency of GaN material is calibrated by using a JYT64000 microRaman system. By using the Lorentz fitting method, the measurement uncertainty for the Raman phonon frequency of 40.035 cm1 is achieved, correspond ing to a temperature accuracy of 43.2 ~C for GaN material, which is the highest temperature resolution in the published works. The thermal resistance of the tested A1GaN/GaN HEMT sample is 22.8 °C/W, which is in rea sonably good agreement with a three dimensional heat conduction simulation. The difference among the channel temperatures obtained by microRaman spectroscopy, the pulsed electrical method and the infrared image method are also investigated quantificationally.展开更多
基金supported by the Natural Science Foundation of Beijing,China (Grant No. 4092005)the National High Technology Research and Development Program of China (Grant No. 2009AA032704)the Specialized Research Fund for the Doctoral Program of Higher Education of China (Grant No. 20091103110006)
文摘The evaluation of thermal resistance constitution for packaged A1GaN/GaN high electron mobility transistor （HEMT） by structure function method is proposed in this paper. The evaluation is based on the transient heating measurement of the A1GaN/GaN HEMT by pulsed electrical temperature sensitive parameter method. The extracted chip-level and package-level thermal resistances of the packaged multi-finger A1GaN/GaN HEMT with 400μm SiC substrate are 22.5 K/W and 7.2 K/W respectively, which provides a non-invasive method to evaluate the chip-level thermal resistance of packaged A1GaN/GaN HEMTs. It is also experimentally proved that the extraction of the chip- level thermal resistance by this proposed method is not influenced by package form of the tested device and temperature boundary condition of measurement stage.
基金Supported by the Beijing Municipal Natural Science Fund,under Grant No 4092005the Research Fund for Doctoral Program of Ministry of Education of China under Grant No 20091103110006.
文摘The temperature in the active region of semiconductor modules can be measured by a vacuum system method.The test device is positioned on a vacuum test platform and heated in two ways,from the chip and from the case,to identify the required heat to establish stable temperature gradients for the two processes,respectively.A complementary relationship between the temperatures under the two heating methods is found.By injecting the total heat into the device,the resulting uniform temperature can be derived from the temperature curves of the chip and case.It is demonstrated that the temperature obtained from this vacuum system method is equivalent to the normal operating temperature of the device in the atmosphere.Further comparison of our result with that of the electrical method also shows good agreement.
文摘We present the high-temperature characteristics of Ti/Al/Ni/Au（15 nm/220 nm/40 nm/50 nm） multiplayer contacts to n-type GaN （Nd = 3.7 × 10^17 cm^-3, Nd = 3.0 × 10^18 cm^-3）. The contact resistivity increases with the measurement temperature. Furthermore, the increasing tendency is related to doping concentration. The higher the doped, the slower the contact resistivity with decreasing measurement temperature. Ti/Al/Ni/Au ohmic contact to heavy doping n-GaN takes on better high temperature reliability. According to the analyses of XRD and AES for the n-GaN/Ti/Al/Ni/Au, the Au atoms permeate through the Ni layer which is not thick enough into the AI layer even the Ti layer.
基金Project supported by the Beijing Municipal Nature Science Fund,China(No.4092005)the High-Tech Research and Development Program of China(No.2009AA32704)the Research Fund for Doctoral Program of Ministry of Education,China(No.20091103110006)
文摘Channel temperature determinations of A1GaN/GaN high electron mobility transistors （HEMTs） by high spectral resolution microRaman spectroscopy are proposed. The temperature dependence of the E2 phonon fre quency of GaN material is calibrated by using a JYT64000 microRaman system. By using the Lorentz fitting method, the measurement uncertainty for the Raman phonon frequency of 40.035 cm1 is achieved, correspond ing to a temperature accuracy of 43.2 ~C for GaN material, which is the highest temperature resolution in the published works. The thermal resistance of the tested A1GaN/GaN HEMT sample is 22.8 °C/W, which is in rea sonably good agreement with a three dimensional heat conduction simulation. The difference among the channel temperatures obtained by microRaman spectroscopy, the pulsed electrical method and the infrared image method are also investigated quantificationally.
