Hot deformation behavior of novel imitation-gold copper alloy

The hot deformation behavior of a novel imitation-gold copper alloy was investigated with Gleeble-1500 thermo-mechanical simulator in the temperature range of 650-770 °C and strain rate range of 0.001-1.0 s-1. The hot deformation constitutive equation was established and the thermal activation energy was obtained to be 249.60 kJ/mol. The processing map at a strain of 1.2 was developed. And there are two optimal regions in processing map, namely 650-680 °C, 0.001-0.01 s-1 and 740-770 °C, 0.01-0.1 s-1. Optical microscopy was employed to investigate the microstructure evolution of the alloy in the process of deformation. Recrystallized grains and twin crystals were found in microstructures of the hot deformed alloy.

抗变色仿金稀土铜合金的耐蚀行为

设计并制备一种新型的抗变色仿金稀土铜合金。采用金相组织分析、中性盐雾试验、质量损失法、电化学阻抗谱和扫描电镜等手段对比研究所设计合金与现有造币用H72-1-1合金的组织结构、抗变色性能和耐蚀性能。结果表明:所设计合金退火组织细小、均匀,在3.5%NaCl溶液中保持不变色的时间较H72-1-1合金的延长了25%。在3.5%NaCl溶液中浸泡腐蚀过程中,所设计合金形成了一层均匀致密、完整的腐蚀产物膜,减缓了腐蚀的进程,其耐腐蚀性能优于H72-1-1合金的,腐蚀速率为10.3μm/a;所设计合金电荷转移电阻Rct、Warburg扩散阻抗ZW与H72-1-1合金的相比都有大幅度的提高,腐蚀过程阻力增加。