The electronic product has gravitated towards component miniaturization and integration, employment of lead-free materials, and low-temperature soldering processes. Noble-metal aerogels have drawn increasing attention...The electronic product has gravitated towards component miniaturization and integration, employment of lead-free materials, and low-temperature soldering processes. Noble-metal aerogels have drawn increasing attention for high conduction and low density. However,the noble metal aerogels with outstanding solderability were rarely studied. This work has successfully synthesized an aerogel derived from silver nanowires(AgNWs) using a liquid phase reduction method. It is found that the noble metal aerogels can be made into diverse aerogel preformed soldering sheets. The influence of bonding temperature(150-300 ℃), time(2-20 min), and pressure(5-20 MPa) on the joint strength of the AgNWs aerogel affixed to electroless nickel/silver copper plates were investigated. Additionally, the AgNWs aerogel displays almost the same shear strength for substrates of various sizes. In a word, this study presents a flux-free, high-strength, and adaptable soldering structural material.展开更多
SiC MOSFET器件的集成化、高频化和高效化需求,对功率模块封装形式和工艺提出了更高的要求。本文中总结了近年来封装形式的结构优化和技术创新,包括键合式功率模块的金属键合线长度、宽度和并联数量对寄生电感的影响,直接覆铜(DBC)的陶...SiC MOSFET器件的集成化、高频化和高效化需求,对功率模块封装形式和工艺提出了更高的要求。本文中总结了近年来封装形式的结构优化和技术创新,包括键合式功率模块的金属键合线长度、宽度和并联数量对寄生电感的影响,直接覆铜(DBC)的陶瓷基板中陶瓷层的面积和高度对寄生电容的影响,以及采用叠层换流技术优化寄生参数等成果;综述了双面散热结构的缓冲层厚度和形状对散热指标和应力与形变的影响;汇总了功率模块常见失效机理和解决措施,为模块的安全使用提供参考。最后探讨了先进烧结银技术的要求和关键问题,并展望了烧结封装技术和材料的发展方向。展开更多
基金the National Natural Science Foundation of China(Grant No.52075125,No.52105331)the Shenzhen Science and Technology Innovation Committee(Grant No.JCYJ20210324124203009,No.JSGG20201102154600003,No.GXWD20220818163456002)+1 种基金Special Fund for Science and Technology Innovation Strategy of Guangdong Province(Grant No.pdjh2022b0570)Sustainedly Supported Fundation by National Key Laboratory of Science and Technology on Space Microwave under Grant HTKJ2022KL504011,and NIO University Programme(NIO UP).
文摘The electronic product has gravitated towards component miniaturization and integration, employment of lead-free materials, and low-temperature soldering processes. Noble-metal aerogels have drawn increasing attention for high conduction and low density. However,the noble metal aerogels with outstanding solderability were rarely studied. This work has successfully synthesized an aerogel derived from silver nanowires(AgNWs) using a liquid phase reduction method. It is found that the noble metal aerogels can be made into diverse aerogel preformed soldering sheets. The influence of bonding temperature(150-300 ℃), time(2-20 min), and pressure(5-20 MPa) on the joint strength of the AgNWs aerogel affixed to electroless nickel/silver copper plates were investigated. Additionally, the AgNWs aerogel displays almost the same shear strength for substrates of various sizes. In a word, this study presents a flux-free, high-strength, and adaptable soldering structural material.