A highly sensitive sensor with piezoresistive nanocomposite material assembled in a flexible composite film is designed and tested for hydrodynamic sensing. Within the device, two nanocomposite films with micrometer s...A highly sensitive sensor with piezoresistive nanocomposite material assembled in a flexible composite film is designed and tested for hydrodynamic sensing. Within the device, two nanocomposite films with micrometer scale modified small bumps on the surface are arranged together face-to-face by the interlocking mechanism. These structures are verified to have full-scale piezoresistive high sensitivities which are very appropriate for underwater sensing. Obvious output signals can be observed from the device subjected to the hydroacoustic dipole （vibrating sphere） with exciting frequency from 10 Hz to 40 Hz. A spectral peak can be seen in the Fourier analysis of the output signal at the corresponding frequency.展开更多
Flexible arrays based on the flexible connection of double layers are demonstrated.Flexible sensor arrays are highly desired for many applications.Conventional flexible electronics are implemented by directly fabricat...Flexible arrays based on the flexible connection of double layers are demonstrated.Flexible sensor arrays are highly desired for many applications.Conventional flexible electronics are implemented by directly fabricating them on organic flexible substrates such as polyimide or polyethylene terephthalate,or forming on rigid substrates and then transferring them onto elastomeric substrates.For the first time,a novel process method based on trench refilling with polydimethylsiloxane to make flexible arrays is proposed.In this method,the sensors are directly fabricated on islands of the final bulk silicon.The performance of the sensor will not to be effected by bending and stretching operations.A one-dimensional flexible array shows good flexibility.Since the flexibility process is the last fabrication step,this method is compatible with many micro-electro-mechanical system fabrication technologies and has good yield.展开更多
Wafer-scale flexible surface acoustic wave(SAW)devices based on AlN/silicon structure are demonstrated.The final fabricated devices with a 50μm-thickness silicon wafer exhibit good flexibility with a bending curvatur...Wafer-scale flexible surface acoustic wave(SAW)devices based on AlN/silicon structure are demonstrated.The final fabricated devices with a 50μm-thickness silicon wafer exhibit good flexibility with a bending curvature radius of 8 mm.Measurements under free and bending conditions are carried out,showing that the central frequency shifts little as the curvature changes.SAW devices with central frequency about 191.9 MHz and Q-factor up to 600 are obtained.The flexible technology proposed is directly applied to the wafer silicon substrate in the last step,providing the potential of high performance flexible wafer-scale devices by direct integration with mature CMOS and MEMS technology.展开更多
基金Supported by the National Natural Science Foundation under Grant No 61434001 and 61574083the National Basic Research Program of China under Grant No 2015CB352100+1 种基金the National Key Project of Science and Technology under Grant No2011ZX02403-002the Special Fund for Agroscientic Research in the Public Interest of China under Grant No 201303107
文摘A highly sensitive sensor with piezoresistive nanocomposite material assembled in a flexible composite film is designed and tested for hydrodynamic sensing. Within the device, two nanocomposite films with micrometer scale modified small bumps on the surface are arranged together face-to-face by the interlocking mechanism. These structures are verified to have full-scale piezoresistive high sensitivities which are very appropriate for underwater sensing. Obvious output signals can be observed from the device subjected to the hydroacoustic dipole （vibrating sphere） with exciting frequency from 10 Hz to 40 Hz. A spectral peak can be seen in the Fourier analysis of the output signal at the corresponding frequency.
基金Supported by the National Natural Science Foundation of China(61025021,60936002,and 61020106006)the National Key Project of Science and Technology(2011ZX02403-002).
文摘Flexible arrays based on the flexible connection of double layers are demonstrated.Flexible sensor arrays are highly desired for many applications.Conventional flexible electronics are implemented by directly fabricating them on organic flexible substrates such as polyimide or polyethylene terephthalate,or forming on rigid substrates and then transferring them onto elastomeric substrates.For the first time,a novel process method based on trench refilling with polydimethylsiloxane to make flexible arrays is proposed.In this method,the sensors are directly fabricated on islands of the final bulk silicon.The performance of the sensor will not to be effected by bending and stretching operations.A one-dimensional flexible array shows good flexibility.Since the flexibility process is the last fabrication step,this method is compatible with many micro-electro-mechanical system fabrication technologies and has good yield.
基金Supported by the National Natural Science Foundation of China under Grant Nos 61025021,60936002,and 61020106006the National Key Project of Science and Technology(2011ZX02403-002).
文摘Wafer-scale flexible surface acoustic wave(SAW)devices based on AlN/silicon structure are demonstrated.The final fabricated devices with a 50μm-thickness silicon wafer exhibit good flexibility with a bending curvature radius of 8 mm.Measurements under free and bending conditions are carried out,showing that the central frequency shifts little as the curvature changes.SAW devices with central frequency about 191.9 MHz and Q-factor up to 600 are obtained.The flexible technology proposed is directly applied to the wafer silicon substrate in the last step,providing the potential of high performance flexible wafer-scale devices by direct integration with mature CMOS and MEMS technology.
