真空度对TiB_2/Al复合材料摩擦行为的影响(英文)

在不同真空度条件下(0.01、0.03、0.05、0.07和0.1MPa),采用销盘式摩擦磨损试验机研究气压对TiB2/Al复合材料的摩擦学行为的影响。结果表明:随着气压的增加,摩擦系数呈现下降的趋势,而磨损率变化不大。能谱分析表明,随着真空度的升高,磨损表面的Fe含量逐渐下降,与摩擦系数的下降趋势保持一致。

石墨增强体对SiC/Gr/Al复合材料干摩擦磨损性能的影响(英文)

采用挤压铸造技术制备不同粒径石墨颗粒增强的40%SiC/5%Gr/Al复合材料,研究了石墨颗粒对摩擦系数和磨损率的影响。结果表明,随着石墨的加入,复合材料的摩擦系数降低,磨损抗力提高170-340倍。另外,石墨颗粒粒径的增加也导致磨损抗力的提高,这是由于在干摩擦的过程中形成由铁的氧化物、石墨及SiC等组成的具有润滑性质的薄膜。

碳纤维增强镁基复合材料表面化学镀镍Ni-P合金层

用碱式碳酸镍作为化学镀液主盐,在T300碳纤维增强AZ91复合材料表面化学镀Ni-P合金层.采用SEM扫描电镜、EDS能谱仪和X射线衍射仪研究镀层的成分和结构.结果表明,经过化学镀Ni-P的复合材料表面有大小均匀连续的胞状凸起,镀层均匀、致密没有缺陷,主要成分是Ni和P,其中Ni为非晶态结构,P含量为8.5%,镀层属于耐腐蚀性能较好的中等磷含量镀层.动电位极化曲线测试表明,化学镀Ni-P处理后复合材料的自腐蚀电位升高250 mV,说明化学镀Ni-P层可以明显改善碳纤维增强镁基复合材料的耐腐蚀性能.

Microstructure and electric properties of Si_p/Al composites for electronic packaging applications

Sip/1199,Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure,particle volume fraction,particle size,matrix alloy and heat treatment on the electrical properties of composites were discussed,and the electrical conductivity was calculated by theoretical models. It is shown that the Si/Al interfaces are clean and do not have interface reaction products. For the same matrix alloy,the electrical conductivity of composites decreases with increasing the reinforcement volume fraction. As for the same particle content,the electrical conductivity of composites decreases with increasing the alloying element content of matrix. Particle size has little effects on the electrical conductivity. Electrical conductivity of composites increases slightly after annealing treatment. The electrical conductivity of composites calculated by P.G model is consistent with the experimental results.