In the present study,anodic films on aluminium alloy was used as the dielectric layer for Cu thinfilm temperature sensor,and then Cu film was deposited by unbalanced magnetron sputtering ion plating as the sensitive l...In the present study,anodic films on aluminium alloy was used as the dielectric layer for Cu thinfilm temperature sensor,and then Cu film was deposited by unbalanced magnetron sputtering ion plating as the sensitive layer.Microstructure and surface morphologies of Cu film were investigated by optical microscope(OM),atomic force microscope(AFM) and scanning electron microscope(SEM).Electrical properties of Cu thin-film temperature sensor were tested by four-point probe technique and Digit Multimeter.The results showed that the surface roughness of anodic films can be reduced from Ra 58.096 nm to Ra 16.335 nm by proper polishing.Continual Cu stripes can be obtained both on polished anodic alumina film and smooth alumina wafer by etching after Cu film annealing.The resistivity of Cu films before and after 300 ℃ as well as 400 ℃ annealing are 12.48 mΩ·cm,5.48 mΩ·cm and 4.83 mΩ·cm,respectively.The resistances of Cu thin-film temperature sensor in 70 ℃ and 0 ℃ are 946.5 Ω and 761.15 Ω respectively.The temperature coefficient of resistivity(TCR) of the sensor is 3479 × 10^(- 6) /℃.展开更多
In the present study, 2024 aluminum alloy specimen was anodized in acetic acid and oxalic acid e- lectrolytes. Effects of the current density on the microstructure and corrosion resistance of anodic oxide film have be...In the present study, 2024 aluminum alloy specimen was anodized in acetic acid and oxalic acid e- lectrolytes. Effects of the current density on the microstructure and corrosion resistance of anodic oxide film have been investigated. The steady voltage increases from 11 V to 71 V with the current density increase from 0. 5 A/din2 to 2. 5 A/din2. The SEM reveals that there are pits, cavities and irregular pores in the anodic film, and their size and morphologies change with the current density. The corrosion resistance of the film was evalua- ted by potentiodynamic polarization and electrochemical impedance in 0.1 mol/L FeC13 solution at room temper- ature. The results show that corrosion resistance of the anodic oxide film changes with the current density, and the anodic fihn formed at the current density of 1.0 A/dm2 has the best corrosion resistance. These observations indicate that anodic film formed at J -- 1.0 A/dm2can serve as a support material for the Cu micrometallic pat-展开更多
基金Sponsored by the National Natural Science Foundation of China(Grant No. 60971020)
文摘In the present study,anodic films on aluminium alloy was used as the dielectric layer for Cu thinfilm temperature sensor,and then Cu film was deposited by unbalanced magnetron sputtering ion plating as the sensitive layer.Microstructure and surface morphologies of Cu film were investigated by optical microscope(OM),atomic force microscope(AFM) and scanning electron microscope(SEM).Electrical properties of Cu thin-film temperature sensor were tested by four-point probe technique and Digit Multimeter.The results showed that the surface roughness of anodic films can be reduced from Ra 58.096 nm to Ra 16.335 nm by proper polishing.Continual Cu stripes can be obtained both on polished anodic alumina film and smooth alumina wafer by etching after Cu film annealing.The resistivity of Cu films before and after 300 ℃ as well as 400 ℃ annealing are 12.48 mΩ·cm,5.48 mΩ·cm and 4.83 mΩ·cm,respectively.The resistances of Cu thin-film temperature sensor in 70 ℃ and 0 ℃ are 946.5 Ω and 761.15 Ω respectively.The temperature coefficient of resistivity(TCR) of the sensor is 3479 × 10^(- 6) /℃.
基金Sponsored by the National Natural Science Foundation of China (Grant No. 60971020)
文摘In the present study, 2024 aluminum alloy specimen was anodized in acetic acid and oxalic acid e- lectrolytes. Effects of the current density on the microstructure and corrosion resistance of anodic oxide film have been investigated. The steady voltage increases from 11 V to 71 V with the current density increase from 0. 5 A/din2 to 2. 5 A/din2. The SEM reveals that there are pits, cavities and irregular pores in the anodic film, and their size and morphologies change with the current density. The corrosion resistance of the film was evalua- ted by potentiodynamic polarization and electrochemical impedance in 0.1 mol/L FeC13 solution at room temper- ature. The results show that corrosion resistance of the anodic oxide film changes with the current density, and the anodic fihn formed at the current density of 1.0 A/dm2 has the best corrosion resistance. These observations indicate that anodic film formed at J -- 1.0 A/dm2can serve as a support material for the Cu micrometallic pat-
