SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualizatio...SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner＇ s law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pustes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases.展开更多
Short circuit transfer involves bridging between the consumable electrode and the weld pool, associated with variations of electrical parameters which characterize the change of molten metal bridge state and are very ...Short circuit transfer involves bridging between the consumable electrode and the weld pool, associated with variations of electrical parameters which characterize the change of molten metal bridge state and are very important for the control of .spatter. In this paper, electrical process parameters and short circuit transfer images were simultaneously recorded with a LabView-based synchronous sensing and visualizing system. The arc^bridge resistance and derivatives of welding current, arc voltage and arc resistance at various instants were calculated by means of offline analysis of the welding current, arc voltage and droplet images. Parameters and their feature values indicating the onset of short circuit and the oncoming necking-down of molten metal bridge were determined. Using the calculated feature values, bridge-state-feedback control for .short circuit transfer was realized with a spatter rate less than 0. 25%.展开更多
文摘SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner＇ s law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pustes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases.
基金This work is supported by Shandong Natural Science Foundation （ Key Project） under contract No. ZR2010EZ005.
文摘Short circuit transfer involves bridging between the consumable electrode and the weld pool, associated with variations of electrical parameters which characterize the change of molten metal bridge state and are very important for the control of .spatter. In this paper, electrical process parameters and short circuit transfer images were simultaneously recorded with a LabView-based synchronous sensing and visualizing system. The arc^bridge resistance and derivatives of welding current, arc voltage and arc resistance at various instants were calculated by means of offline analysis of the welding current, arc voltage and droplet images. Parameters and their feature values indicating the onset of short circuit and the oncoming necking-down of molten metal bridge were determined. Using the calculated feature values, bridge-state-feedback control for .short circuit transfer was realized with a spatter rate less than 0. 25%.
