研究了化学镀 N i-P-B合金溶液的稳定性和镀层的结构。结果表明 ,增大镀液中硫酸镍、硼氢化钠、次亚磷酸钠浓度及溶液的 p H值 ,会降低镀液的稳定性 ,而甲酸浓度增大则会显著改善镀液的稳定性。镀层中硼含量增加使磷含量下降 ,且镀层结...研究了化学镀 N i-P-B合金溶液的稳定性和镀层的结构。结果表明 ,增大镀液中硫酸镍、硼氢化钠、次亚磷酸钠浓度及溶液的 p H值 ,会降低镀液的稳定性 ,而甲酸浓度增大则会显著改善镀液的稳定性。镀层中硼含量增加使磷含量下降 ,且镀层结构由非晶向微晶转变。镀层硬度随硼含量增加而增大 ,40展开更多
The electroless Ni-Cu-P coatings with different Cu content have been deposited from alkaline bath. The surface morphology, microstructure and crystallization behaviour of the electroless Ni-Cu-P alloys have been studi...The electroless Ni-Cu-P coatings with different Cu content have been deposited from alkaline bath. The surface morphology, microstructure and crystallization behaviour of the electroless Ni-Cu-P alloys have been studied by SEM, XRD and DSC. The results show that the concentration of CuSO4·5H2O in the bath has a great effect on the composition of the deposits and the deposition rate. The codeposition of a small amount of Cu makes the crystal grains of the deposits become smaller, but with the Cu content increasing, the deposits exhibit a larger grain size and a more coarse surface morphology. The thermal stability of Ni-Cu-P deposit increases with the Cu content increasing in the deposits.展开更多
文摘The electroless Ni-Cu-P coatings with different Cu content have been deposited from alkaline bath. The surface morphology, microstructure and crystallization behaviour of the electroless Ni-Cu-P alloys have been studied by SEM, XRD and DSC. The results show that the concentration of CuSO4·5H2O in the bath has a great effect on the composition of the deposits and the deposition rate. The codeposition of a small amount of Cu makes the crystal grains of the deposits become smaller, but with the Cu content increasing, the deposits exhibit a larger grain size and a more coarse surface morphology. The thermal stability of Ni-Cu-P deposit increases with the Cu content increasing in the deposits.
