电介质和金属表面被激发出来的二次电子(Secondary electron emission,SEE)可以显著地改变该表面附近的电势分布和通量。在一些情况下,如电子束焊机、扫描电子显微镜、透射式电子显微镜、电子衍射仪、俄歇电子能谱仪、电子倍增管等应用...电介质和金属表面被激发出来的二次电子(Secondary electron emission,SEE)可以显著地改变该表面附近的电势分布和通量。在一些情况下,如电子束焊机、扫描电子显微镜、透射式电子显微镜、电子衍射仪、俄歇电子能谱仪、电子倍增管等应用中,二次电子的次级倍增效应得到很好的应用。然而在另一些情况下,例如射频放大器、粒子加速器和霍尔推进器、电子真空管、空间宇宙飞行器表面等应用中,二次电子会对仪器产生不利的影响。因此,抑制二次电子发射及研究减少二次电子产额(Secondary electron yield,SEY)是非常有意义的。现有的抑制二次电子发射的研究方法有外加偏置场法和表面处理法,其中通过外加电场或磁场来抑制二次电子的激发会对入射束流、束斑产生不利影响,因此表面处理法更具优势。表面处理法主要分为三类:表面陷阱构造(矩形以及三角形的凹槽、微孔结构、纤维结构、泡沫结构等)、表面镀膜(石墨烯膜、TiN膜等)、表面束流处理(激光刻蚀、磁控溅射法)。这些抑制二次电子激发的方法主要为了达到两个目的,一是减少物体表面的真二次电子的发射,二是捕获发射的二次电子,使之不能逃逸。本文总结了一些抑制二次电子激发的方法,比较不同方法或不同影响因素对二次电子的影响。展开更多
In this paper, N-doped diamond-like carbon(DLC) films were deposited on silicon substrates by using helicon wave plasma chemical vapor deposition(HWP-CVD) with the Ar/CH_4/N_2 mixed gas. The surface morphology, struct...In this paper, N-doped diamond-like carbon(DLC) films were deposited on silicon substrates by using helicon wave plasma chemical vapor deposition(HWP-CVD) with the Ar/CH_4/N_2 mixed gas. The surface morphology, structural and mechanical properties of the N-doped DLC films were investigated in detail by scanning electron microscopy(SEM), x-ray photoelectron spectroscopy(XPS), Raman spectra, and atomic force microscopy(AFM). It can be observed from SEM images that surface morphology of the films become compact and uniform due to the incorporation of N. The maximum of the deposition rate of the films is 143 nm min^(-1), which is related to the high plasma density. The results of XPS show that the N incorporates in the films and the C-C sp^3 bond content increases firstly up to the maximum(20%) at 10 sccm of N_2 flow rate, and then decreases with further increase in the N_2 flow rate. The maximum Young's modulus of the films is obtained by the doping of N and reaches 80 GPa at 10 sccm of N_2 flow rate, which is measured by AFM in the scanning probe microscope mode. Meanwhile, friction characteristic of the N-doped DLC films reaches a minimum value of 0.010.展开更多
文摘电介质和金属表面被激发出来的二次电子(Secondary electron emission,SEE)可以显著地改变该表面附近的电势分布和通量。在一些情况下,如电子束焊机、扫描电子显微镜、透射式电子显微镜、电子衍射仪、俄歇电子能谱仪、电子倍增管等应用中,二次电子的次级倍增效应得到很好的应用。然而在另一些情况下,例如射频放大器、粒子加速器和霍尔推进器、电子真空管、空间宇宙飞行器表面等应用中,二次电子会对仪器产生不利的影响。因此,抑制二次电子发射及研究减少二次电子产额(Secondary electron yield,SEY)是非常有意义的。现有的抑制二次电子发射的研究方法有外加偏置场法和表面处理法,其中通过外加电场或磁场来抑制二次电子的激发会对入射束流、束斑产生不利影响,因此表面处理法更具优势。表面处理法主要分为三类:表面陷阱构造(矩形以及三角形的凹槽、微孔结构、纤维结构、泡沫结构等)、表面镀膜(石墨烯膜、TiN膜等)、表面束流处理(激光刻蚀、磁控溅射法)。这些抑制二次电子激发的方法主要为了达到两个目的,一是减少物体表面的真二次电子的发射,二是捕获发射的二次电子,使之不能逃逸。本文总结了一些抑制二次电子激发的方法,比较不同方法或不同影响因素对二次电子的影响。
基金supported by the National Magnetic Confinement Fusion Science Program of China (Grant Nos. 2014GB106005 and 2014GB106000)National Natural Science Foundation of China (Nos. 11505123,11435009,11375126)Project funded by China Postdoctoral Science Foundation (No. 156455)
文摘In this paper, N-doped diamond-like carbon(DLC) films were deposited on silicon substrates by using helicon wave plasma chemical vapor deposition(HWP-CVD) with the Ar/CH_4/N_2 mixed gas. The surface morphology, structural and mechanical properties of the N-doped DLC films were investigated in detail by scanning electron microscopy(SEM), x-ray photoelectron spectroscopy(XPS), Raman spectra, and atomic force microscopy(AFM). It can be observed from SEM images that surface morphology of the films become compact and uniform due to the incorporation of N. The maximum of the deposition rate of the films is 143 nm min^(-1), which is related to the high plasma density. The results of XPS show that the N incorporates in the films and the C-C sp^3 bond content increases firstly up to the maximum(20%) at 10 sccm of N_2 flow rate, and then decreases with further increase in the N_2 flow rate. The maximum Young's modulus of the films is obtained by the doping of N and reaches 80 GPa at 10 sccm of N_2 flow rate, which is measured by AFM in the scanning probe microscope mode. Meanwhile, friction characteristic of the N-doped DLC films reaches a minimum value of 0.010.
