The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means.It was found that copper powder plated with silver having an interspersion str...The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means.It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%,the temperature of oxidation resistance varies with the surface Ag content.The greater the surface Ag content is,the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure.The copper powder plated by silver with full packaging structure can not be oxidized even at展开更多
The reaction system of silver plating for micron copper particle was studied by SEM、 XRD and other testing means.It was found that micron copper particles produce stronger absorption to complex ions [Cu(NH3)4]2＋ whi...The reaction system of silver plating for micron copper particle was studied by SEM、 XRD and other testing means.It was found that micron copper particles produce stronger absorption to complex ions [Cu(NH3)4]2＋ which come from the substitution reaction. This absorption retards the substitution reaction so that Cu Ag bimetallic powders only with the plating of interspersion structure are obtained through once silver plating reaction. Besides, because of the plating of decoration structure a lot of minuteness cells form in the system, so that the plating changes into multilayer. Based on the mechanism,only if ions [Cu(NH3)4]2＋ absorbed are cleaned, the reaction of silver plating goes on in order to preparating Cu Ag bimetallic powders with the plating of packaging structure.展开更多
文摘The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means.It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%,the temperature of oxidation resistance varies with the surface Ag content.The greater the surface Ag content is,the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure.The copper powder plated by silver with full packaging structure can not be oxidized even at
文摘The reaction system of silver plating for micron copper particle was studied by SEM、 XRD and other testing means.It was found that micron copper particles produce stronger absorption to complex ions [Cu(NH3)4]2＋ which come from the substitution reaction. This absorption retards the substitution reaction so that Cu Ag bimetallic powders only with the plating of interspersion structure are obtained through once silver plating reaction. Besides, because of the plating of decoration structure a lot of minuteness cells form in the system, so that the plating changes into multilayer. Based on the mechanism,only if ions [Cu(NH3)4]2＋ absorbed are cleaned, the reaction of silver plating goes on in order to preparating Cu Ag bimetallic powders with the plating of packaging structure.
