Dynamic mechanical analysis(DMA) was used to investigate the dynamic mechanical and thermal properties of the controllable cross-linking poly(ether ether ketone)s containing thioether bond and pure poly(ether ether ke...Dynamic mechanical analysis(DMA) was used to investigate the dynamic mechanical and thermal properties of the controllable cross-linking poly(ether ether ketone)s containing thioether bond and pure poly(ether ether ketone). The processes of cross-linking reaction were monitored with the changes in storage modulus(E′) and tanδ with the change of temperature. The storage modulus(E′) increases in the high temperature region and tanδ shifts toward high temperature with increasing the degree of cross-linking. Comparing dynamic mechanical properties of pure poly(ether ether ketone) with that of the controllable cross-linking poly(ether ether ketone)s, we can conclude that the cross-linking reaction could occurred at the sites of thioether bonds. The novel polymer can be processed as conveniently as thermoplastic material before cross-linking and has a high application temperature as thermosetting material after cross-linking. It can be applied to a new technological region.展开更多
文摘Dynamic mechanical analysis(DMA) was used to investigate the dynamic mechanical and thermal properties of the controllable cross-linking poly(ether ether ketone)s containing thioether bond and pure poly(ether ether ketone). The processes of cross-linking reaction were monitored with the changes in storage modulus(E′) and tanδ with the change of temperature. The storage modulus(E′) increases in the high temperature region and tanδ shifts toward high temperature with increasing the degree of cross-linking. Comparing dynamic mechanical properties of pure poly(ether ether ketone) with that of the controllable cross-linking poly(ether ether ketone)s, we can conclude that the cross-linking reaction could occurred at the sites of thioether bonds. The novel polymer can be processed as conveniently as thermoplastic material before cross-linking and has a high application temperature as thermosetting material after cross-linking. It can be applied to a new technological region.
