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Effects of single and multi-stage solid solution treatments on microstructure and properties of as-extruded AA7055 helical profile 被引量:11
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作者 Cun-sheng ZHANG Zhao-gang ZHANG +3 位作者 Ming-fu LIU En-cheng BAO Liang CHEN Guo-qun ZHAO 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2021年第7期1885-1901,共17页
The effects of single-stage solution treatment(SST),enhanced solution treatment(EST),high-temperature pre-precipitation(HTPP)and multi-stage solution treatment(MST)on the microstructure,mechanical properties and corro... The effects of single-stage solution treatment(SST),enhanced solution treatment(EST),high-temperature pre-precipitation(HTPP)and multi-stage solution treatment(MST)on the microstructure,mechanical properties and corrosion resistance of the as-extruded 7055 aluminium alloy(AA7055)helical profile were investigated using differential scanning calorimetry(DSC),optical microscopy(OM),scanning electron microscopy(SEM),electron back-scattered diffraction(EBSD)and transmission electron microscopy(TEM).It was observed that EST and MST could promote the dissolution of the second-phase particles compared with the traditional SST,and the intergranular phases were distinctly discontinuously distributed after HTPP and MST.There was obvious difference in the main texture type and texture strength for the alloy after different solid solution treatments.HTPP could improve the corrosion resistance of the alloy by regulating the intergranular phases,but the mechanical properties were severely weakened.While the good corrosion resistance of the alloy could be obtained by MST without obvious strength loss.As a result,the MST is an ideal solid solution treatment scheme for AA7055. 展开更多
关键词 7055 aluminum alloy extruded profile solid solution treatment mechanical properties corrosion resistance
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铜层厚度及退火温度对ZnS/Cu/ZnS复合薄膜显微结构与性能的影响
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作者 王梦慧 易叶帆 +4 位作者 鲍恩成 饶项炜 李晓涵 刘劲松 李子全 《机械工程材料》 CAS CSCD 北大核心 2016年第1期47-51,共5页
采用磁控溅射技术制备了不同铜层厚度的ZnS/Cu/ZnS复合薄膜,并在不同温度(100~300℃)下对其进行退火处理,研究了铜层厚度和退火温度对复合薄膜物相、表面形貌、透光率和表面电阻等的影响。结果表明:随着铜层厚度增加,复合薄膜的表面... 采用磁控溅射技术制备了不同铜层厚度的ZnS/Cu/ZnS复合薄膜,并在不同温度(100~300℃)下对其进行退火处理,研究了铜层厚度和退火温度对复合薄膜物相、表面形貌、透光率和表面电阻等的影响。结果表明:随着铜层厚度增加,复合薄膜的表面粗糙度逐渐减小后趋于平缓,方块电阻逐渐下降;当铜层厚度为16nm时,复合薄膜的最高透光率最大为87%,方块电阻为62.5Ω;随着退火温度升高,复合薄膜中ZnS层结晶性增强,表面出现颗粒团簇;在100℃退火后,铜层厚度为16nm的复合薄膜的最高透光率为89%,方块电阻为46.3Ω。 展开更多
关键词 ZnS/Cu/ZnS复合薄膜 退火温度 透光率 电阻
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