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Powder mixed electrochemical discharge process for micro machining of C103 niobium alloy
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作者 Niladri Mandal Nitesh kumar alok kumar das 《Defence Technology(防务技术)》 SCIE EI CAS CSCD 2023年第8期84-101,共18页
This work demonstrates the viability of the powder-mixed micro-electrochemical discharge machining(PMECDM) process to fabricate micro-holes on C103 niobium-based alloy for high temperature applications.Three processes... This work demonstrates the viability of the powder-mixed micro-electrochemical discharge machining(PMECDM) process to fabricate micro-holes on C103 niobium-based alloy for high temperature applications.Three processes are involved simultaneously i.e.spark erosion,chemical etching,and abrasive grinding for removal of material while the classical electrochemical discharge machining process involves double actions i.e.spark erosion,and chemical etching.The powder-mixed electrolyte process resulted in rapid material removal along with a better surface finish as compared to the classical microelectrochemical discharge machining(MECDM).Further,the results are optimized through a multiobjective optimization approach and study of the surface topography of the hole wall surface obtained at optimized parameters.In the selected range of experimental parameters,PMECDM shows a higher material removal rate(MRR) and lower surface roughness(R_(a))(MRR:2.8 mg/min and R_(a) of 0.61 μm) as compared to the MECDM process(MRR:2.01 mg/min and corresponding Raof 1.11 μm).A detailed analysis of the results is presented in this paper. 展开更多
关键词 Micro-electrochemical discharge machining C103 niobium alloy Surface integrity Material removal rate Hybrid powder mixed ECDM
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激光包覆工艺的实验研究及人工神经网络对工艺参数的预测
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作者 Rashi TYAGI Shakti kumar +2 位作者 Mohammad Shahid RAZA Ashutosh TRIPATHI alok kumar das 《Journal of Central South University》 SCIE EI CAS CSCD 2022年第10期3489-3502,共14页
根据正交实验(L^(16))设计方案,将氮化钛与SS304的粉末混合物在光纤激光器上对SS304衬底进行激光包覆。利用Taguchi信噪比方法对得到的包覆层微观硬度和包厚度进行分析,得到了最优的参数组合。并利用人工神经网络(ANN)对比分析得到与Tag... 根据正交实验(L^(16))设计方案,将氮化钛与SS304的粉末混合物在光纤激光器上对SS304衬底进行激光包覆。利用Taguchi信噪比方法对得到的包覆层微观硬度和包厚度进行分析,得到了最优的参数组合。并利用人工神经网络(ANN)对比分析得到与Taguchi方法不同的最优组合,但二种方法得到的包覆层厚度和微观硬度几乎是相同的,包覆层微观硬度(HV_(0.5)121)是SS304衬底硬度(HV_(0.5)752)的6倍多。氮化物陶瓷的存在导致了更高的微观硬度,包覆层表面无裂缝和孔隙,平均包覆层厚度达0.6 mm。 展开更多
关键词 激光包覆 Taguchi正交设计 人工神经网络 微观硬度 显微结构
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Machining of circular micro holes by electrochemical micro-machining process 被引量:6
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作者 alok kumar das P. Saha alokkumardas·ParthaSaha 《Advances in Manufacturing》 SCIE CAS 2013年第4期314-319,共6页
Machining of micro holes with micro electro- chemical machining (micro ECM) process has been carried out with an indigenously developed set up. This paper describes relevant problems and solutions for the circular m... Machining of micro holes with micro electro- chemical machining (micro ECM) process has been carried out with an indigenously developed set up. This paper describes relevant problems and solutions for the circular micro holes machining process on 304 stainless steel sheets with 60 μm thickness using high speed steel cylindrical tool of diameter 500 ~tm and using dilute I-I2SO4 as elec- trolyte. The taper angle variation of the machined hole is analyzed and reported for different experimental setting parameters. The minimum value of the taper angle of machined holes is achieved at the parameter setting of 0.4 mol/L H2504, 700 kHz, 600 ns and 21 V, for stainless steel sheets and HSS tool. 展开更多
关键词 Micro machining - Micro ECMMicro-hole ~ Electrochemical dissolution ~Short pulse voltage ~ Pulse power supply
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