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Electrochemical Corrosion Study in H2SO4 of NiAl with Cu Additions, Microstructure and Micro-Hardness at Room Temperature
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作者 Jesús M. Colín de la Cruz Sergio A. Serna Barquera +3 位作者 Alvaro Torres-Islas arturo molina-ocampo Edgar Valenzuela José G. González Rodríguez 《Journal of Minerals and Materials Characterization and Engineering》 2022年第3期225-241,共17页
For many years, intermetallic materials promise applications in a wide variety of technology areas. NiAl intermetallic compound is material that exhibits important characteristics such as high corrosion resistance and... For many years, intermetallic materials promise applications in a wide variety of technology areas. NiAl intermetallic compound is material that exhibits important characteristics such as high corrosion resistance and low density besides its ability to retain strength and stiffness at elevated temperatures. However NiAl intermetallic is too hard, brittle and exhibits very low ductility at room temperature being the reason because this material is not yet available for structural applications. In order to increase the ductility of the NiAl intermetallic compound, the addition of a third alloying element has been proved, nevertheless it is important to determine if such additions decrease or increase the hardness and the corrosion resistance of the alloy. So, the present investigation reports the corrosion performance of the NiAl intermetallic compound modified with Cu, emphasizing the EIS analysis and the relation between physical parameters and the modelling equations used in the Equivalent Electric Circuit. It was found that the addition of Cu promotes the formation of the γ’-Ni<sub>3</sub>Al phase in Cu contents greater than 15 at. %, in addition to a decrease in micro hardness and an increment in the I<sub>corr</sub> values. In this way, the electrochemical characterization evidenced a high corrosion resistance of these intermetallic alloys. 展开更多
关键词 NiAl-Cu Corrosion Behavior Electrochemical Impedance Spectrum Vickers Micro Hardness MICROSTRUCTURE
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