The continuous growth of stacked die packagesis resulting from the technology’s ability to effec-tively increase the functionality and capacity of elec-tronic devices within the same footprint as a singlechip. The in...The continuous growth of stacked die packagesis resulting from the technology’s ability to effec-tively increase the functionality and capacity of elec-tronic devices within the same footprint as a singlechip. The increased utilization of stacked die pack-ages in cell phone and other consumer productsdrives technologies that enable multiple die stackswithin a given package dimension.展开更多
文摘The continuous growth of stacked die packagesis resulting from the technology’s ability to effec-tively increase the functionality and capacity of elec-tronic devices within the same footprint as a singlechip. The increased utilization of stacked die pack-ages in cell phone and other consumer productsdrives technologies that enable multiple die stackswithin a given package dimension.