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Compact Thermosyphon Heat Exchanger for Power Electronics Cooling
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作者 bruno agostini mathieu habert 《Journal of Energy and Power Engineering》 2013年第5期972-978,共7页
The heat losses density in power electronics products follows an ever increasing trend. Nowadays they reach 200 W/cmz at chip level and 50 W/cm2 at heatsink base level. Water cooling is the most effective cooling meth... The heat losses density in power electronics products follows an ever increasing trend. Nowadays they reach 200 W/cmz at chip level and 50 W/cm2 at heatsink base level. Water cooling is the most effective cooling method but unfortunately water is often undesired due to high voltages or costumer requirements. Two-phase cooling is a promising technology for electronics cooling. It allows using dielectric fluids in passive systems and still benefits from very high heat transfer coefficients. Thermosyphons are a particularly interesting technology in the field of power electronics because it is entirely passive and a simple equipment. ABB has developed a compact thermosyphon heat exchanger based on automotive technology, which uses numerous multi-port extruded tubes with capillary sized channels disposed in parallel and brazed to a heated base plate in order to achieve the desired compactness. The experimental performances of this novel power electronics cooling system are presented with R134a as a working fluid. The influence of several parameters on the performances was studied experimentally: coolant flow rate, coolant temperature, heat load and fluid filling. 展开更多
关键词 THERMOSYPHON heat pipe power electronics.
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