The study of photonic sintering has gained interest based on the advantages of fast processing at room temperature.However,printed electronics made from photonic sintering with an intensive pulsed light(IPL)energy sou...The study of photonic sintering has gained interest based on the advantages of fast processing at room temperature.However,printed electronics made from photonic sintering with an intensive pulsed light(IPL)energy source exhibit more mechanical instability than those made from conventional thermal sintering processes.To solve the mechanical instability problems,we fabricated Ag flake hybrid pastes with a variety of concentrations of Ag flake(0,25,50,75,and 100 wt.%).All of the screen-printed hybrid Ag circuits were fabricated on polyimide substrates and were sintered at 3.5 MW.Surface porosity was analyzed using the Brunauer-Emmett-Teller method.An IPC(Packaging Electronic Circuits)sliding test was performed to analyze the flexibility of the screen-printed Ag flake hybrid circuits.The adhesion strength of the hybrid circuits was evaluated with a roll-type 90°peel test.The hybrid Ag printed circuit showed improvements in both the flexibility and adhesion strength with the addition of Ag flake.展开更多
基金supported by the Basic Science Research Program through the National Research Foundation of Korea(NRF)funded by the Ministry of Education(No.2019R1A6A1A03033215)supported by“Human Resources Program in Energy Technology”of the Korea Institute of Energy Technology Evaluation and Planning(KETEP),granted financial resource from the Ministry of Trade,Industry&Energy,Republic of Korea(No.20174030201800)。
文摘The study of photonic sintering has gained interest based on the advantages of fast processing at room temperature.However,printed electronics made from photonic sintering with an intensive pulsed light(IPL)energy source exhibit more mechanical instability than those made from conventional thermal sintering processes.To solve the mechanical instability problems,we fabricated Ag flake hybrid pastes with a variety of concentrations of Ag flake(0,25,50,75,and 100 wt.%).All of the screen-printed hybrid Ag circuits were fabricated on polyimide substrates and were sintered at 3.5 MW.Surface porosity was analyzed using the Brunauer-Emmett-Teller method.An IPC(Packaging Electronic Circuits)sliding test was performed to analyze the flexibility of the screen-printed Ag flake hybrid circuits.The adhesion strength of the hybrid circuits was evaluated with a roll-type 90°peel test.The hybrid Ag printed circuit showed improvements in both the flexibility and adhesion strength with the addition of Ag flake.
