Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film

In this paper,we investigate the interfacial behavior of a thin one-dimensional(1D)hexagonal quasicrystal(QC)film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation.The contact interface is assumed to be nonslipping,with both perfectly bonded and debonded boundary conditions.The Fourier transform technique is adopted to establish the integral equations in terms of interfacial shear stress,which are solved as a linear algebraic system by approximating the unknown phonon interfacial shear stress via the series expansion of the Chebyshev polynomials.The expressions are explicitly obtained for the phonon interfacial shear stress,internal normal stress,and stress intensity factors(SIFs).Finally,based on numerical calculations,we briefly discuss the effects of the material mismatch,the geometry of the QC film,and the debonded length and location on stresses and SIFs.

Interfacial fracture analysis for a two-dimensional decagonal quasi-crystal coating layer structure

The interface crack problems in the two-dimensional(2D)decagonal quasicrystal(QC)coating are theoretically and numerically investigated with a displacement discontinuity method.The 2D general solution is obtained based on the potential theory.An analogy method is proposed based on the relationship between the general solutions for 2D decagonal and one-dimensional(1D)hexagonal QCs.According to the analogy method,the fundamental solutions of concentrated point phonon displacement discontinuities are obtained on the interface.By using the superposition principle,the hypersingular boundary integral-differential equations in terms of displacement discontinuities are determined for a line interface crack.Further,Green’s functions are found for uniform displacement discontinuities on a line element.The oscillatory singularity near a crack tip is eliminated by adopting the Gaussian distribution to approximate the delta function.The stress intensity factors(SIFs)with ordinary singularity and the energy release rate(ERR)are derived.Finally,a boundary element method is put forward to investigate the effects of different factors on the fracture.

Three-dimensional interfacial fracture analysis of a one-dimensional hexagonal quasicrystal coating

In this paper, the three-dimensional(3D) interfacial fracture is analyzed in a one-dimensional(1D) hexagonal quasicrystal(QC) coating structure under mechanical loading. A planar interface crack with arbitrary shape is studied by a displacement discontinuity method. Fundamental solutions of interfacial concentrated displacement discontinuities are obtained by the Hankel transform technique, and the corresponding boundary integral-differential equations are constructed with the superposition principle.Green’s functions of constant interfacial displacement discontinuities within a rectangular element are derived, and a boundary element method is proposed for numerical simulation.The singularity of stresses near the crack front is investigated, and the stress intensity factors(SIFs) as well as energy release rates(ERRs) are determined. Finally, relevant influencing factors on the fracture behavior are discussed.