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MICROBRIDGE TESTING OF YOUNG'S MODULUS AND RESIDUAL STRESS OF NICKEL FILM ELECTROPLATED ON SILICON WAFER
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作者 Y.Zhou c.s.yang +5 位作者 J.A. Chen G.F. Ding L. Wang M.J Wang Y.M Zhang T.H Zhang 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2004年第3期247-254,共8页
Microbridge testing is used to measure the Young's modulus and residual stresses ofmetallic films. Nickel film microbridges with widths of several hundred microns arefabricated by Microelectromechanical Systems. I... Microbridge testing is used to measure the Young's modulus and residual stresses ofmetallic films. Nickel film microbridges with widths of several hundred microns arefabricated by Microelectromechanical Systems. In order to measure the mechanicalproperties of nickel film microbridges, special shaft structure is designed to solve theproblem of getting the load--deflection curves of metal film microbridge by Nanoin--denter XP system with normal Berkovich probe. Theoretical analysis of the micro--bridge load--deflection curve is proposed to evaluate the Young's modulus and residualstress of the films simultaneously. The calculated results based on the experimentalmeasurements show that the average Young's modulus and residual stress are around190GPa and 175MPa respectively, while the Young's modulus measured by Nano-hardness method on nickel film with silicon substrate is 186.8±7.34GPa. 展开更多
关键词 nickel film microbridge MEMS mechanical property loadeflection measurement
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