The effect of magnetic field on the growth behavior of compound layer was examined at the interface between the solid Cu and liquid AI during reactive diffusion. It was found that the thickness of compound layer was r...The effect of magnetic field on the growth behavior of compound layer was examined at the interface between the solid Cu and liquid AI during reactive diffusion. It was found that the thickness of compound layer was reduced by the high magnetic field. The growth activation energy in β, γ1 and ε2 layers under a high magnetic field was larger than those in non magnetic circumstances, the increment percentage being 4.8%, 13.3% and 5.5%, respectively.展开更多
The intermetallic compound （IMC） growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210℃ for different time. It was found that the total IMC in Sn10...The intermetallic compound （IMC） growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210℃ for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.展开更多
基金supported by the National Natural Science Foundation of China (No. 50871026)the 111 Project(B07015)+2 种基金Foundation for the Author of National Excellent Doctoral Dissertation of China (No. 200745)Program for New Century Excellent Talents in University (NCET-06-0288)the Fundamental Research Funds for the Central Universities (N090109001)
文摘The effect of magnetic field on the growth behavior of compound layer was examined at the interface between the solid Cu and liquid AI during reactive diffusion. It was found that the thickness of compound layer was reduced by the high magnetic field. The growth activation energy in β, γ1 and ε2 layers under a high magnetic field was larger than those in non magnetic circumstances, the increment percentage being 4.8%, 13.3% and 5.5%, respectively.
基金supported by the National Natural Science Foundation of China (No. 50871026)the 111 Project(No. B07015)+2 种基金Foundation of National Excellent Doctoral Dissertation of China (No. 200745)Program for New Century Excellent Talents in University (No. NCET-060288)the Fundamental Research Funds for the Central Universities (No. N090109001)
文摘The intermetallic compound （IMC） growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210℃ for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.
