The Microwave Characteristics of an In_(0.4)Ga_(0.6)As Metal-Oxide-Semiconductor Field-Effect Transistor with an In_(0.49)Ga_(0.51)P Interfacial Layer

A high microwave performance enhancement-mode(E-mode)In_(0.4)Ga_(0.6)As channel metal-oxide-semiconductor field-effect transistor(MOSFET)with a Si-doped In_(0.49)Ga0.51P interfacial layer is fabricated.A 0.8-μm-gate-length In_(0.4)Ga_(0.6)As MOSFET with a 5-nm Al_(2)O_(3) dielectric layer provides a current gain cutoff frequency of 16.7 GHz and a maximum oscillation frequency of 52 GHz.A semi-empirical small-signal-parameter extraction technique accounting for the low frequency anomaly of this MOSFET device is described,which is based on on-wafer S-parameter measurements.Excellent agreement between measured and simulated scattering parameters as well as the physically realistic circuit elements demonstrates the validity of this approach.

A High Performance In_(0.7)Ga_(0.3)As MOSFET with an InP Barrier Layer for Radio-Frequency Application

We demonstrate a high performance implant-free n-type In_(0.7)Ga_(0.3)As channel MOSFET with a 4-nm InP barrier layer fabricated on a semi-insulating substrate employing a 10-nm Al_(2)O_(3) as gate dielectric.The maximum effective channel mobility is 1862 cm^(2)/V·s extracted by the split C–V method.Devices with 0.8μm gate length exhibit a peak extrinsic transconductance of 85 mS/mm and a drive current of more than 200 mA/mm.A short-circuit current gain cutoff frequency f_(T) of 24.5 GHz and a maximum oscillation frequency f_(max) of 54 GHz are achieved for the 0.8μm gate-length device.The research is helpful to obtain higher performance In_(0.7)Ga_(0.3)As MOSFETs for radio-frequency applications.

GaSb p-Channel Metal-Oxide-Semiconductor Field-Effect Transistors with Ni/Pt/Au Source/Drain Ohmic Contacts

GaSb is an attractive candidate for future high-performance Ⅲ-Ⅴ p-channel metal-oxide-semiconductor-field-effect-transistors(pMOSFETs)because of its high hole mobility.The effect of HCl based-chemical cleaning on removing the non-self limiting and instable native oxide layer of GaSb to obtain a clean and smooth surface has been studied.It is observed that the rms roughness of a GaSb surface is significantly reduced from 2.731 nm to 0.693 nm by using HCl:H_(2)O(1:3)solution.The Ni/Pt/Au ohmic contact exhibits an optimal specific contact resistivity of about 6.89×10^(-7)Ω·cm^(2) with a 60 s rapid thermal anneal(RTA)at 250℃.Based on the chemical cleaning and ohmic contact experimental results,inversion-channel enhancement GaSb pMOSFETs are demonstrated.For a 6μm gate length GaSb pMOSFET,a maximum drain current of about 4.0 mA/mm,a drain current on-off(ION/IOFF)ratio of>10^(3),and a subthreshold swing of~250 mV/decade are achieved.Combined with the split C-V method,a peak hole mobility of about 160 cm^(2)/V·s is obtained for a 24μm gate length GaSb pMOSFET.

High-Quality Single Crystalline Ge(111)Growth on Si(111)Substrates by Solid Phase Epitaxy

Heterogeneous integration of crystalline Ge layers on cleaned and H-terminated Si(111)substrates are demonstrated by employing a combination of e-beam evaporation and solid phase epitaxy techniques.High-quality single crystalline Ge(111)layers on Si(111)substrates with a smooth Ge surface and an abrupt interface between Ge and Si are obtained.An XRD rocking curve scan of the Ge(111)diffraction peak shovs a FWHM of only 260 arcsec for a 50-nm-thick Ge layer annealed at 600℃with a ramp-up rate of 20℃/s and a holding time of 1 min.The AFM images exhibit that the rms surface roughness of all the crystalline Ge layers are less than 2.1 nm.

The Impact of HC1 Precleaning and Sulfur Passivation on the Al2O3/Ge Interface in Ge Metal-Oxide-Semiconductor Capacitors

Surface treatment for Ge substrates using hydrogen chlorine cleaning and chemical passivation are investigated on AuTi/Al2O3/Ge metal-oxide-semiconductor capacitors.After hydrogen chlorine cleaning,a smooth Ge surface almost free from native oxide is demonstrated by atomic force microscopy and x-ray photoelectron spectroscopy observations.Passivation using a hydrogen chlorine solution is found to form a chlorine-terminated surface,while aqueous ammonium sulfide pretreatment results in a surface terminated by Ge-S bonding.Compared with chlorine-passivated samples,the sulfur-passivated ones show less frequency dispersion and better thermal stability based on capacitance-voltage characterizations.The samples with HCl pre-cleaning and (NH4 )2S passivation show less frequency dispersion than the HF pre-cleaning and (NH4)2S passivated ones.The surface treatment process using hydrogen chlorine cleaning followed by aqueous ammonium sulfide passivation demonstrates a promising way to improve gate dielectric/Ge interface quality.

Solid Phase Reactions of Ni-GaAs Alloys for High Mobility Ⅲ-Ⅴ MOSFET Applications

The solid phase reactions of Ni with GaAs substrates are investigated.The experimental results reveal that the Ni-GaAs solid phase reaction forms a ternary phase of Ni2GaAs when annealing temperatures are in the range 250 300℃.As the annealing temperature increases to 400℃,the Ni2GaAs phase starts to decompose due to NiAs phase precipitation.Ni-GaAs alloys processed at 400℃ with a 3min annealing time demonstrate a sheet resistance of 30Ω/square after unreacted Ni removal in hot diluted-HCl solutions.Therefore,Ni-GaAs alloys formed by solid phase reaction could be promising metallic source/drain structures with significant low series resistance for high mobility Ⅲ-Ⅴ metal-oxide-semiconductor field effect transistor (MOSFET) applications.