目的探讨毅新博创Clin-TOF-I基质辅助激光解吸电离飞行时间质谱(matrix-assisted laser desorption ionization-time of flight mass spectrometry,MALDI-TOF MS)分析性能验证方法,使之满足实验室对临床常见病原微生物的检测需要,为临...目的探讨毅新博创Clin-TOF-I基质辅助激光解吸电离飞行时间质谱(matrix-assisted laser desorption ionization-time of flight mass spectrometry,MALDI-TOF MS)分析性能验证方法,使之满足实验室对临床常见病原微生物的检测需要,为临床提供及时准确的鉴定结果。方法选取标准菌株、质控菌株和临床菌株共167株,包含常见的革兰氏阳性及阴性杆菌67株、革兰氏阳性及阴性球菌45株、真菌33株,厌氧菌10株、苛养菌12株,所有菌株均经VITEK2 XL、Clin-TOF-II鉴定,必要时进行细菌16S rDNA验证。采用该质谱检测系统推荐的方法对以上菌株进行鉴定,完成准确度验证试验;选取标准菌株10株,采用该质谱检测系统对10株菌株每天进行质谱鉴定3次,连续鉴定3d,从而验证鉴定结果的重复性,即完成精密度验证。结果毅新博创质谱对标准/质控菌株的鉴定符合率为100%;对临床菌株的属水平鉴定符合率为100%;对常见革兰氏阳性及阴性杆菌的种水平鉴定符合率95.5%;对常见革兰氏阳性球菌的种水平鉴定符合率为100%;对真菌的种水平鉴定符合率为90.9%;对苛养菌的种水平鉴定符合率为100%;对厌氧菌的种水平鉴定符合率为100%。精密度验证试验结果重复性为100%。结论MALDI-TOF MS系统在革兰氏阳性及阴性杆菌、革兰氏阳性及阴性球菌、真菌、苛养菌鉴定的准确度和精密度均符合规定要求,验证通过。展开更多
基于表面贴装元器件(Surface Mount Device,SMD)逐片检测工况中对拾取、放回料带的定位需求,提出一种适于多自由度(Multi-Degrees Of Freedom,MDOF)精确转移的视觉补偿定位方法。针对SMD逐片检测流程和布局分析,计算了元件成功放回料槽...基于表面贴装元器件(Surface Mount Device,SMD)逐片检测工况中对拾取、放回料带的定位需求,提出一种适于多自由度(Multi-Degrees Of Freedom,MDOF)精确转移的视觉补偿定位方法。针对SMD逐片检测流程和布局分析,计算了元件成功放回料槽的转移误差允许边界;分别提出了双视觉系统中上、下视觉对SMD多自由度转移的定位误差补偿方法。利用元件转移实验数据的均值-极差控制分析,分别测试所述视觉定位方法的精确性和稳定性,实验结果表明:在SMD转移过程中采用所述视觉定位方法提高了转移精度并保证转移过程稳定可控。所述研究可为成卷SMD逐片全检工艺中元件高效拾放转移、精确定位提供参考。展开更多
Ubiquitous on earth,bacteriophages are the most abundant entities in every ecosystem,but human knowledge about them is still limited compared with that about other forms of organisms.To enrich human knowledge and prom...Ubiquitous on earth,bacteriophages are the most abundant entities in every ecosystem,but human knowledge about them is still limited compared with that about other forms of organisms.To enrich human knowledge and promote the utilization of bacteriophages,it is necessary to isolate and characterize as many as possible different bacteriophages.Here we describe the isolation of a T4-like bacteriophage IME08 and a rapid method for its genetic characterization.With this method we easily cloned a few random fragments of the bacteriophage genome.Sequence analysis of these random clones showed that bacteriophage IME08 shared the highest sequence similarity with T4-like Enterobacteria phage T4（94%identity）,JS98（95% identity）,JS10（95%identity） and RB14（94%identity） respectively,which suggested that IME08 belonged to T4-like bacteriophage genus.展开更多
The emergence of new display devices,such as organic light-emitting diodes,has brought about numerous advantages,including high material utilization,low cost,and high adaptability.These devices are manufactured using ...The emergence of new display devices,such as organic light-emitting diodes,has brought about numerous advantages,including high material utilization,low cost,and high adaptability.These devices are manufactured using inkjet printing and possess the potential to become a key technology for display transformations.However,a challenge in achieving this is the display effect that reveals uneven brightness and darkness,which can be avoided by controlling the volume of ink solution in a pixel to within 5%.Currently,the volume difference among the nozzles of commercial printheads does not meet the requirements for volume uniformity,thus challenging the printing process.Therefore,designing a suitable printing method that allows for the fusion of different volumes of ink droplets,ultimately reducing the error of the post fusion process,is necessary.In this study,we propose a print display droplet fusion scheduling method comprising two main steps.First,we use a dichotomous trust domain algorithm to obtain a feasible range of printhead docking point spacings for different nozzle and pixel panel resolutions.Second,we model the printing process as a droplet fusion scheduling model based on mixed integer programming,with the optimization objective of achieving intra pixel volume uniformity via ensuring the volume uniformity of ink droplets within all pixels.We verified this method through numerical simulations and printing experiments using 394 pixels per inch(ppi)pixel panels and successfully reduced the volume uniformity error among pixels to within 5%.展开更多
Flexible electronics such as mechanically compliant displays,sensors and solar cells,have important applications in the fields of energy,national defence and biomedicine,etc.Various types of flexible electronics have ...Flexible electronics such as mechanically compliant displays,sensors and solar cells,have important applications in the fields of energy,national defence and biomedicine,etc.Various types of flexible electronics have been proposed or developed by the improvements in structural designs,material properties and device integrations.However,the manufacturing of flexible electronics receives little attention,which limits its mass production and industrialization.The increasing demands on the size,functionality,resolution ratio and reliability of flexible electronics bring several significant challenges in their manufacturing processes.This work aims to report the state-of-art technologies and applications of flexible electronics manufacturing.Three key technologies including electrohydrodynamic direct-writing,flip chip and automatic optical inspection are highlighted.The mechanism and developments of these technologies are discussed in detail.Based on these technologies,the present work develops three kinds of manufacturing equipment,i.e.,inkjet printing manufacturing equipment,robotized additive manufacturing equipment,and roll-to-roll manufacturing equipment.The advanced manufacturing processes,equipment and systems for flexible electronics pave the way for applications of new displays,smart sensing skins and epidermal electronics,etc.By reviewing the developments of flexible electronics manufacturing technology and equipment,it can be found that the existing advances greatly promote the applications and commercialization of flexible electronics.Since flexible electronics manufacturing contains many multi-disciplinary problems,the current investigations are confronted with great challenges.Therefore,further developments of the reviewed manufacturing technology and equipment are necessary to break the current limitations of manufacturing resolution,efficiency and reliability.展开更多
The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technolog...The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.展开更多
文摘基于表面贴装元器件(Surface Mount Device,SMD)逐片检测工况中对拾取、放回料带的定位需求,提出一种适于多自由度(Multi-Degrees Of Freedom,MDOF)精确转移的视觉补偿定位方法。针对SMD逐片检测流程和布局分析,计算了元件成功放回料槽的转移误差允许边界;分别提出了双视觉系统中上、下视觉对SMD多自由度转移的定位误差补偿方法。利用元件转移实验数据的均值-极差控制分析,分别测试所述视觉定位方法的精确性和稳定性,实验结果表明:在SMD转移过程中采用所述视觉定位方法提高了转移精度并保证转移过程稳定可控。所述研究可为成卷SMD逐片全检工艺中元件高效拾放转移、精确定位提供参考。
文摘Ubiquitous on earth,bacteriophages are the most abundant entities in every ecosystem,but human knowledge about them is still limited compared with that about other forms of organisms.To enrich human knowledge and promote the utilization of bacteriophages,it is necessary to isolate and characterize as many as possible different bacteriophages.Here we describe the isolation of a T4-like bacteriophage IME08 and a rapid method for its genetic characterization.With this method we easily cloned a few random fragments of the bacteriophage genome.Sequence analysis of these random clones showed that bacteriophage IME08 shared the highest sequence similarity with T4-like Enterobacteria phage T4（94%identity）,JS98（95% identity）,JS10（95%identity） and RB14（94%identity） respectively,which suggested that IME08 belonged to T4-like bacteriophage genus.
基金This work was supported by the National Natural Science Foundation of China(Grant No.51975236)the National Key Research and Development Program of China(Grant No.2018YFA0703203)Innovation Project of Optics Valley Laboratory(Grant No.OVL2021BG007).
文摘The emergence of new display devices,such as organic light-emitting diodes,has brought about numerous advantages,including high material utilization,low cost,and high adaptability.These devices are manufactured using inkjet printing and possess the potential to become a key technology for display transformations.However,a challenge in achieving this is the display effect that reveals uneven brightness and darkness,which can be avoided by controlling the volume of ink solution in a pixel to within 5%.Currently,the volume difference among the nozzles of commercial printheads does not meet the requirements for volume uniformity,thus challenging the printing process.Therefore,designing a suitable printing method that allows for the fusion of different volumes of ink droplets,ultimately reducing the error of the post fusion process,is necessary.In this study,we propose a print display droplet fusion scheduling method comprising two main steps.First,we use a dichotomous trust domain algorithm to obtain a feasible range of printhead docking point spacings for different nozzle and pixel panel resolutions.Second,we model the printing process as a droplet fusion scheduling model based on mixed integer programming,with the optimization objective of achieving intra pixel volume uniformity via ensuring the volume uniformity of ink droplets within all pixels.We verified this method through numerical simulations and printing experiments using 394 pixels per inch(ppi)pixel panels and successfully reduced the volume uniformity error among pixels to within 5%.
基金supported by the National Key Research and Development Program of China(Grant No.2018YFA0703200)the National Natural Science Foundation of China(Grant Nos.51820105008 and 52188102)。
文摘Flexible electronics such as mechanically compliant displays,sensors and solar cells,have important applications in the fields of energy,national defence and biomedicine,etc.Various types of flexible electronics have been proposed or developed by the improvements in structural designs,material properties and device integrations.However,the manufacturing of flexible electronics receives little attention,which limits its mass production and industrialization.The increasing demands on the size,functionality,resolution ratio and reliability of flexible electronics bring several significant challenges in their manufacturing processes.This work aims to report the state-of-art technologies and applications of flexible electronics manufacturing.Three key technologies including electrohydrodynamic direct-writing,flip chip and automatic optical inspection are highlighted.The mechanism and developments of these technologies are discussed in detail.Based on these technologies,the present work develops three kinds of manufacturing equipment,i.e.,inkjet printing manufacturing equipment,robotized additive manufacturing equipment,and roll-to-roll manufacturing equipment.The advanced manufacturing processes,equipment and systems for flexible electronics pave the way for applications of new displays,smart sensing skins and epidermal electronics,etc.By reviewing the developments of flexible electronics manufacturing technology and equipment,it can be found that the existing advances greatly promote the applications and commercialization of flexible electronics.Since flexible electronics manufacturing contains many multi-disciplinary problems,the current investigations are confronted with great challenges.Therefore,further developments of the reviewed manufacturing technology and equipment are necessary to break the current limitations of manufacturing resolution,efficiency and reliability.
基金supported by the National Natural Science Foundation of China (Grant Nos. 51475195, 51322507 & 91323303)National Science and Technology Support Program (Gant No. 2015BAF11B02)
文摘The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.
