LED lighting has problems such as short life span, power reduction due to the LED chip's heat, and decreased luminance efficiency etc. Many studies on the optimization of the thermal performance of LEDs have been ...LED lighting has problems such as short life span, power reduction due to the LED chip's heat, and decreased luminance efficiency etc. Many studies on the optimization of the thermal performance of LEDs have been conducted actively to solve these problems. The present study changes the fin shape and intervals of various heat sink designs so that LED can effectively produce a thermal effect. The water-cooling heat release system and the heat pipe methods show higher thermal performance results than the existing systems; however, the system is of high cost and requires a large-scale apparatus. This study carried out a numerical analysis of the thermal control system by applying heat flux and heat sink properties as an active heat release system using the commercial code ANSYS ver. 13.0 and verified the validity of the new heat sink design for temperature distribution analysis.展开更多
基金Financial aid from the Korea Ministry of Education through the Brain Korea 21 Project [HRD Center for Convergence Mechanical System Design] is gratefully acknowledgedthe financial support of Sungkyunkwan University for his sabbatical year
文摘LED lighting has problems such as short life span, power reduction due to the LED chip's heat, and decreased luminance efficiency etc. Many studies on the optimization of the thermal performance of LEDs have been conducted actively to solve these problems. The present study changes the fin shape and intervals of various heat sink designs so that LED can effectively produce a thermal effect. The water-cooling heat release system and the heat pipe methods show higher thermal performance results than the existing systems; however, the system is of high cost and requires a large-scale apparatus. This study carried out a numerical analysis of the thermal control system by applying heat flux and heat sink properties as an active heat release system using the commercial code ANSYS ver. 13.0 and verified the validity of the new heat sink design for temperature distribution analysis.
