The interfacial thermal conductance （ITC） and thermal conductivity （TC） of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were ...The interfacial thermal conductance （ITC） and thermal conductivity （TC） of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were performed to investigate the effect of thickness, sound velocity, and other parameters of coating layers on the ITC and TC. It is found that both the ITC and TC decline with increasing coating thickness, especially for the coatings with relatively low thermal conductivity. Nevertheless, if the coating thickness is close to zero, or quite a small value, the ITC and TC are mainly determined by the constants of the coating material. Under this condition, coatings such as Ni, TiC, Mo 2 C, SiC, and Si can significantly improve the ITC and TC of diamond/Al composites. By contrast, coatings like Ag will exert the negative effect. Taking the optimization of interfacial bonding into account, conductive carbides such as TiC or Mo 2 C with low thickness can be the most suitable coatings for diamond/Al composites.展开更多
A1N/A1 composites are a potentially new kind of thermal management material for electronic packaging and heat sink applications. The spark plasma sintering （SPS） technique was used for the first time to prepare the ...A1N/A1 composites are a potentially new kind of thermal management material for electronic packaging and heat sink applications. The spark plasma sintering （SPS） technique was used for the first time to prepare the A1N/A1 composites, and attention was focused on the effects of sintefing parameters on the relative density, microstructure and, in particular, thermal conductivity behavior of the composites. The results showed that the relative density and thermal conductivity of the composites increased with increasing sintering temperature and pressure. The composites sintered at 1550℃ for 5 min under 70 MPa showed the maximum relative density and thermal conductivity, corresponding to 99% and 97.5 W.m-1.K-1, respectively. However, the thermal conductivity of present A1N/A1 composites is still far below the theoretical value. Possible reasons for this deviation were discussed.展开更多
Diamond reinforced copper （Cu/diamond） composites were prepared by a pressure infilla＇ation technique. The composites show a super high conductivity of 713 W.m-1.K-1 in combination with an extremely low coefficient...Diamond reinforced copper （Cu/diamond） composites were prepared by a pressure infilla＇ation technique. The composites show a super high conductivity of 713 W.m-1.K-1 in combination with an extremely low coefficient of thermal expansion （CTE） of 7.72 × 10-6 K-1 （25-100℃）, which are achieved by modifying the copper matrix with adding 0.3 wt.% of boron to get a good thermal contact between the matrix and the diamond particles. By adopting a series of postmachining techniques the composites were made into near-net-shape parts, and an electroless silver coating was also successfully plated on the composites. Finally, their potential applications in the thermal management of fight emitting diodes （LED） were illustrated via prototype examples.展开更多
文摘The interfacial thermal conductance （ITC） and thermal conductivity （TC） of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were performed to investigate the effect of thickness, sound velocity, and other parameters of coating layers on the ITC and TC. It is found that both the ITC and TC decline with increasing coating thickness, especially for the coatings with relatively low thermal conductivity. Nevertheless, if the coating thickness is close to zero, or quite a small value, the ITC and TC are mainly determined by the constants of the coating material. Under this condition, coatings such as Ni, TiC, Mo 2 C, SiC, and Si can significantly improve the ITC and TC of diamond/Al composites. By contrast, coatings like Ag will exert the negative effect. Taking the optimization of interfacial bonding into account, conductive carbides such as TiC or Mo 2 C with low thickness can be the most suitable coatings for diamond/Al composites.
基金supported by the National Natural Science Foundation of China (No. 50971020)the National High-Tech Research and Development Program of China (No. 2008AA03Z505)
文摘A1N/A1 composites are a potentially new kind of thermal management material for electronic packaging and heat sink applications. The spark plasma sintering （SPS） technique was used for the first time to prepare the A1N/A1 composites, and attention was focused on the effects of sintefing parameters on the relative density, microstructure and, in particular, thermal conductivity behavior of the composites. The results showed that the relative density and thermal conductivity of the composites increased with increasing sintering temperature and pressure. The composites sintered at 1550℃ for 5 min under 70 MPa showed the maximum relative density and thermal conductivity, corresponding to 99% and 97.5 W.m-1.K-1, respectively. However, the thermal conductivity of present A1N/A1 composites is still far below the theoretical value. Possible reasons for this deviation were discussed.
基金supported by the National Natural Science Foundation of China (No. 50971020)the National High-Tech Research and Development Program of China (No. 2008AA03Z505)
文摘Diamond reinforced copper （Cu/diamond） composites were prepared by a pressure infilla＇ation technique. The composites show a super high conductivity of 713 W.m-1.K-1 in combination with an extremely low coefficient of thermal expansion （CTE） of 7.72 × 10-6 K-1 （25-100℃）, which are achieved by modifying the copper matrix with adding 0.3 wt.% of boron to get a good thermal contact between the matrix and the diamond particles. By adopting a series of postmachining techniques the composites were made into near-net-shape parts, and an electroless silver coating was also successfully plated on the composites. Finally, their potential applications in the thermal management of fight emitting diodes （LED） were illustrated via prototype examples.
