Using micro-electronic techniques, a high-temperature oxygen sensor with three electrodesis designed. Yttrium-doped stabilized zirconia is used to make the solid electrolyte and thesupporting substrate for the electro...Using micro-electronic techniques, a high-temperature oxygen sensor with three electrodesis designed. Yttrium-doped stabilized zirconia is used to make the solid electrolyte and thesupporting substrate for the electrodes. A gold resistance thermometer is installed on thesensor to directly monitor the temperature of gas. The platinum film is covered with aporous alumina coating, to reduce the flow effect on the sensor output and prolong thesensor’s life. Tests, conducted at 650-900℃ in the mixture of oxygen and nitrogen withthe spanning 0-32.7% oxygen concentration, indicate that the sensor is of higher sensitivity,better reproducibility and durability, fast response, but relatively large current outputs areachieved simultaneously. The sensor fabricated using photolithographic reduction and thick-film metallization techniques is conductive to substantial miniaturization.展开更多
基金Project supported by the National Natural Science Foundation of China and the Edison Sensor Technology Center, Department of Development of the State of Ohio, USA.
文摘Using micro-electronic techniques, a high-temperature oxygen sensor with three electrodesis designed. Yttrium-doped stabilized zirconia is used to make the solid electrolyte and thesupporting substrate for the electrodes. A gold resistance thermometer is installed on thesensor to directly monitor the temperature of gas. The platinum film is covered with aporous alumina coating, to reduce the flow effect on the sensor output and prolong thesensor’s life. Tests, conducted at 650-900℃ in the mixture of oxygen and nitrogen withthe spanning 0-32.7% oxygen concentration, indicate that the sensor is of higher sensitivity,better reproducibility and durability, fast response, but relatively large current outputs areachieved simultaneously. The sensor fabricated using photolithographic reduction and thick-film metallization techniques is conductive to substantial miniaturization.
