Determination of interfacial heat transfer coefficient and its application in high pressure die casting process

In this paper,the research progress of the interfacial heat transfer in high pressure die casting(HPDC)is reviewed.Results including determination of the interfacial heat transfer coefficient(IHTC),influence of casting thickness,process parameters and casting alloys on the IHTC are summarized and discussed.A thermal boundary condition model was developed based on the two correlations:(a)IHTC and casting solid fraction and(b)IHTC peak value and initial die surface temperature.The boundary model was then applied during the determination of the temperature field in HPDC and excellent agreement was found.

集成电路核心工艺装备技术的现状与展望

集成电路装备产业是集成电路产业链的重要组成部分,拥有极高的技术门槛。文章从分析国内外集成电路装备产业的发展现状、核心工艺装备技术的发展趋势及配套关键部件技术面临的挑战等方面入手,剖析中国集成电路装备产业的问题与痛点,探求产业和技术的发展趋势,进而对中国集成电路装备产业在此背景下的发展提出对策与建议。