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Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test 被引量:4
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作者 chen chuantong Zhang Hao +2 位作者 Jiu Jinting Long Xu Suganuma Katsuaki 《China Welding》 CAS 2022年第1期15-21,共7页
The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal ... The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal cycling(–50 ℃–250 ℃) in SiC/DBC(direct bonding copper) die attachment structure for different time.During harsh thermal shock test,the strength of sintered joint deceased gradually with the increase of cycling number,and the value just was half of the value of as-sintered after 1 000 cycles.Coarsening of Ag grains was observed in micron-porous joint with the structure inhomogeneity and defects increasing,which were the reasons of the strength decease.In addition,it was also found that the fracture behavior of sintered joints was changed from ductile deformation of Ag grain to brittle fracture of crack propagation after 1 000 cycles.This study will add the understanding in the mechanical properties of Ag sinter joining and its applications at high temperature. 展开更多
关键词 power module high-temperature reliability Ag sinter joining low stress structure thermal shock test
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纳米压痕下单/多层薄膜弹塑性本构的无量纲分析 被引量:4
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作者 龙旭 申子怡 +4 位作者 贾啟普 李娇 陈传彤 刘永超 苏昱太 《中国科学:物理学、力学、天文学》 CSCD 北大核心 2023年第1期51-61,共11页
针对薄膜-基体结构特点,本文基于纳米压痕测试所得荷载-位移曲线,从加载阶段的荷载与功的角度出发,将薄膜材料的本构参数(弹性模量、硬化指数、屈服强度)作为荷载-位移曲线的影响参数并对其进行无量纲组合.结合有限元仿真分析结果将无... 针对薄膜-基体结构特点,本文基于纳米压痕测试所得荷载-位移曲线,从加载阶段的荷载与功的角度出发,将薄膜材料的本构参数(弹性模量、硬化指数、屈服强度)作为荷载-位移曲线的影响参数并对其进行无量纲组合.结合有限元仿真分析结果将无量纲函数公式化表达,提出适应于单层弹塑性薄膜材料的本构参数求解方法.通过与机器学习算法基于大量压痕数据预测所得本构参数进行对比,验证本文所提出无量纲函数在复现有限元预测结果方面的优势.此外,通过所提出“复合本构参数”的概念,基于本文提出的单层薄膜求解方法,逐层求解未知单层薄膜本构参数,最终确定多层薄膜的本构参数.本文的力学性能研究工作对提高薄膜系统和基于薄膜技术的器件可靠性和寿命具有重大意义. 展开更多
关键词 薄膜 纳米压痕 量纲分析 弹塑性本构 有限元计算
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