Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.

Study on the thermal deformation behavior and microstructure of FGH96 heat extrusion alloy during two-pass hot deformation

The change rules associated with hot deformation of FGH96 alloy were investigated by isothermal two-pass hot deformation tests in the temperature range 1050–1125°C and at strain rates ranging from 0.001 to 0.1 s^(-1) on a Gleeble 3500 thermo-simulation machine. The results showed that the softening degree of the alloy between passes decreases with increasing temperature and decreasing strain rates. The critical strain of the first-pass is greater than that of the second-pass. The true stress–true strain curves showed that single-peak dynamic recrystallization, multi-peak dynamic recrystallization, and dynamic response occur when the strain rate is 0.1, 0.01, and 0.001 s^(-1), respectively. The alloy contains three different grain structures after hot deformation: partially recrystallized tissue, completely fine recrystallized tissue, coarse-grained grains. The small-angle grain boundaries increase with increasing temperature. Increasing strain rates cause the small-angle grain boundaries to first increase and then decrease.

Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration

Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.

Fabrication and thermal conductivity of copper matrix composites reinforced by tungsten-coated carbon nanotubes

Carbon nanotubes （CNTs） were coated by tungsten using metal organic chemical vapor deposition. Magnetic stirring was employed to disperse the W-coated CNTs （W-CNTs） in a Cu matrix, and then, the mixed powders were consolidated by spark plasma sintering. The W-CNTs obtained a uniform dispersion within the Cu matrix when the W-CNT content was less than 5.0vo1%, but high content of W-CNTs （10vol%） resulted in the presence of clusters. The W-CNT/Cu composites containing low content of W-CNTs （〈5.0vol%） exhibited a higher thermal conductivity than the sintered pure Cu, while the CNT/Cu composites exhibited no increase in thermal conductivity after the incorporation of uncoated CNTs. The W-CNT content was found to play a crucial role in determining the thermal conductivity of the W-CNT/Cu composites. The thermal conductivity of the W-CNT/Cu composites increased first and then decreased with the W-CNT content increasing. When the W-CNT content was 2.5vo1%, the W-CNT/Cu composite obtained the maximum value of thermal conductivity. The thermal resistance of the （W-CNT）-Cu interface was predicted in terms of Maxwell-Gamett effective medium approximation, and its calculated value was about 3.0× 10-9 m2.K.W-l.

Effects of boron on the microstructure and thermal properties of Cu/diamond composites prepared by pressure infiltration

Diamond reinforced copper（Cu/diamond） composites were prepared by pressure infiltration for their application in thermal management where both high thermal conductivity and low coefficient of thermal expansion（CTE） are important.They were characterized by the microstructure and thermal properties as a function of boron content,which is used for matrix-alloying to increase the interfacial bonding between the diamond and copper.The obtained composites show high thermal conductivity（660 W/（m·K）） and low CET（7.4×10-6 K-1） due to the formation of the B13C2 layer at the diamond-copper interface,which greatly strengthens the interfacial bonding.Thermal property measurements indicate that in the Cu-B/diamond composites,the thermal conductivity and the CTE show a different variation trend as a function of boron content,which is attributed to the thickness and distribution of the interfacial carbide layer.The CTE behavior of the present composites can be well described by Kerner＇s model,especially for the composites with 0.5wt% B.

Fabrication and sintering behavior of high-nitrogen nickel-free stainless steels by metal injection molding

High-nitrogen nickel-free stainless steels were fabricated by the metal injection molding technique using high nitrogen alloying powders and a mixture of three polymers as binders.Mixtures of metal powders and binders with various proportions were also investigated, and an optimum powder loading capacity was determined as 64vol%.Intact injection molded compacts were successfully obtained by regulating the processing parameters.The debinding process for molded compacts was optimized with a combination of thermo-gravimetric analysis and differential scanning calorimetry analysis.An optimum relative density and nitrogen content of the specimens are obtained at 1360℃,which are 97.8%and 0.79wt%,respectively.

Dielectric properties of spark plasma sintered AlN/SiC composite ceramics

In this study, we have investigated how the dielectric loss tangent and permittivity of AlN ceramics are affected by factors such as powder mixing methods, milling time, sintering temperature, and the addition of a second conductive phase. All ceramic samples were pre-pared by spark plasma sintering （SPS） under a pressure of 30 MPa. AlN composite ceramics sintered with 30wt%-40wt%SiC at 1600℃ for 5 min exhibited the best dielectric loss tangent, which is greater than 0.3. In addition to AlN and β-SiC, the samples also contained 2H-SiC and Fe5Si3, as detected by X-ray difraction （XRD）. The relative densities of the sintered ceramics were higher than 93%. Experimental results indicate that nano-SiC has a strong capability of absorbing electromagnetic waves. The dielectric constant and dielectric loss of AlN-SiC ce-ramics with the same content of SiC decreased as the frequency of electromagnetic waves increased from 1 kHz to 1 MHz.

Simulation of jet-flow solid fraction during spray forming

A numerical model was developed to simulate the jet-flow solid fraction of W18Cr4 V high-speed steel during spray forming. The whole model comprises two submodels: one is an individual droplet model, which describes the motion and thermal behaviors of individual droplets on the basis of Newton's laws of motion and the convection heat transfer mechanism; the other is a droplet distribution model, which is used to calculate the droplet size distribution. After being verified, the model was used to analyze the effects of parameters, including the initial gas velocity, deposition distance, superheat degree, and the ratio of gas-to-metal mass flow rates, on the jet-flow solid fraction. Finally, an equation to predict the jet-flow solid fraction directly and conveniently according to the parameters was presented. The values predicted by the equation show good agreement with those calculated by the numerical model.

Low-temperature heat conduction characteristics of diamond/Cu composite by pressure infiltration method

In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.

Preparation and radar-absorbing properties of Al2O3/TiO2/Fe2O3/Yb2O3 composite powder

Al2O3/TiOe/FeeO3/Yb2O3 composite powder was synthesized via the sol-gel method. The structure, morphology, and ra- dar-absorption properties of the composite powder were characterized by transmission electron microscopy, X-ray diffraction analysis and RF impedance analysis. The results show that two types of particles exist in the composite powder. One is irregular flakes （100-200 rim） and the other is spherical A1203 particles （smaller than 80 rim）. Electromagnetic wave attenuation is mostly achieved by dielectric loss. The maximum value of the dissipation factor reaches 0.76 （at 15.68 GHz） in the frequency range of 2-18 GHz. The electromagnetic absorption of waves covers 2-18 GHz with the matching thicknesses of 1.5-4.5 mm. The absorption peak shifts to the lower-frequency area with increas- ing matching thickness. The effective absorption hand covers the frequency range of 2.16-9.76 GHz, and the maximum absorption peak reaches -20.18 dB with a matching thickness of 3.5 mm at a frequency of 3.52 GHz.

Effects of process parameters on nonaqueous gelcasting for copper powder

An approach to fabricate sintered copper with high green strength and high sintered density using nonaqueous gelcasting technol- ogy is presented in this study. The effects of various gelcasting processing parameters such as monomer content, monomer/crosslinker ratio, initiator content, dispersant dosage, and temperature on the flexural strength of dried green bodies and the relative density of sintered bodies were studied to obtain better microstructures and properties. The appropriate process parameters obtained for copper gelcasting are as follows monomer content, 20vol%-30vol% （based on the total volume of reagents）; monomer/crosslinker ratio, 10：1 to 20：1; initiator content, 3vol%-4vol% （based on the volume of the monomer）; dispersant dosage, 1.5wt%-2.5wt% （based on the mass of the copper powder）; and reaction temperature, 65-75℃.

Influence of plasma on the densification mechanism of SPS under multi-field effect

The densification mechanism of an Fe-based alloy powder containing tiny oxide particles under the synergic multi-field effect of spark plasma sintering （SPS） was investigated. Metallographic microscopy and scanning electron microscopy were used to observe the morphology of samples sintered at different temperatures, and the temperature dislribution in an individual spherical powder particle during sintering was calculated in consideration of the influence of plasma, which was qualified and quantified through the analysis of the U-Icurve. The plasma was observed to play a substantial role in activating and heating the samples at the very early stage of sintering, whereas the joule-heat effect played a dominant role during sintering. Moreover, the plasma also facilitated the diffusion and migration of materials for neck formation.

Fabrication of tungsten films by metallorganic chemical vapor deposition

Tungsten films growing on copper substrates were fabricated by metallorganic chemical vapor deposition （MOCVD）. The chemi-cal purity, crystallographic phase, cross-sectional texture, and resistivity of the deposited films both before and after annealing treatment were investigated by X-ray energy-dispersive spectroscopy （EDS）, X-ray diffraction （XRD）, scanning electron microscopy （SEM）, and four-point probe method. It is found that the films deposited at 460°C are metastable β-W with （211） orientation and can change into α-W when an-nealed in high-purity hydrogen atmosphere at high temperature. There are small amounts of C and O in the films, and the W content of the films increases with increasing deposition temperature and also goes up after annealing in high-purity hydrogen atmosphere. The films have columnar microstructures and the texture evolution during their growth on copper substrates can be divided into three stages. The resistivity of the as-deposited films is in the range of 87-104 μΩ·cm, and low resistivity is obtained after annealing in high-purity hydrogen atmosphere.

Study on the preparation of Pt nanocapsules

Ag@Pt core-shell nanoparticles（Ag@Pt NPs） were prepared by a co-reduction method. Pt nanocapsules with diameters of less than 10 nm were obtained by an electrochemical method. Cyclic voltammetry（CV） scanning was used to cavitate the Ag@Pt NPs, and the morphology, structure, and cavitation conditions were studied. The results indicate that the effective cavitation conditions to obtain Pt nanoparticles from Ag@Pt NPs are a scanning voltage of 0 to 0.8 V and continuous CV scanning over 2 h. This cavitation method is also applicable for the syntheses of Ir, Ru, and Ru-Pt nanocapsules.

Microstructures and Mechanical Properties of X100 Pipeline Steel Strip

Dynamic CCT （continuous cooling transformation） curves and effects of microstructures and M/A islands of X100 hot rolled strip on mechanical properties were studied by means of a thermal simulator, a scanning electron mi- croscope （SEM）, a transmission electron microscope （TEM）, a digital micro-hardness tester and Image-Pro Plus analysis software. The results show that high contents of C and Mo can make transformation lines of acicular ferrite and bain- ite shift rightward. High Mo tested strip has higher strength and micro-hardness and lower toughness than the other one because lath bainite appears instead of quasi-polygonal ferrite. Tested strip with granular bainite, lath bainite and M/A islands has better mechanical properties and in the microstructures lath bainite content is around 36.50% and M/A islands are fine and disperse in the matrix.

Spherical modification of tungsten oxide powder and its mechanism analysis

Owing to its high production costs, complexity of equipment, and difficulty in controlling parameters, spherical or subglobose tungsten powder preparation method cannot meet the demand of industrial production. Tungstic oxide powder was treated by particle composite system and its effects were studied. Morphologies of par- ticles were investigated by scanning electron microscopy （SEM）. Particle size analysis was carried out and the related mechanism was discussed. The results show that the processing effect is best when the rotational speed is set at 4,000 r.min-1 for 15 rain： the powder particles become nearly spherical and their sharp edge angles are rounded off and reshaped. When the processing time is 60 min, the powders smash to pieces because of too much energy inputting. So the test results, such as grain size distribution, can be explained well. Nearly spherical tungsten powder is obtained after reduction at 780 ℃ for 2 h and its flow ability is significantly improved.

Dielectric properties of AlN/Mo composite ceramics prepared by spark plasma sintering method at different processing conditions

In this study,the effects of powder mixed method,sintering temperature,and the additive amount of the conductive phase on the dielectric loss tangent and permittivity constant of AlN/Mo composite ceramics were investigated.All the ceramic samples were prepared by spark plasma sintering(SPS).AlN composite ceramics with additional 10 vol%Mo sintered at 1400℃holding for 5 min exhibit the best dielectric loss tangent,which is greater than 0.23.AlN/Mo ceramics with additional 20 vol%Mo become conductive,with the resistivity of 0.05–0.06Ω·m.High-energy ball milling is better than magnetic stirring powder mixing method.In addition,the additive Mo and lower sintering temperature lead to a better property with the increase in the electromagnetic wave frequency range of 1×10^(3)–1×10^(6)Hz.

Spherical modification of tungsten powder by particle composite system

Owing to contradiction between increasing demand of spherical tungsten powder and limitation of traditional manufacturing technology,a novel preparation method was developed to sphericize the polygonal tungsten powder by means of modification of particle composite system.Tungsten powder particles were modified by par-ticle composite system,and detailed characterization by scanning electron microscopy(SEM)was studied.Particle size distribution and function mechanism were analyzed,and the internal relationship between average diameter and processing time was discussed.The results show that the spherical tungsten powder with an average diameter of 6.41μm is obtained from polyhedral tungsten powder with an average diameter of 7.50μm.The spherical effect could be achieved(sharp edge angles of particles are rounded off and reshaped)when the processing time is over 30 min.The relationship between average diameter(d)and pro-cessing time can be described by the exponential decay model,which provides a good interpretation for the process of modification.The relationship between them can be expressed by the equation d=1.87406exp(-x/8.92718)+6.4182.The proposed method could readily enable large-scale production of spherical tungsten powder.

Evolution of thermo-physical properties of diamond/Cu composite materials under thermal shock load

In this paper, the two-flume method was used to study the change laws of the thermal conductivity and thermal expansion coefficient of diamond/Cu composite materials with 100, 300, and 500 cycle numbers, under the action of thermal shock load between-196 and 85 °C; the X-ray diffraction method（XRD） was used to study the change of the residual stress in the thermal shock process of the diamond/Cu composite materials; and the evolution of the fracture microstructure with different thermal shock cycle numbers was observed through scanning electron microscopy（SEM）. The results of the study show that the increase of the binder residue at the interface reduces the thermal shock stability of the diamond/Cu composite materials. In addition, under the thermal shock load between-196 and 85 °C, the residual stress of the diamond/Cu composite materials increases continuously with the increase of the cycle numbers, the increase of residual stress leads to a small amount of interface debonding, an increase of the interfacial thermal resistances, and a decrease of the constraints of low-expansion component on material deformation, thus the thermal conductivity decreases slightly and the thermal expansion coefficient increases slightly.