Co evolutions for WC-Co with different Co contents during pretreatment and HFCVD diamond film growth processes

Systematical researches were accomplished on WC-Co with different Co contents(6%,10%and 12%,mass fraction).Based on the XPS and EDX,from orthogonal pretreatment experiments,it is indicated that the acid concentration,the time of the acid pretreatment and the original Co content have significant influences on the Co-removal depth(D).Moreover,the specimen temperature,original Co content and Co-removal depth dependences of the Co evolution in nucleation,heating(in pure H2 atmosphere)and growth experiments were discussed,and mechanisms of Co evolutions were summarized,providing sufficient theoretical bases for the deposition of high-quality diamond films on WC-Co substrates,especially Co-rich WC-Co substrates.It is proven that the Co-rich substrate often presents rapid Co diffusion.The high substrate temperature can promote the Co diffusion in the pretreated substrate,while acts as a Co-etching process for the untreated substrates.It is finally found that the appropriate Co-removal depth for the WC-12%Co substrate is 8-9μm.

Approach for Polishing Diamond Coated Complicated Cutting Tool: Abrasive Flow Machining(AFM)

Lower surface roughness and sharper cutting edge are beneficial for improving the machining quality of the cut?ting tool, while coatings often deteriorate them. Focusing on the diamond coated WC?Co milling cutter, the abrasive flow machining(AFM) is selected for reducing the surface roughness and sharpening the cutting edge. Comparative cutting tests are conducted on di erent types of coated cutters before and after AFM, as well as uncoated WC?Co one, demonstrating that the boron?doped microcrystalline and undoped fine?grained composite diamond coated cutter after the AFM(AFM?BDM?UFGCD) is a good choice for the finish milling of the 6063 Al alloy in the present case, because it shows favorable machining quality close to the uncoated one, but much prolonged tool lifetime. Besides, compared with the micro?sized diamond films, it is much more convenient and e cient to finish the BDM?UFGCD coated cutter covered by nano?sized diamond grains, and resharpen its cutting edge by the AFM, owing to the lower initial surface roughness and hardness. Moreover, the boron incorporation and micro?sized grains in the underly?ing layer can enhance the film?substrate adhesion, avoid the rapid film removal in the machining process, and thus maximize the tool life(1040 m, four times more than the uncoated one). In general, the AFM is firstly proposed and discussed for post?processing the diamond coated complicated cutting tools, which is proved to be feasible for improving the cutting performance

Fabrication and application of nano/microcrystalline composite diamond coated drawing dies using alternative carbon sources

Nano/microcrystalline composite diamond films were deposited on the holes of WC-6%Co drawing dies by a two-step procedure using alternative carbon sources, i.e., methane for the microcrystalline diamond（MCD） layer and acetone for the nanocrystalline diamond（NCD） layer. Moreover, the monolayer methane-MCD and acetone-NCD coated drawing dies were fabricated as comparisons. The adhesion and wear rates of the diamond coated drawing dies were also tested by an inner hole polishing apparatus. Compared with mono-layer diamond coated drawing die, the composite diamond coated one exhibits better comprehensive performance, including higher adhesive strength and better wear resistance than the NCD one, and smoother surface（Ra=65.3 nm） than the MCD one（Ra=95.6 nm） after polishing at the same time. Compared with the NCD coated drawing die, the working lifetime of the composite diamond coated one is increased by nearly 20 times.