期刊文献+
共找到5篇文章
< 1 >
每页显示 20 50 100
Mechanical responses and crystal plasticity model of CoCrNi medium-entropy alloy under ramp wave compression
1
作者 Jinlei Dong Xuping Zhang +6 位作者 Guiji Wang Xianqian Wu Binqiang Luo Xuemiao Chen Fuli Tan Jianheng Zhao chengwei sun 《Matter and Radiation at Extremes》 SCIE EI CSCD 2024年第5期93-108,共16页
It is of substantial scientific significance and practical value to reveal and understand the multiscale mechanical properties and intrinsic mechanisms of medium-entropy alloys(MEAs)under high strain rates and pressur... It is of substantial scientific significance and practical value to reveal and understand the multiscale mechanical properties and intrinsic mechanisms of medium-entropy alloys(MEAs)under high strain rates and pressures.In this study,the mechanical responses and deformation mechanisms of an equiatomic CoCrNi MEA are investigated utilizing magnetically driven ramp wave compression(RWC)with a strain rate of 105 s^(−1).The CoCrNi MEA demonstrates excellent dynamic mechanical responses and yield strength under RWC compared with other advanced materials.Multiscale characterizations reveal that grain refinement and abundant micromechanisms,including dislocation slip,stacking faults,nanotwin network,and Lomer–Cottrell locks,collectively contribute to its excellent performance during RWC.Furthermore,dense deformation twins and shear bands intersect,forming a weave-like microstructure that can disperse deformation and enhance plasticity.On the basis of these observations,we develop a modified crystal plasticity model with coupled dislocation and twinning mechanisms,providing a relatively accurate quantitative description of the multiscale behavior under RWC.The results of simulations indicate that the activation of multilevel microstructures in CoCrNi MEA is primarily attributable to stress inhomogeneities and localized strain during RWC.Our research offers valuable insights into the dynamic mechanical responses of CoCrNi MEA,positioning it as a promising material for use under extreme dynamic conditions. 展开更多
关键词 DEFORMATION ALLOY MICROSTRUCTURE
下载PDF
Editorial for the Special Issue on Deep Matter & Energy
2
作者 Ho-Kwang Mao chengwei sun 《Engineering》 SCIE EI 2019年第3期351-351,共1页
Volatile elements—such as carbon, hydrogen, sulfur, nitrogen, and halogens—are minor constituents of Earth’s deep interior. Despite their low abundances, deep volatiles mediate major Earth processes, including magm... Volatile elements—such as carbon, hydrogen, sulfur, nitrogen, and halogens—are minor constituents of Earth’s deep interior. Despite their low abundances, deep volatiles mediate major Earth processes, including magma generation, volcanism, mantle convection, and plate tectonics, which control the exchange of volatiles between Earth’s deep interior and its surface. Over geological time, deep volatiles play critical, primary roles in governing energy resources, natural hazards, atmospheric composition, climate, and planetary habitability. Human activities after the industrial revolution have played an impactful, secondary role, and the resulting risk of add-on effects that could lead to irreversible runaway catastrophes has greatly increased. 展开更多
关键词 DEEP MATTER & ENERGY SPECIAL ISSUE
下载PDF
The on-chip thermoelectric cooler:advances,applications and challenges
3
作者 Chengjun Li Yubo Luo +7 位作者 Wang Li Boyu Yang chengwei sun Wenyuan Ma Zheng Ma Yingchao Wei Xin Li Junyou Yang 《Chip》 EI 2024年第2期96-108,共13页
With the development of 5G technology and increasing chip integration,traditional active cooling methods struggle to meet the growing thermal demands of chips.Thermoelectric coolers(TECs)have garnered great attention ... With the development of 5G technology and increasing chip integration,traditional active cooling methods struggle to meet the growing thermal demands of chips.Thermoelectric coolers(TECs)have garnered great attention due to their rapid response,significant cooling differentials,strong compatibility,high stability and controllable device dimensions.In this review,starting from the fundamental principles of thermoelectric cooling and device design,high-performance thermoelectric cooling materials are summarized,and the progress of advanced on-chip TECs is comprehensively reviewed.Finally,the paper outlines the challenges and opportunities in TEC design,performance and applications,laying great emphasis on the critical role of thermoelectric cooling in addressing the evolving thermal management requirements in the era of emerging chip technologies. 展开更多
关键词 CHIP Thermal management Thermoelectric materials Thermoelectric cooler Cooling performance
原文传递
Nanoscale all-optical devices based on surface plasmon polaritons 被引量:4
4
作者 Jianjun Chen chengwei sun Xiaoyong Hu 《Chinese Science Bulletin》 SCIE EI CAS 2014年第22期2661-2665,共5页
Surface plasmon polariton,a kind of surface electromagnetic wave propagating along the interface between metals and dielectrics,provides an excellent platform for the realization of integrated photonic devices due to ... Surface plasmon polariton,a kind of surface electromagnetic wave propagating along the interface between metals and dielectrics,provides an excellent platform for the realization of integrated photonic devices due to its unique properties of confining light into subwavelength scales.Our recent research progresses of nanoscale integrated photonic devices based on surface plasmon polaritons,including all-optical switches,all-optical logic discriminator,and all-optical routers,are introduced in detail. 展开更多
关键词 表面等离子体激元 全光器件 纳米 光子器件 全光路由器 波的传播 全光开关 全光逻辑
原文传递
On-chip polarization splitter based on a multimode plasmonic waveguide 被引量:1
5
作者 FENGYUAN GAN chengwei sun +2 位作者 HONGYUN LI QIHUANG GONG JIANJUN CHEN 《Photonics Research》 SCIE EI 2018年第1期47-53,共7页
The miniaturization of polarization beam splitters(PBSs) is vital for ultradense chip-scale photonic integrated circuits. However, the small PBSs based on complex hybrid plasmonic structures exhibit large fabrication ... The miniaturization of polarization beam splitters(PBSs) is vital for ultradense chip-scale photonic integrated circuits. However, the small PBSs based on complex hybrid plasmonic structures exhibit large fabrication difficulties or high insertion losses. Here, by designing a bending multimode plasmonic waveguide, an ultrabroadband on-chip plasmonic PBS with low insertion losses is numerically and experimentally realized. The multimode plasmonic waveguide, consisting of a metal strip with a V-shaped groove on the metal surface, supports the symmetric and antisymmetric surface plasmon polariton(SPP) waveguide modes in nature. Due to the different field confinements of the two SPP waveguide modes, which result in different bending losses, the two incident SPP waveguide modes of orthogonal polarization states are efficiently split in the bending multimode plasmonic waveguide. The numerical simulations show that the operation bandwidth of the proposed PBS is as large as 430 nm because there is no resonance or interference effect in the splitting process. Compared with the complex hybrid plasmonic structure, the simple bending multimode plasmonic waveguide is much easier to fabricate. In the experiment, a broadband(Δλ≈ 120 nm) and low-insertion-loss(<3 dB with a minimum insertion loss of 0.7 dB) PBS is demonstrated by using the strongly confined waveguide modes as the incident sources in the bending multimode plasmonic waveguide. 展开更多
关键词 超宽带芯片 等离子体 波导 通讯技术
原文传递
上一页 1 下一页 到第
使用帮助 返回顶部