Introduction
The process development of copper/low-K backends is unique in the semiconductor industry. Thereare a substantial number of alternative integrationapproaches to the dual damascene copper processthat incorp...Introduction
The process development of copper/low-K backends is unique in the semiconductor industry. Thereare a substantial number of alternative integrationapproaches to the dual damascene copper processthat incorporates a low-K dielectric. With the multi-plicity of integration approaches and materials, therequirements on the CMP processes are highly spe-cific to each integration scheme, in particular forwhat is labeled the second step, or copper barrierCMP step.展开更多
文摘Introduction
The process development of copper/low-K backends is unique in the semiconductor industry. Thereare a substantial number of alternative integrationapproaches to the dual damascene copper processthat incorporates a low-K dielectric. With the multi-plicity of integration approaches and materials, therequirements on the CMP processes are highly spe-cific to each integration scheme, in particular forwhat is labeled the second step, or copper barrierCMP step.
