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Influence of Ti on Weld Microstructure and Mechanical Properties in Large Heat Input Welding of High Strength Low Alloy Steels 被引量:3
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作者 A-rong Lin ZHAO +1 位作者 chuan pan Zhi-ling TIAN 《Journal of Iron and Steel Research International》 SCIE EI CAS CSCD 2015年第5期431-437,共7页
The influence of Ti on weld microstructure and mechanical properties in large heat input welding of high strength low alloy steels is investigated. The results indicate that a moderate amount of Ti is still effective ... The influence of Ti on weld microstructure and mechanical properties in large heat input welding of high strength low alloy steels is investigated. The results indicate that a moderate amount of Ti is still effective for grain refinement even under larger heat input and a large amount of acicular ferrite (AF) is formed in the weld metal when Ti content is within 0. 028%--0. 038%. With increasing Ti content, proeutectoid ferrite in the weld metal decreases, whereas bainite and M-A constituent increase. The type of inclusion in the welds varies from Mn-Si-AI-O to Ti-Mn- A1-O and finally to Ti-A1-O as Ti content increases from 0 up to 0. 064%. As for adding 0. 028%--0. 038% Ti, high weld toughness could be attained since most inclusions less than 2 tim which contain Ti20s provide the effective nu- clei for aeicular ferrite formation. However, the toughness of the weld metals severely reduces when Ti content is over the optimum ranRe of 0. 028%--0. 038%. 展开更多
关键词 large heat input welding TI MICROSTRUCTURE acicular ferrite INCLUSION high strength low alloy steel
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Ultrasound-Assisted Transient Liquid Phase Bonding of Magnesium Alloy Using Brass Interlayer in Air 被引量:8
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作者 Zhiwei Lai Ruishan Xie +4 位作者 chuan pan Xiaoguang Chen Lei Liu Wenxian Wang Guisheng Zou 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2017年第6期567-572,共6页
The microstructure evolution and oxide film behavior in ultrasound-assisted transient liquid phase(U-TLP) bonding of Mg alloy were investigated by applying different ultrasonic time at 460?C with brass interlayer i... The microstructure evolution and oxide film behavior in ultrasound-assisted transient liquid phase(U-TLP) bonding of Mg alloy were investigated by applying different ultrasonic time at 460?C with brass interlayer in air. The results indicated that with increasing ultrasonic time, brass interlayer disappeared gradually and the Mg-Cu-Zn eutectic compounds were formed. The eutectic compounds in the joint decreased as the ultrasonic time increased further. The oxide removal process was divided into four steps. Continuous oxide film at the interface was partially fractured by ultrasonic vibration,and then suspended into liquid by undermining eutectic reaction. After that, the suspended oxide film was broken into small oxide fragments by ultrasonic cavitation effect, which was finally squeezed out of the joint by ultrasonic squeeze action. In addition, the mechanical properties of the joints were investigated. The maximum shear strength of the joint reached 105 MPa, which was 100% of base metal. 展开更多
关键词 Magnesium alloy Bonding Ultrasound Oxide film Microstructure
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Rapid Ultrasonic-Assisted Soldering of AZ31B Mg Alloy/6061 Al Alloy with Low-Melting-Point Sn–xZn Solders Without Flux in Air 被引量:1
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作者 Zhi-Wei Lai Zhe-Yuan Huang +5 位作者 chuan pan Hui-Qiao Du Xiao-Guang Che Lei Liu Wei-Ming Long Gui-Sheng Zou 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2019年第3期332-342,共11页
A novel ultrasonic-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn–x Zn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa a... A novel ultrasonic-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn–x Zn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa at soldering temperature of 300 °C under ultrasonic assistance for only 5 s using Sn–20 Zn solder. The fracture path propagates completely in the soldering seam. The results indicate that the microjet generated by ultrasonic pressure in liquid solder could strike and splinter the Mg_2Sn intermetallic compounds into small pieces, which contributes to the enhancement of the joint strength. In addition, the primary Al(Zn) solid solution phase formed during cooling stage could also strengthen the joint due to the prevention of microcracks propagation. 展开更多
关键词 ULTRASONIC-ASSISTED SOLDERING Ultrasonic effect mechanism MICROJET INTERMETALLIC compound distribution Solid solution Joint strengthening
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