The corrosion kinetics and patina(corrosion products) layer evolution of galvanized steel submitted to wet/dry cyclic corrosion test in a simulated coastal-industrial atmosphere was investigated. The results show that...The corrosion kinetics and patina(corrosion products) layer evolution of galvanized steel submitted to wet/dry cyclic corrosion test in a simulated coastal-industrial atmosphere was investigated. The results show that zinc coating has a greater corrosion rate during the initial period and a lower corrosion rate during the subsequent period, and the patina composition and structure can greatly affect the corrosion kinetics evolution of zinc coating. Moreover, Zn5(OH)6(CO3)2 and Zn4(OH)6 SO4 are identified as the main stable composition and exhibit an increasing relative amount;while Zn12(OH)15Cl3(SO4)3 cannot stably exist and diminish in the patina layer as the corrosion develops.展开更多
Motivated by the increasing use of Sn-3.0 Ag-0.5 Cu(SAC305)solder in electronics worked in marine atmospheric environment and the uneven distribution of Ag3Sn and Cu6Sn5 intermetallic compounds(IMCs)inβ-Sn matrix,com...Motivated by the increasing use of Sn-3.0 Ag-0.5 Cu(SAC305)solder in electronics worked in marine atmospheric environment and the uneven distribution of Ag3Sn and Cu6Sn5 intermetallic compounds(IMCs)inβ-Sn matrix,comb-like electrodes have been designed for in-situ EIS measurements to study the microstructure induced galvanic corrosion evolution of SAC305 solder in simulated marine atmosphere with high-temperature and high-humidity.Results indicate that in-situ EIS measurement by comb-like electrodes is an effective method for corrosion evolution behavior study of SAC305 solder.Besides,the galvanic effect between Ag3Sn IMCs andβ-Sn matrix can aggravate the corrosion of both as-received and furnace-cooled SAC305 solder as the exposure time proceeds in spite of the presence of corrosion product layer.Pitting corrosion can be preferentially found on furnace-cooled SAC305 with larger Ag3Sn grain size.Moreover,the generated inner stress during phases transformation process with Sn3O(OH)2Cl2 as an intermediate and the possible hydrogen evolution at local acidified sites are supposed to be responsible for the loose,porous,cracked,and non-adherent corrosion product layer.These findings clearly demonstrate the corrosion acceleration behavior and mechanism of SAC305 solder,and provide potential guidelines on maintenance of microelectronic devices for safe operation and longer in-service duration.展开更多
The stable operation of electronic devices in marine atmospheric environment is affected by the corrosion deterioration of solder joints,and the effects by atmosphere temperature and chloride deposition are critical.I...The stable operation of electronic devices in marine atmospheric environment is affected by the corrosion deterioration of solder joints,and the effects by atmosphere temperature and chloride deposition are critical.In this work,NaCl deposition and temperature dependent corrosion of Pb-free SAC305 solder in simulated marine atmosphere has been investigated.The results indicate that higher NaCl deposition prolongs the surface wetting time and leads to the final thicker saturated electrolyte film for further corrosion.Higher temperature accelerates the evaporation and contributes to the final thinner saturated NaCl electrolyte film.Besides,the corrosion control process varies under the initially covered thicker NaCl electrolyte layer and under the final saturated much thinner NaCl electrolyte film as the evaporation proceeds.Moreover,the ready oxygen availability through the final thinner saturated NaCl electrolyte film facilitates the formation of corrosion product layer mainly of electrochemically stable SnO2,but higher temperature leads to the final corrosion product layer with smaller crystal size and large cracks.The findings clearly demonstrate the effects of NaCl deposition and temperature on corrosion evolution of SAC305 solder joints and are critical to the daily maintenance of electronic devices for longer service life in marine atmosphere.展开更多
基金supported by the National Natural Science Fundation of China (Nos. 51501204 and 51671200)the Research Program of Corrosion Distribution and Anti-corrosion Measures of Power Transmission in Complex Atmospheric Environment of Large Coastal Cities (No. GZM2014-2-0004)the Science and Technology Department of Henan Province (No. 172102310726)
文摘The corrosion kinetics and patina(corrosion products) layer evolution of galvanized steel submitted to wet/dry cyclic corrosion test in a simulated coastal-industrial atmosphere was investigated. The results show that zinc coating has a greater corrosion rate during the initial period and a lower corrosion rate during the subsequent period, and the patina composition and structure can greatly affect the corrosion kinetics evolution of zinc coating. Moreover, Zn5(OH)6(CO3)2 and Zn4(OH)6 SO4 are identified as the main stable composition and exhibit an increasing relative amount;while Zn12(OH)15Cl3(SO4)3 cannot stably exist and diminish in the patina layer as the corrosion develops.
基金financially supported by the National Natural Science Foundation of China(No.51601057)。
文摘Motivated by the increasing use of Sn-3.0 Ag-0.5 Cu(SAC305)solder in electronics worked in marine atmospheric environment and the uneven distribution of Ag3Sn and Cu6Sn5 intermetallic compounds(IMCs)inβ-Sn matrix,comb-like electrodes have been designed for in-situ EIS measurements to study the microstructure induced galvanic corrosion evolution of SAC305 solder in simulated marine atmosphere with high-temperature and high-humidity.Results indicate that in-situ EIS measurement by comb-like electrodes is an effective method for corrosion evolution behavior study of SAC305 solder.Besides,the galvanic effect between Ag3Sn IMCs andβ-Sn matrix can aggravate the corrosion of both as-received and furnace-cooled SAC305 solder as the exposure time proceeds in spite of the presence of corrosion product layer.Pitting corrosion can be preferentially found on furnace-cooled SAC305 with larger Ag3Sn grain size.Moreover,the generated inner stress during phases transformation process with Sn3O(OH)2Cl2 as an intermediate and the possible hydrogen evolution at local acidified sites are supposed to be responsible for the loose,porous,cracked,and non-adherent corrosion product layer.These findings clearly demonstrate the corrosion acceleration behavior and mechanism of SAC305 solder,and provide potential guidelines on maintenance of microelectronic devices for safe operation and longer in-service duration.
基金This work was financially supported by the National Natural Science Foundation of China(Nos.51601057 and 51701038)and the Marine Science Special Project of Hebei Normal University of Science&Technology(No.2018HY004),and the authors acknowledge the assistance.
文摘The stable operation of electronic devices in marine atmospheric environment is affected by the corrosion deterioration of solder joints,and the effects by atmosphere temperature and chloride deposition are critical.In this work,NaCl deposition and temperature dependent corrosion of Pb-free SAC305 solder in simulated marine atmosphere has been investigated.The results indicate that higher NaCl deposition prolongs the surface wetting time and leads to the final thicker saturated electrolyte film for further corrosion.Higher temperature accelerates the evaporation and contributes to the final thinner saturated NaCl electrolyte film.Besides,the corrosion control process varies under the initially covered thicker NaCl electrolyte layer and under the final saturated much thinner NaCl electrolyte film as the evaporation proceeds.Moreover,the ready oxygen availability through the final thinner saturated NaCl electrolyte film facilitates the formation of corrosion product layer mainly of electrochemically stable SnO2,but higher temperature leads to the final corrosion product layer with smaller crystal size and large cracks.The findings clearly demonstrate the effects of NaCl deposition and temperature on corrosion evolution of SAC305 solder joints and are critical to the daily maintenance of electronic devices for longer service life in marine atmosphere.