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Single-chip 3D electric field microsensor 被引量:3
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作者 Biyun LING Yu WANG +4 位作者 chunrong peng Bing LI Zhaozhi CHU Bin LI Shanhong XIA 《Frontiers of Mechanical Engineering》 SCIE CSCD 2017年第4期581-590,共10页
This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same st... This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0-50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measure- ment errors of the three electrostatic field components are less than 14.04%. 展开更多
关键词 electric field microsensor three-dimensional single-chip in-plane rotation
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