Photonic integrated circuits(PICs)have long been considered as disruptive platforms that revolutionize optics.Building on the mature industrial foundry infrastructure for electronic integrated circuit fabrication,the ...Photonic integrated circuits(PICs)have long been considered as disruptive platforms that revolutionize optics.Building on the mature industrial foundry infrastructure for electronic integrated circuit fabrication,the manufacturing of PICs has made remarkable progress.However,the packaging of PICs has often become a major barrier impeding their scalable deployment owing to their tight optical alignment tolerance,and hence,the requirement for specialty packaging instruments.Two-photon lithography(TPL),a laser direct-write three-dimensional(3-D)patterning technique with deep subwavelength resolution,has emerged as a promising solution for integrated photonics packaging.This study provides an overview of the technology,emphasizing the latest advances in TPL-enabled packaging schemes and their prospects for adoption in the mainstream photonic industry.展开更多
基金S.Y.and Q.D.acknowledge funding support from the National Key R&D Program of China 2021ZD0109904the Key Research Project of Zhejiang Lab No.2022PH0AC03.C.R.M.acknowledges the funding support provided by the Fulbright Program.
文摘Photonic integrated circuits(PICs)have long been considered as disruptive platforms that revolutionize optics.Building on the mature industrial foundry infrastructure for electronic integrated circuit fabrication,the manufacturing of PICs has made remarkable progress.However,the packaging of PICs has often become a major barrier impeding their scalable deployment owing to their tight optical alignment tolerance,and hence,the requirement for specialty packaging instruments.Two-photon lithography(TPL),a laser direct-write three-dimensional(3-D)patterning technique with deep subwavelength resolution,has emerged as a promising solution for integrated photonics packaging.This study provides an overview of the technology,emphasizing the latest advances in TPL-enabled packaging schemes and their prospects for adoption in the mainstream photonic industry.
