As Moore’s law approaching its end,electronics is hitting its power,bandwidth,and capacity limits.Photonics is able to overcome the performance limits of electronics but lacks practical photonic register and flexible...As Moore’s law approaching its end,electronics is hitting its power,bandwidth,and capacity limits.Photonics is able to overcome the performance limits of electronics but lacks practical photonic register and flexible control.Combining electronics and photonics provides the best of both worlds and is widely regarded as an important post-Moore’s direction.For stability and dynamic operations considerations,feedback tuning of photonic devices is required.For silicon photonics,the thermooptic effect is the most frequently used tuning mechanism due to the advantages of high efficiency and low loss.However,it brings new design requirements,creating new design challenges.Emerging applications,such as optical phased array,optical switches,and optical neural networks,employ a large number of photonic devices,making PCB tuning solutions no longer suitable.Electronic-photonic-converged solutions with compact footprints will play an important role in system scalability.In this paper,we present a unified model for thermo-optic feedback tuning that can be specialized to different applications,review its recent advances,and discuss its future trends.展开更多
Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides withi...Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology.展开更多
基金This work was supported by the National Key Research and Development Program of China(No.2018YFA0704400).
文摘As Moore’s law approaching its end,electronics is hitting its power,bandwidth,and capacity limits.Photonics is able to overcome the performance limits of electronics but lacks practical photonic register and flexible control.Combining electronics and photonics provides the best of both worlds and is widely regarded as an important post-Moore’s direction.For stability and dynamic operations considerations,feedback tuning of photonic devices is required.For silicon photonics,the thermooptic effect is the most frequently used tuning mechanism due to the advantages of high efficiency and low loss.However,it brings new design requirements,creating new design challenges.Emerging applications,such as optical phased array,optical switches,and optical neural networks,employ a large number of photonic devices,making PCB tuning solutions no longer suitable.Electronic-photonic-converged solutions with compact footprints will play an important role in system scalability.In this paper,we present a unified model for thermo-optic feedback tuning that can be specialized to different applications,review its recent advances,and discuss its future trends.
基金supported by the National Key Research and Development Program of China(No.2019YFB2203004).
文摘Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology.
